PZT MEMS Based Energy Harvesting for Miniaturized Smart Systems (Internet of Things Applications USA 2015)

Smart-MEMPHIS project http://www.smart-memphis.eu/ addresses the increasing demand for low-cost, energy-efficient autonomous systems by integrating 1) lead-zirconate-titanate materials in MEMS-based multiaxis energy harvester 2) ultra-low-power ASIC to manage the variations of the frequency and harvested power 3) miniaturized carbon-nano material based energy storing supercapacitor. All these are heterogeneously and cost effectively 3D integrated by new innovative flat panel packaging technologies. The performance of the system will be demonstrated by leadless bio-compatible cardiac pacemaker capable of harvesting energy from the heart beats and by wireless sensor networks (WSN) for structural health monitoring for e.g. detection of micro-cracks in composite aircraft wings.

Magnus received his M.Sc. in Physics from Lund Institute of Technology. After working 6 years as a consultant within the field of Opto-Electro-Mechanics (Optronics) he joined Silex Microsystems in 2002. In 2005 Magnus relocated from Sweden to open Silex first US office in Boston and in 2007 he relocated to the Bay Area, where he currently resides, opening a second Silex US office.

During Magnus' years at Silex the company has grown from about 20 to 150 employees at the same time as the yearly revenue has grown from 1-2 to about 40 MUSD. His work consists both of technical and management support to the various customer products that Silex manufactures as well as handling sales and business development. Magnus also sits on the governing council of MEMS Industry Group (MIG) and has over the years been active in various collaborative groups in order to further and promote overall MEMS Industry.

Silex Microsystems is a pure play MEMS Foundry offering high volume wafer manufacturing on 6 and 8 inch wafers in separate fabs. Silex manufactures a multitude of various MEMS components some of which integrates CMOS wafers. Silex works with qualified unit processes, which include through wafer VIAs (TSVs), PZT processing as well as bond to as well as other type of integration of CMOS material.