Mesoscribe Technologies

Mesoscribe Technologies

HQ Country
United States
Profile
Are you looking to move beyond the limits of conventional printed electronics? Let our exclusive MesoPlasma Printed Electronics capability add functionality, durability and improved performance to your products. A unique 3D additive manufacturing process with multi-material capability that produces extremely robust deposits that are compatible with a wide array of substrate materials. We excel at:
  • Printed Conformal Antennas - On complex contours
  • Printed Heaters - To 500W/cm^2
  • Printed Thermal Sensors - Heat flux sensors and thermocouple arrays (>800C)
 
Proven performance in demanding applications. Discover the process that major Aerospace OEM's have been taking advantage of for years.
Filtered by:
Mesoscribe Technologies
Company
Topic
Show