Announcing BeanIoT™ - Defining Form, Fit and Function of IoT Leaf-Nodes (Internet of Things Applications Europe 2015)

Mr Andrew Holland, Managing Director
RFMOD
United Kingdom
 
Apr 29, 2015.

Downloads

Europe 2015 Presentation - RFMOD*
Europe 2015 Audio Presentation - RFMOD*

If you already have access, please [Login]
Access can be purchased via IDTechEx Credits

Presentation Summary

RFMOD will unveil a completely new product - BeanIoT™ a highly adaptable, deployable, "wearable" "Leaf-Node" for the Internet of Things. Drawing from RFMOD's proven experience in IP / semiconductor / package / system / software and UX co-design the BeanIoT™ is the culmination of all that is "HOT!" in the burgeoning IoT space.

Speaker Biography (Andrew Holland)

Andrew Holland, Inventor, Managing Director and Founder of RF Module & Optical Design Ltd has over 25 years' proven experience in semiconductor packaging technology and its successful application to mass-market, cost-sensitive, consumer products.
Andrew's career includes posts in Technical Management with CSR and Samsung and as an Independent Consultant.
Andrew was Chairman of IMAPS-UK, International Microelectronics Assembly and Packaging Society (UK) from2011 to 2013. He was also General-Chair of EMPC-2011 when IMAPS-UK hosted IMAPS' flagship European event.
Andrew is the sole inventor of RFMOD patents: QFN and WLCSP
Andrew lives and works in Cambridge, UK.

Company Profile (RFMOD)

RFMOD logo
RFMOD Technology and IP is designed to underpin disruptive RF products with unprecedented levels of functionality, performance, value and size
 
RFMOD is now offering its patented semiconductor packaging portfolio to industrial partners through its licensed partner programme.
 
RFMOD Design Service leverages tried and tested practice in Chip, Package, System co-design to create potent solutions for high volume, small size, cost critical markets such as Mobile, "Wearables" and the "Internet of Things IoT"
 
With 25 years' experience in RF/Mixed signal and High-speed Digital package design and with an in-depth knowledge of semiconductor and package manufacturing processes RFMOD can help your project through the critical phases of development. From Chip-floor-planning to mask, from Multi-Project wafer test-chip to prototype and onto full production.
 
RFMOD is delighted to announce BeanIoT™ at the show
View RFMOD Timeline