All IDTechEx Research reports : Photonics

Heterogeneous Integration, AI, HPC, Data Centers, Semiconductor Packaging Market Forecast, Antenna in Package, 2.5D, 3D, Fan-Out, FOWLP, FOPLP, Through-Si-Via, Glass Packaging, Co-Packaged Optics, RDL (Redistribution Layer), Hybrid Bonding

Graphics processing units (GPUs), central processing units (CPUs), custom AI ASICs, and other AI accelerators, with player analysis, technologies, trends, supply chain, and forecasts

TFT-LCD, OLED, microLED, Light field displays, CGH, dashboard displays, CID and heads-up displays. Display components overview, cover glass, display adhesives, display driver ICs. Technology landscapes, key market forecasts by technology and display type

CPO, optical interconnects, optical IO, data center, switches, AI, advanced semiconductor packaging, 2.5D, 3D, optical engine, EIC, PIC

Encompassing displays for XR headsets, including micro-LED, laser beam scanning, liquid-crystal on silicon displays, OLED, LCDs, holographic and light field displays, and more. Players, forecasts, and analysis in the VR, AR, and MR markets.

Commercial fusion market overview, fusion fuels, materials for fusion, 20-year timelines for the fusion industry, funding and roadmaps by player, benchmarking fusion approaches: tokamaks, stellarators, inertial confinement fusion, and more.

Glass in semiconductors technology benchmarks & analysis, supply-chain deep dive, market forecasts across carrier, panel, IC-substrate, interposer, IPD, RF-MEMS & photonic glass segments, challenges, opportunities and adoption outlook

High-Performance Computing, Exascale Supercomputers, AI Chips, CPUs, GPUs and Accelerators, Memory, Storage, Advanced Semiconductor Packaging, Networking, Interconnects and Thermal Management.

Combiner, windshield, augmented reality (AR) HUDs, TFT-LCDs, DLP, Laser-scanned MEMS, MicroLEDs, CGH, TFEL. Windshield coatings, holographic optical elements. Technology landscapes, market forecast by technology and type

TOF or FMCW detection; mechanical, MEMS, OPA, flash, liquid crystal and other solid-state lidar for ADAS, autonomous vehicles, industrial, smart city, security and mapping with automotive focus

20-year forecasts for materials opportunities in quantum computing, quantum sensing, and quantum communications. Technologies, key players, supply chain dynamics for superconductors, photonics, PICs, nanomaterials, and diamond for quantum applications.

Covering Reconfigurable Intelligent Surfaces, radar beamforming, anti-reflection coatings, laser glare protection, metalenses and LiDAR beam-steering. Forecasts of revenue, surface area, and units 2024-2034

Micro-LEDs for AR/VR/MR, TVs, automotive, mobile phones, wearables, tablets, laptops, and large video displays, with analysis of technology, supply chain, market, players, and opportunities

Quantum random number generators, quantum key distribution, terrestrial optical networks and space-based satellite quantum networks for the next generation of cryptographic security

20 year forecasts for quantum computing: superconducting, photonic, silicon spin, neutral atom, trapped ion, diamond defect, annealers, topological qubits. Infrastructure, applications, and materials for quantum computing, quantum and AI.

Key players, technologies, applications, materials, and 20-year granular quantum sensor market forecasts for: atomic clocks, quantum magnetic field sensors, gravimeters, gyroscopes, accelerometers, quantum RF, and single photon detectors.

Comprehensive overview of the technologies, applications, trends, and opportunities in the quantum computing market, quantum sensing market, and quantum communications market as well as the overarching trends in quantum material development.

Global sensor market including future mobility, LiDAR, radar, cameras, IR; MEMS, wearables; AI, edge sensors; quantum sensors; printed sensors; gas sensors; battery sensors; silicon photonics, image sensors, with 10-year granular sensor market forecast

Compound Semiconductors, Transceivers, Indium Phosphide/InP PICs, Thin-Film Lithium Niobate/TFLN PICs, PICs for Quantum, Light-based Interconnects, Manufacturing, Materials, Co-Packaged Optics

Encompassing XR headsets, sensors, haptics, displays, optics and associated technologies for the metaverse and more. Players, forecasts and analysis in the VR, AR, and MR markets.