21 Sep 2020
They have a similar direct transfer approach, but focus on mounting IC dies rather than LEDs. They are also an earlier stage company than Rohinni.
5 Mar 2020
SysteMECH have developed a direct die-placement technology to attach thin dies (unpackaged ICs) to flexible substrates. This promises to avoid the damage that can occur to bare dies using typical pick-and-place methods and increase yields.