1. | EXECUTIVE SUMMARY |
1.1. | Introduction to Thermal Interface Materials (TIM) |
1.2. | Overview of TIM by type |
1.3. | Advanced Materials for TIM |
1.4. | Market Overview |
1.5. | Market forecast: TIM for EV battery packs |
1.6. | Market forecast: TIM for power electronic modules |
1.7. | Market forecast: TIM in LED for general lighting |
1.8. | Market forecast: TIM in LED for automotive |
1.9. | Market forecast: TIM in LED for displays |
1.10. | Market forecast: TIM in LED for 4G/LTE base stations |
1.11. | Market forecast: TIM for 5G base stations |
1.12. | Market forecast: TIM for consumer electronics |
2. | OVERVIEW OF THERMAL INTERFACE MATERIALS |
2.1. | Introduction to Thermal Interface Materials (TIM) |
2.2. | Key Factors in System Level Performance |
2.3. | Thermal Conductivity vs Thermal Resistance |
3. | TIM FORM AND MATERIAL OVERVIEW |
3.1. | TIM considerations |
3.2. | Thermal Interface Material by physical form |
3.3. | Assessment and considerations of liquid products |
3.4. | Ten Types of Thermal Interface Material |
3.5. | Properties of Thermal Interface Materials |
3.6. | 1. Pressure-Sensitive Adhesive Tapes |
3.7. | 2. Thermal Liquid Adhesives |
3.8. | 3. Thermal Greases |
3.9. | Problems with thermal greases |
3.10. | Thermal Greases |
3.11. | Viscosity of Thermal Greases |
3.12. | Technical Data on Thermal Greases |
3.13. | The effect of filler, matrix and loading on thermal conductivity |
3.14. | 4. Thermal Gels |
3.15. | 5. Thermal Pastes |
3.16. | Technical Data on Gels and Pastes |
3.17. | 6. Elastomeric pads |
3.18. | Advantages and Disadvantages of Elastomeric Pads |
3.19. | 7. Phase Change Materials (PCMs) |
3.20. | Phase Change Materials - overview |
3.21. | Operating Temperature Range of Commercially Available Phase Change Materials |
4. | ADVANCED MATERIALS AS THERMAL INTERFACE MATERIALS |
4.1. | Advanced Materials for TIM - Introduction |
4.2. | Achieving through-plane alignment |
4.3. | Summary of TIM utilising advanced carbon materials |
5. | GRAPHITE |
5.1. | Graphite - overview |
5.2. | Graphite Sheets: Through-plane limitations |
5.3. | Graphite Sheets: interfacing with heat source and disrupting alignment |
5.4. | Panasonic - Pyrolytic Graphite Sheet (PGS) |
5.5. | Progressions in vertical graphite |
5.6. | Vertical graphite with additives |
5.7. | Graphite Pastes |
6. | CARBON FIBER |
6.1. | Carbon fiber as a thermal interface material - introduction |
6.2. | Carbon fiber as TIM in smartphones |
6.3. | Magnetic alignment of carbon fiber TIM |
6.4. | Other routes to CF alignment in a TIM |
6.5. | Carbon fiber with other conductive additives |
7. | CARBON NANOTUBES (CNT) |
7.1. | Introduction to Carbon Nanotubes (CNT) |
7.2. | Challenges with VACNT as TIM |
7.3. | Transferring VACNT arrays |
7.4. | Notable CNT TIM examples from commercial players |
8. | GRAPHENE |
8.1. | Graphene in thermal management: application roadmap |
8.2. | Graphene heat spreaders: commercial success |
8.3. | Graphene heat spreaders: performance |
8.4. | Graphene heat spreaders: suppliers multiply |
8.5. | Graphene as a thermal paste additive |
8.6. | Graphene as additives to thermal interface pads |
9. | CERAMIC ADVANCEMENTS |
9.1. | Ceramic trends: spherical variants |
9.2. | Denka: functional fine particles for thermal management |
9.3. | Showa Denko: transition from flake to spherical type filler |
10. | BORON NITRIDE NANOSTRUCTURES |
10.1. | Introduction to nano boron nitride |
10.2. | BNNT players and prices |
10.3. | BNNT property variation |
10.4. | BN nanostructures in thermal interface materials |
11. | TIM FOR EV BATTERY PACKS |
11.1. | Introduction to thermal management for EVs |
11.2. | Battery thermal management - hot and cold |
11.3. | Cell chemistry impact thermal runaway likelihood |
11.4. | Analysis of passive battery cooling methods |
11.5. | Analysis of active battery cooling methods |
11.6. | Emerging routes - Immersion cooling |
11.7. | Emerging routes - phase change materials |
11.8. | Main incentives for liquid cooling |
11.9. | Shifting OEM Strategies - liquid cooling |
11.10. | Global trends in OEM cooling methodologies adopted |
11.11. | Is tab cooling a solution? |
11.12. | Thermal management - pack and module overview |
11.13. | Thermal Interface Material (TIM) - pack and module overview |
11.14. | Switching to gap fillers rather than pads |
11.15. | EV use-case examples (1) |
11.16. | Battery pack TIM - Options and market comparison |
11.17. | The silicone dilemma for the automotive industry |
11.18. | TIM: silicone alternatives |
11.19. | The main players and considerations |
11.20. | Notable acquisitions for TIM players |
11.21. | TIM for electric vehicle battery packs - trends |
11.22. | TIM for EV battery packs - forecast by category |
11.23. | TIM for EV battery packs - forecast by TIM type |
11.24. | Insulating cell-to-cell foams |
11.25. | Heat spreaders or interspersed cooling plates - pouches and prismatic |
11.26. | Active cell-to-cell cooling solutions - cylindrical |
11.27. | Summary and Conclusions for LiB for EV |
12. | TIM FOR POWER MODULES |
12.1. | Why use TIM in power modules? |
12.2. | Which EV inverter modules have TIM? |
12.3. | When will the TIM not become the limiting factor? |
12.4. | Why the drive to eliminate the TIM? |
12.5. | Has TIM been eliminated in any EV inverter modules? |
12.6. | Choice of non-bonded thermal interface materials |
12.7. | Comparison of various thermal greases |
12.8. | Thermal grease: other shortcomings |
12.9. | Thermal grease: causes of failure |
12.10. | Phase change materials (PCM) in power electronics modules |
12.11. | Thermal resistance of grease and PCMs |
12.12. | TIM market forecast in $ and tons for all power modules (2019 to 2030) |
13. | TIM FOR DATA CENTERS |
13.1. | Thermal Interface Materials in data centers: introduction |
13.2. | Introduction to data center equipment: servers, switches, and supervisors |
13.3. | How TIMs are used in servers |
13.4. | Estimating the TIM area in servers |
13.5. | Data center: determining the relative number of equipment by examining common design methods |
13.6. | Average switch port numbers |
13.7. | How TIMs are used in data centre switches |
13.8. | Estimating the TIM area in data center switches |
13.9. | Estimating the number of supervisor modules in data centers |
13.10. | How TIMs are used in supervisor modules in data centers |
13.11. | TIM consumption in power supply modules of data centers |
13.12. | How are TIMs used in power suppliers in data centers? |
13.13. | Ten-year server forecast in million units (2018 to 2030) |
13.14. | Ten-year forecasts (2018 to 2030) for switches and supervisor modules in data centers |
13.15. | Aggregated data center equipment unit number forecast (2018 to 2030) |
13.16. | Thermal interface material surface area in the data centers (2018 to 2030) |
14. | TIM IN LED FOR GENERAL LIGHTING |
14.1. | General lighting market |
14.2. | LED technology and application space reaches maturity |
14.3. | LED technology: approaching maturity |
14.4. | LED market: top and median performance levels in various sectors |
14.5. | LEDs: price target and price evolution |
14.6. | LEDs: why focus on thermal management |
14.7. | LEDs come in a variety of packages |
14.8. | LED package and board assembly reviews: die on lead-frame and die on ceramic on FR4 with vias |
14.9. | LED package and board assembly reviews: COB on metal core PCB and ceramic boards |
14.10. | LED packaging: improving in thermal resistance over time |
14.11. | Choices of thermal boards: FR4 and Insulated Metal Substrate |
14.12. | Insulated metal substrate: the importance of the dielectric |
14.13. | Choices of thermal boards: FR4 with filled thermal vias |
14.14. | Moderate to high power LEDs require TIM |
14.15. | Low power LED lamp design may have no TIM |
14.16. | Going from LED to board-level area |
14.17. | TIM: a variety of choices available |
14.18. | LED lighting market: unit number forecasts from 2017 to 2030 |
14.19. | TIM market in LED general lighting (2018 to 2030) in tons and area |
15. | TIM IN LED FOR AUTOMOTIVE |
15.1. | LED lighting market in automotive |
15.2. | Examples of LED headlights in various vehicles |
15.3. | Examples of boards used in tail and head LED automotive lights |
15.4. | LED for automotive: key characteristics |
15.5. | LED in automotive: trend towards matrix systems |
15.6. | LED in automotive: lumen output requirements for headlamp, tail lights and various signal functions |
15.7. | TIM addressable market (2018 to 2030) |
15.8. | TIM market forecasts in sqm and tons (2018 and 2030) |
16. | TIM IN LED FOR DISPLAYS |
16.1. | Display industry in sqm |
16.2. | The rise of OLED will affect the addressable market? |
16.3. | TIM in edge-lit and direct-lit LED-LCDs |
16.4. | The importance of thermal management |
16.5. | Estimating LED in LCD numbers |
16.6. | Addressable market for TIM in LED-LCD displays in sqm and tons (2018 to 2030) |
17. | TIM IN BASE STATIONS |
17.1. | A simple description to the anatomy of a base station |
17.2. | Background info on baseband processing unit and remote radio head |
17.3. | Path evolution from baseband unit to antenna |
17.4. | The 6 components of a baseband processing unit |
17.5. | BBU parts I: TIM area in the main control board |
17.6. | BBU parts II & III: TIM area in the baseband processing board & the transmission extension board |
17.7. | BBU parts IV & V: TIM area in radio interface board & satellite-card board |
17.8. | BBU parts VI: TIM area in the power supply board |
17.9. | Remote radio head unit components |
17.10. | RRU parts: TIM area in the main board |
17.11. | RRU parts: TIM area in PA board |
17.12. | Summary |
17.13. | BBU TIM forecasts in 4G/LTE base stations |
17.14. | RRU TIM forecast in 4G/LTE base stations |
17.15. | Total TIM area forecast for the 4G/LTE base stations |
18. | 5G BASE STATIONS |
18.1. | What is 5G |
18.2. | Evolution of mobile communications |
18.3. | What can 5G offer? |
18.4. | Differences between 4G and 5G |
18.5. | 5G operates at high frequency |
18.6. | High Frequency lead to high capacity, low latency and changes in antennas & stations |
18.7. | 5G base station types |
18.8. | 5G trend: small cells (picocell and femtocell) |
18.9. | Base station architecture: C-RAN |
18.10. | Evolution of the cellular base station: overview |
18.11. | Radio Frequency Front End (RFFE) Module |
18.12. | Massive MIMO requires active antennas |
18.13. | 5G station instalment number by year |
18.14. | Main suppliers of 5G active antennas unit (AAU) (1) |
18.15. | Case study: NEC 5G Radio Unit |
18.16. | Case study: Samsung 5G Access solution for SK telecom |
18.17. | Air cavity vs plastic overmold packages |
18.18. | Examples of ceramic packages |
18.19. | Examples of actual packaged GaN discreet PAs |
18.20. | GaAs also requires conductive heat slug |
18.21. | Air-cavity packages for full front end modules |
18.22. | TIM forecast in 5G base stations (macro, micro, pico, femto stations) |
19. | TIM IN CONSUMER ELECTRONICS |
19.1. | Introduction |
19.2. | Galaxy 3: teardown and how TIM is used |
19.3. | Galaxy S6: teardown and how TIM is used |
19.4. | Galaxy S7: teardown and how TIM is used |
19.5. | Galaxy S7: teardown and how TIM is used |
19.6. | Galaxy S9: teardown and how TIM is used |
19.7. | Galaxy note 9 carbon water cooling system |
19.8. | Samsung S10 and S10e: teardown and how TIM is used |
19.9. | Galaxy S6 and S7 TIM area estimates |
19.10. | Oppo R17: teardown and how TIM is used |
19.11. | Huawei Mate Pro 30: teardown and how TIM is used |
19.12. | Huawei Mate Pro 20: teardown and how TIM is used |
19.13. | iPhone 4: teardown and how TIM is used |
19.14. | iPhone 5: teardown and how TIM is used |
19.15. | iPhone 7: teardown and how TIM is used |
19.16. | iPhone X: teardown and how TIM is used |
19.17. | Smartphone thermal material estimate summary |
19.18. | Asus K570U and Clevo P641RE: teardown and how TIM is used |
19.19. | Lenovo ThinkPad X1 and Dell XPs 13: teardown and how TIM is used |
19.20. | Apple MacBook Pro, Asus ROG Zephyrus M501 & Dell Inspiron 15 7000 |
19.21. | LAPTOP TIM SPECS |
19.22. | Unit sales forecast for consumer electronics |
19.23. | Thermal interface material and heat spreader forecast in consumer electronics |
19.24. | Heat spreader material forecast in smartphones by area (excl. display) |
19.25. | Thermal interface material and heat spreader forecast for laptops |
19.26. | Thermal interface material and heat spreader forecast for tablets |
19.27. | Thermal interface material and heat spreader forecast for desktops |
20. | COMPANY PROFILES |
20.1. | 3M Electronic Materials |
20.2. | AI Technology |
20.3. | AIM Specialty Materials |
20.4. | AOS Thermal |
20.5. | Bando |
20.6. | BNNano |
20.7. | BNNT |
20.8. | Condalign |
20.9. | Denka |
20.10. | Dexerials |
20.11. | DK Thermal |
20.12. | Dow Corning |
20.13. | Dymax Corporation |
20.14. | Ellsworth Adhesives |
20.15. | Enerdyne |
20.16. | European Thermodynamics Ltd |
20.17. | Fujipoly |
20.18. | Fralock |
20.19. | GrafTech |
20.20. | Henkel |
20.21. | Hitek Electronic Materials |
20.22. | Honeywell |
20.23. | Indium Corporation |
20.24. | Inkron |
20.25. | Kitagawa Industries |
20.26. | Laird Tech |
20.27. | LORD |
20.28. | MA Electronics |
20.29. | MH&W International |
20.30. | Minteq |
20.31. | Momentive |
20.32. | NeoGraf Solutions |
20.33. | Parker Chomerics |
20.34. | Resinlab |
20.35. | Schlegel Electronics Materials |
20.36. | ShinEtsu |
20.37. | Smart Hight Tech |
20.38. | Timtronics |
20.39. | Universal Science |