Photonic Integrated Circuits, Driving an Interconnect Revolution

As AI drives the demand for compute ever higher, networking interconnect density is emerging as a critical bottleneck. In order to transmit more data between chips at lower latencies, the industry is shifting to a photonic integrated circuit (PICs) platform. This webinar will explore the highlights from IDTechEx research into PICs, including:
 
  • Key applications of PICs for scale-up and scale-out networking.
  • Component requirements for PIC.
  • Laser trends in optical transceivers.
  • Modulator options and player landscape.
 
The webinar draws on research from the newly published market report "Silicon Photonics and Photonic Integrated Circuits 2026-2036: Technologies, Markets, and Forecasts".

Presenter

Mika Takahashi
Mika Takahashi
Senior Technology Analyst
IDTechEx

Registration

We will be hosting the same webinar 3 times in one day, so please join which ever session is the most convenient for you.
Spaces are limited

Date:
Thursday 23 April 2026

Approximate Duration:
30 minutes

Webinar Times

Session #1 - Asia-Pacific
2:00am (London Time)
Session #2 - Europe
10:00am (London Time)
Session #3 - Americas
5:00pm (London Time)