Taiwan Semiconductor Manufacturing Company, Ltd.

Blueqat

Blueqat is a Japanese developer of quantum hardware and software solutions, currently developing a silicon-spin qubit quantum computer.

VisEra

VisEra Technologies operates as a specialty foundry focused on wafer-level optical component manufacturing and process integration for image sensors and micro-optical devices.

The Transition Transforming Network and AI Architecture

In recent years, optical transceiver technology has been steadily shifting toward placing the optics closer to the ASIC. Many in the industry expect the transition to progress directly toward fully integrated solutions such as co-packaged optics. IDTechEx's new report "Co-Packaged Optics (CPO) 2026-2036: Technologies, Market, and Forecasts" examines this transition in detail.

W.L. Gore & Associates

W.L. Gore is a specialist in fluoropolymers. IDTechEx spoke to W.L. Gore at Semicon Europa 2025 to learn more about its offerings, including cables and aerogel-based insulation.

Black Sesame Technologies

Black Sesame Technologies is a leading artificial intelligence chip design company based in China. The company focuses on the development of automotive grade intelligent computing SoC chips used for autonomous driving and advanced driver assistance systems. Black Sesame positions itself as a technology enabler for the automotive industry. It provides a full stack autonomous driving computing solution that includes both hardware and software, supporting OEMs and Tier 1 suppliers in deploying Level 2 to Level 4 intelligent driving functions.

Scaling the Silicon: Why GPUs are Leading the AI Data Center Boom

With the rising prevalence of these data centers, the accelerated computing chips needed within them are hot in today's markets. In the market report "AI Chips for Data Centers and Cloud 2025-2035: Technologies, Market, Forecasts", IDTechEx explores high-performance GPUs used in AI data centers and cloud computing. This article shows the scale of deployments from NVIDIA and AMD for today's AI infrastructure, and highlights technology enablers and challenges of these AI chips.

US Export Controls on AI Chips Boost Domestic Innovation in China

IDTechEx explores the rising hardware and energy requirements needed for training today's largest AI models, and how nations are competing to stay ahead. This article discusses the sanctions the US has imposed on China, and how China is navigating these.

Impinj

Founded in 2000, Impinj is a leading provider of RAIN RFID technology and solutions that enable wireless item-to-cloud connectivity for billions of physical objects. The company went public in 2016 and generated US$366 million in revenue in 2024. It specializes in endpoint tag ICs and reader ICs, which form the foundation of passive UHF (RAIN) RFID systems. IDTechEx spoke to Matt Branda, a Vice President at Impinj, to gain insights into the company's strategy and roadmap.

Strategic Silicon: Geopolitics Is Redirecting Semiconductor Investment

At IDTechEx, we closely track the global semiconductor and computing landscape, spanning advanced silicon nodes, HPC (High Performance Computing) hardware, AI, advanced semiconductor packaging, photonics, and quantum computing. This article examines how geopolitical tensions are redirecting global investments in advanced semiconductor technologies, reshaping the semiconductor supply chain in pursuit of technological sovereignty.

SambaNova Systems

SambaNova Systems is a California-based startup building proprietary AI chips to compete with GPUs. The firm was founded in 2017 with the mission to deliver an enterprise-scale, full-stack AI platform that accelerates the development and deployment of state-of-the-art generative and deep learning workloads. It is known for creating the Reconfigurable Dataflow Unit (RDU).

Emerging Memory Takes the Embedded Route

Emerging non-volatile memory technologies are finding commercial traction not by replacing DRAM or NAND, but by solving real scaling and performance challenges in embedded systems. IDTechEx explores how MRAM, ReRAM, and others are becoming key enablers for next-generation automotive, IoT, and AI edge devices.

Nordic Semiconductor

Nordic Semiconductor is a Norwegian fabless semiconductor company specializing in ultra-low-power wireless communication and embedded processing for IoT and a market leader in low-power wireless connectivity solutions. Founded in 1983 as Nordic VLSI, the company is headquartered in Trondheim, Norway.

Amazon: Custom Silicon

Amazon, a global technology giant, is a major player in AI infrastructure and is the largest hyperscale cloud provider globally. Amazon is developing its vertical integration strategy by designing custom silicon, including chips for AI training, AI inference, networking, and general-purpose workloads.

AI Chips for Data Center and Cloud to Exceed US$400 Billion by 2030

IDTechEx explores the AI chip markets and key technologies seen in today's AI data centers. This article unveils key trends in high-performance GPUs, custom AI ASICs, and emerging AI chip markets.

Trends in GPUs for AI Data Centers

Innovation map of trends in Graphics Processing Units (GPUs) for AI data centers.

Graphcore

Graphcore is a UK-based semiconductor chip designer that develops accelerators and data center systems for AI and machine learning. Its main innovation is a novel processor called the IPU (Intelligence Processing Unit), an architecture designed from the ground up to specifically tackle machine learning workloads. As of 2024, it is a subsidiary of Softbank.

Computers to Cars: IDTechEx Celebrates Sustainable Tech on Earth Day

The environment often pays a price for the comforts of modern life. Every year on Earth Day, the world reflects on pathways towards a greener economy that promotes resource circularity and a lower carbon footprint.

SMART Photonics

SMART Photonics is a Dutch photonic integrated circuit pure-play foundry based in Eindhoven, NL. The company manufactures PICs on a 4 inch InP platform, providing MPW and full production runs. It expects to open a 6 inch InP fab in 2027. IDTechEx caught up with SMART Photonics at PIC International 2025.

xMEMS: Piezoelectric MEMS for Speakers and Thermal Management

xMEMS is a fabless developer of piezoelectric micro-electro-mechanical-systems for applications in speakers and thermal management. IDTechEx spoke with xMEMS to find out more about its piezoelectric MEMS actuator and its applications.

The Packaging Technologies Behind NVIDIA's 3D-Stacked CPO

At GTC 2025, NVIDIA announced two new networking switch platforms - Spectrum-X Photonics and Quantum-X Photonics - based on Co-Packaged Optics (CPO) technology. Both platforms incorporate TSMC's 3D hybrid bonding technology for its CPO, and these will be the world's first 3D-stacked silicon photonics engine.