Aerosol Jet: Produces Fine Pitch Interconnects for Advanced 3D Semiconductor Packaging (Printed Electronics & Photovoltaics USA 2010)

Mr Mike O'Reilly, Product Manager - Aerosol Jet Systems
Optomec
United States
 
Dez 02, 2010.

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Presentation Summary

  • Enabling significant pitch reductions
  • Increased interconnect densities
  • Greater semiconductor packaging functionality

Speaker Biography (Mike O'Reilly)

For the past 12 years, Mike has been responsible for leading Optomec's Aerosol Jet commercialization efforts within printed electronics and related markets. Prior to joining Optomec, Mike was Vice President of Product Marketing at Cadence Design Systems responsible for system level design and verification products. Mike has over 30 years of experience introducing advanced technology into the commercial sector.

Company Profile (Optomec)

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Optomec is evolving the world of additive manufacturing by enabling new dimensions in 3D printing. The LENS and Aerosol Jet families of printers support a range of materials for metals, 3D printed electronics and other applications, and are able to implement feature sizes never before possible.
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