Graphene Based Electrodes for High Performances Supercapacitors Fabricated Using Spray-Gun Deposition Method (Graphene Europe 2015)

This contribution we will deal with the results of recently obtained on supercapacitors with electrodes fabricated using mixtures of graphene based nanomaterials. The electrode fabrication has been performed using a new dynamic spray-gun based deposition process set-up at Thales Research and Technology (patented). This technique constitute a real breakthrough compared to the classical filtration method because electrodes can be deposited over large areas in a completely automated way, using different kinds of substrates and with a thickness between some nm and up to hundredth of μms.

Dr. Paolo Bondavalli is in charge of the transverse topic on nanomaterials at Thale Research and Technology. Presently his work is focused on the development of new materials (e.g. graphene, cnts, nanowires) for the new generation of electronics devices and for energy storage applications, memristor, electromagnetic shielding. Dr Bondavalli has received his Hdr in 2011, at Paris-Sud on a work on "devices based on random network of carbon nanotubes". During the last five years, he has participated, also as coordinator, in several EU projects (concerning CNTs, graphene, spintronics, energy) and ANR projects. He is involved in the Graphene Flagship initiative. He recently issued a book on Graphene ("Graphene and Related Materials: Properties and Applications" Ed Elsevier, pp 192, 2017).

Thales Group Competence Centre Microelectronics is Thales's industrial and technological competence centre for (micro)electronics packaging, interconnections and assemblies. Located in France, the site of Etrelles (Brittany) designs, engineers and manufactures high-added value electronics modules and systems dedicated to harsh environments or specific systems. With 600 skilled staff, 10000sq. m of industrial facilities of which 5700sq. m clean rooms, the GCC Microelectronics team performs pioneering work in electronic technologies to boost the performance and reliability of applications facing critical functional or packaging constraints. We provide innovative and robustified electronic solutions integrative of new generation materials and advanced interconnection and assembly processes.