Dr Martin Hedges, Managing Director
Neotech Services MTP
Europe 2016 Presentation - Neotech Services MTP*
If you already have access, please [Login]
Access can be purchased via IDTechEx Credits
This presentation will review the state-of-the-art related to integrating electronics into 3D Printed substrates to create fully 3D Printed Electronics systems and devices.
A reconfigurable array of suitable printing, pre- and post processing techniques combine to create a CAD driven Rapid Manufacturing process. The resultant process chain is capable of printing electronic functional materials such as conductors, dielectrics and encapsulation materials onto 3D Printed parts. The 5-axis motion and software modules enable the printing of complex shaped 3D electronic circuits, antenna, heater patterns and sensors. Current developments on embedding and interconnecting SMD components to manufacture more sophisticated systems will be presented.
In addition information will be presented on current applications and process scalability through to high volume manufacture.
Speaker Biography (Martin Hedges)
Graduated BSc (Materials Science) from the University of Manchester (UK) in 1987. Completed a PhD in Materials Science in 1990 from UMIST (UK).
Founded the company Neotech in Nuremberg in 2001 to develop additive manufacturing processes with a focus on Printed Electronics
Since 2009 the company has been pioneering the development of 3D Printed Electronics
Company Profile (Neotech AMT)
View Neotech AMT Timeline
Neotech AMT - Advanced Manufacturing Technologies for 3D Printed Electronics:
Neotech AMT GmbH is one of the leading companies developing systems for 3D Printed Electronics. The company began developing this novel technology in 2009 and installed the first 3D PE system in 2010. This system expertly combines hard- and software elements into a unique solution capable of production complex circuitry on almost any 3D surface.
Rapid advances have lead the first commercial installation for mass production for printed 3D antenna for mobile communications devices. This high-throughput system is capable of printing millions of parts per year.