Biobased PLA, PET, PEF, polyesters, polyolefins, polyamides, polyurethanes, PHA, and polysaccharides, for packaging, automotive, textiles, agriculture, consumer goods, and other applications in the circular economy.

Granular forecasts, interview-based company profiles, benchmarking, and market outlook of carbon dioxide utilization technologies in enhanced oil recovery, concrete, fuels, polymers, drop-in chemicals, greenhouses, algae, and proteins

Key applications of helium in semiconductor manufacturing, leak testing (e.g. EV batteries), cryogenics (MRI, NMR, quantum computing), and aerospace, with trends in adoption of substitutes, reclamation technologies, and 10-year forecasts

Flake-based, nanoparticle, particle-free, copper, stretchable, thermoformable nanowire inks for photovoltaics, EMI shielding, printed electronics, flexible hybrid electronics, wearable electronics, e-textiles, 3D electronics

Covering Reconfigurable Intelligent Surfaces, radar beamforming, anti-reflection coatings, laser glare protection, metalenses and LiDAR beam-steering. Forecasts of revenue, surface area, and units 2024-2034

Advanced recycling technology appraisals: pyrolysis, depolymerization, solvent extraction, gasification of homogeneous and mixed plastic waste. In-depth market analysis with 10-year forecasts, player interviews, global chemical recycling input capacity.

Comprehensive overview of the technologies, applications, trends, and opportunities in the quantum computing market, quantum sensing market, and quantum communications market as well as the overarching trends in quantum material development.

Market for 3D electronics, covering electronics on 3D surfaces, in-mold electronics, fully additive 3D electronics, metallization methods, additive electronics materials, and applications.

Market for printed sensors including, organic photodetectors, wearable electrodes, force sensors and piezoresistive sensors, piezoelectric sensors, temperature sensors, gas sensors, capacitive touch sensors and stretchable strain sensors.

Combiner, windshield, augmented reality (AR) HUDs, TFT-LCDs, DLP, Laser-scanned MEMS, MicroLEDs, CGH, TFEL. Windshield coatings, holographic optical elements. Technology landscapes, market forecast by technology and type

AiP, Antenna, Advanced Semiconductor Packaging, Substrate technology, 5G, 6G, Phased array, fan-out, flip-chip, glass, LTCC, HDI, EMI, Beamforming

Applications of copper in passenger cars, copper for electrification, copper for autonomous cars, copper for automotive wiring harness, technology trends, copper replacement, copper demand forecasts by region, application and more

Materials, methods and applications for electromagnetic interference (EMI) shielding including package-level shielding, sputtering, printing, conductive inks, MXenes, nanocarbons, heterogeneous integration, system-in-package, compartmentalization.

TFT-LCD, OLED, microLED, Light field displays, CGH, dashboard displays, CID and heads-up displays. Display components overview, cover glass, display adhesives, display driver ICs. Technology landscapes, key market forecasts by technology and display type

Materials, markets and applications such as displays (edge optic, enhancement film, colour filter (LCD,OLED, μLED), on-chip), QLED, lighting, image sensor, photovoltaics, and agricultural film

Covering applications such as wearable electronics, prototyping automotive electronics, and smart packaging, along with underlying technologies including conductive inks, flexible ICs, component attachment materials/methods and R2R manufacturing.

Assessment of flexible and printed electronics markets, covering smart packaging, printed/flexible sensors, e-textiles, conductive inks, wearable technology, flexible hybrid electronics, 3D electronics, in-mold electronics and more.

Recycled plastics and bioplastics for sustainable packaging applications. Analysis of mechanical recycling and chemical recycling for packaging. 10-year market forecasts and discussions of 30 sustainable packaging materials.

Printed electronics equipment market covering roll-to-roll and sheet-to-sheet manufacturing, analogue and digital printing methods, vacuum processing, flexible hybrid electronics, mounting components.

5G sub-6 GHz & mmWave, regional market forecast, 5G key technology benchmarking, supply chain, player assessment, Open RAN, vendor landscape, smart electromagnetic environment, power consumption, massive MIMO, 5G AiP (antenna-in-package), advanced 5G