TSMC

The Packaging Technologies Behind NVIDIA's 3D-Stacked CPO

At GTC 2025, NVIDIA announced two new networking switch platforms - Spectrum-X Photonics and Quantum-X Photonics - based on Co-Packaged Optics (CPO) technology. Both platforms incorporate TSMC's 3D hybrid bonding technology for its CPO, and these will be the world's first 3D-stacked silicon photonics engine.

Ruth Cleaning Technology

Ruth Cleaning Technology supplies and washes cleanroom garments, boots, and gloves. It has improved sustainability by recycling garment materials and supplying halogen-free gloves.

Innatera Nanoystems BV

Innatera is a startup that develops neuromorphic microprocessors using spiking neural networks (SNN). It is a spin-off from the Delft University of Technology in the Netherlands, created in 2018. Its microprocessor is low-power and always on, so it is used for sensors that require continuous monitoring, such as human detection, audio interfaces, touch-free interfaces, presence detection, activity recognition, and ECG recognition.

Water Usage in Semiconductor Manufacturing to Double by 2035

In 2023 alone, semiconductor giant TSMC reported consumption of a staggering 101 million m3 of water, highlighting the scale of thirst in this fast-growing sector. Furthermore, as node technology advances, so do the number of manufacturing process steps, and the usage of single wafer tools instead of batch tools, making the task of reducing water usage both challenging and even more critical.

Exploring New Materials for Photonic Integrated Circuits

It should come as no surprise that PIC transceivers are fast becoming essential tools in the AI revolution, where they speed up connections between nodes in data centers whilst reducing power consumption, allowing larger AI models to be trained and executed. IDTechEx's recent report on the topic, "Silicon Photonics and Photonic Integrated Circuits 2025-2035: Technologies, Market, Forecasts", predicts this application to be the major contributor to its US$54 billion forecast for the PIC market in 2035.

ASTOM

ASTOM is a membrane, electrode, and dialysis technology provider founded in 1995 and based in Japan. ASTOM provides hydrocarbon ion exchange membrane materials and electro- and diffusion dialyzer equipment, primarily for acid and base recovery applications. IDTechEx spoke with Hiroyuki Yanagi, Former CEO of ASTOM.

Innovations in Sustainable Electronics Manufacturing

The electronics market is vast, with integrated circuits (ICs) being the third most traded product globally, presenting significant opportunities for sustainable electronics innovation. Action is currently being undertaken by many well-known electronics manufacturers to improve the sustainability and efficiency of their products. This includes water management strategies for semiconductor manufacturing, with over 500 billion liters of water used annually by the industry.

Plan Optik AG

Plan Optik AG, a German-based company established in 1972, has positioned itself as a prominent player in the field of high-precision glass substrate manufacturing. Plan Optik specializes in producing structured wafers made from glass, glass-silicon compounds, and quartz.

Next Generation Semiconductor Technologies for Automotive Radar

Innovation map of next generation semiconductor technologies for automotive radar.

Advantest

Advantest is the leading producer of automatic test equipment (ATE) in the semiconductor industry and one of the top large suppliers of chip-making equipment. It supplies ATE for system on chip (SoC), memory, and power devices.

Chiplet Technology: Unlocking New Potential in Semiconductor Industry

Chiplet technology is poised to revolutionize the semiconductor industry by offering a flexible, cost-effective solution that enhances performance while addressing supply chain challenges. As outlined in the IDTechEx report "Chiplet Technology 2025-2035: Technology, Opportunities, Applications," this technology will continue to create opportunities for innovation across various sectors, driving growth and fostering collaboration among industry players.

SureCore

SureCore develops low-power static random access memory (SRAM) technologies, offering solutions that reduce dynamic power consumption by up to 50% and leakage power by up to 20%. Its silicon-proven IP targets energy-efficient applications in IoT, edge computing, wearable devices, and quantum computing, with specialized products like CryoMem™ designed for cryogenic environments.