Join Our Upcoming Webinar on Key Semiconductor Trends

Webinar Title: Key Semiconductor Trends in Edge AI, Automotive, and Advanced Semiconductor Packaging

Date: Wednesday 21 June 2023

Presenter: Leo Charlton (Technology Analyst at IDTechEx), Dr James Jeffs (Senior Technology Analyst at IDTechEx) & Dr Yu-Han Chang (Senior Technology Analyst at IDTechEx)

 

 

Semiconductors are at the heart of almost all technologies used in modern life. Even though they have so thoroughly permeated daily lives there are still significant development and growth opportunities for some semiconductors used in specific applications. In this IDTechEx webinar, three analysts from three teams explain key semiconductor opportunities in their areas.

 

 

In IDTechEx's recent report "AI Chips 2023-2033", compound annual growth rate for AI hardware at the edge is forecast to be 27% over the ten-year period, a higher rate of growth than for AI in the cloud. Some applications of AI at the edge - while increasing user functionality and thereby becoming the new normal - are not fundamental components to a system, while others are only possible with the inclusion of AI.

 

In this section of the webinar, analysts will discuss AI at the Edge, touching on the following key points: 

 

 

IDTechEx's "Semiconductors for Autonomous and Electric Vehicles 2023-2033" report finds that autonomous technologies are going to be the biggest factor in driving growth in automotive semiconductor industry. Innovative technologies such as LiDAR (Light Detection and Ranging) and autonomous driving computers require new semiconductor materials and technologies, far beyond typical automotive applications.

 

This section of the webinar will cover the following topics:

 

 

Data-rich applications like machine learning and AI play a crucial role in various fields, such as data centers, 5G, and autonomous vehicles. These applications require powerful processors, which are based on integrated circuits (ICs) built on silicon (Si). With the slowdown of Moore's law and the increasing difficulty and cost of scaling monolithic ICs, IC vendors are turning towards advanced semiconductor packaging.

 

In this section of the webinar, analysts will discuss the following topics:

 

Date: Wednesday 21 June 2023

Duration: Approx. 45 Minutes

 

9:00am (UTC+8) Singapore, Taipei, Beijing

9:00am (UTC+8) Australian Western Standard Time

10:00am (UTC+9) Tokyo, Seoul

10:30am (UTC+10.30) Australian Central Time

11:00am (UTC+11) Australian Eastern Time

1:00pm (UTC+13) Auckland, New Zealand

 

 

10:00am (UTC) London

11:00am (UTC+1) Amsterdam, Berlin, Rome

12:00noon (UTC+2) Athens, Jerusalem

 

 

9:00am (Pacific Time PT) USA & Canada

10:00am (Mountain MST) USA & Canada

11:00am (Central CST) USA & Canada

12:00noon (Eastern EST) USA & Canada

5:00pm (UTC) London