Next Generation 3D Printed Multi-Chip Module (Printed Electronics USA 2019)

Laura Ramu, Mechanical Engineer
United States

Presentation Summary

Parsons is actively working with the DoD to conceptualize a new generation of 3D-printed MCMs building off of the success of the first generation of HERCULES, presented at IDTechEx last year. The updated HERCULES module is poised to be a core architectural building block for the DoD. We will discuss the extensive ink qualification process that Parsons underwent to determine the optimal material set for chip-scale 3D printed electronics solutions, and early results of accelerated life testing for printed constructions at 40um scale.

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