Taiwan Semiconductor Manufacturing Company, Ltd.

2.5D and 3D - IDTechEx Explores Advanced Semiconductor Packaging

High-performance computing, 6G communication, autonomous vehicle chips, and consumer electronics are all key markets that benefit from advancing semiconductor packaging. IDTechEx's report, "Advanced Semiconductor Packaging 2024-2034: Forecasts, Technologies, Applications", goes into detail about emerging technologies, including 2.5D and 3D packaging.

Co-Packaged Optics (CPO): Evaluating Different Packaging Technologies

The rise of co-packaged optics is transforming modern data centers and high-performance networks by addressing critical challenges such as bandwidth density, energy efficiency, and scalability. CPO enhances interconnect bandwidth and energy efficiency by integrating optics and electronics within a single package, significantly shortening electrical link lengths.

IDTechEx Explores Emerging Materials for PICs

Photonic Integrated Circuits are photonic circuits formed on a semiconductor material that allows light to pass through it, such as silicon dioxide, also known as Silica (or Glass). These photonic circuits contain components for manipulating light passing through the circuit, enabling functionalities such as data transmission, sensing, and processing within a compact form factor. PICs are fundamentally altering how we manage and utilize optical signals, paving the way for advancements across multiple industries.

Ayar Labs: AI Accelerator Interconnect

Ayar Labs is a San Jose-based startup working on an optical I/O connectivity solution that offers high bandwidth, low-power, low-latency connections, using photonic integrated circuits (PICs) and electrical integrated circuits (EICs) on a monolithic chiplet. IDTechEx Technology Analyst James Falkiner spoke with Terry Thorn, Vice President of Commercial Operations at Ayar Labs, discussing Ayar Labs' current and future solutions for high-speed in-package optical communications.

Role of 3D Cu-Cu Hybrid Bonding in Powering Future HPC & AI Products

Semiconductor packaging has evolved from traditional 1D PCB levels to cutting-edge 3D hybrid bonding at the wafer level, achieving interconnecting pitches as small as single micrometers and over 1000 GB/s bandwidth. Key parameters, including Power, Performance, Area, and Cost, are crucial considerations. Power efficiency is enhanced through innovative packaging techniques, while Performance benefits from shorter interconnection pitches. Area requirements vary for high-performance chips and 3D integration's smaller z-form factor.

JSR Corporation

JSR Corporation is a Japanese company that specializes in materials innovation for various industries, such as digital solutions, life sciences, and plastics. IDTechEx spoke with JSR at Semicon Europe 2023

TOK

Tokyo Ohka Kogyo Co., Ltd. (TOK) is a Japan-based company that supplies photoresist material for the semiconductor industry. IDTechEx spoke with TOK at Semicon Europe 2023 to discuss its product offerings, specifically focused on those for advanced semiconductor packaging

Camtek

FormFactor FRT (acquired by Camtek), headquartered in Bergisch Gladbach, Germany, is a supplier of high-precision metrology solutions for the advanced packaging and silicon carbide markets. IDTechEx spoke with FRT/Camtek at Semicon Europe 2023.

Advanced Semiconductor Packaging Trends in AI and HPC

Advanced semiconductor packaging technologies like 2.5D and 3D hybrid bonding, along with emerging solutions like silicon photonics, are critical in optimizing system performance and fostering the next wave of AI and HPC chip innovation.

Hailo: AI Acceleration in Automotive SoCs

Hailo started with AI accelerator chips in the automotive industry but has recently launched its system on chip. IDTechEx spoke to Hailo at CES 2024.

The Age of Artificial Intelligence: AI Chips to 2034

Artificial Intelligence is transforming the world as we know it; from the success of DeepMind over Go world champion Lee Sedol in 2016 to the robust predictive abilities of OpenAI's ChatGPT, the complexity of AI training algorithms is growing at a startlingly fast pace, where the amount of compute necessary to run newly-developed training algorithms appears to be doubling roughly every four months.

SiPearl: A High-Performance CPU Startup

SiPearl is a European fabless semiconductor startup developing energy-efficient high-performance CPUs for applications in AI, healthcare, climate, and more. IDTechEx Technology Analyst James Falkiner sat down for a conversation with SiPearl's CEO and Founder, Philippe Notton, where they discussed SiPearl's upcoming Rhea1 CPU.

High Performance Computing for Automotive

Computers on wheels. That's how people currently see cars. Practically everything that happens in a vehicle is being monitored and actuated by a microcontroller, from opening windows to calculating the optimal fuel-air mixture for the current torque demand. But the surface has only just been scratched in terms of how much computing power is making its way into vehicles.

US CHIPS Act

This premium article discusses the key aspects of the US CHIPS Act and highlights which companies are likely to benefit the most. It also explains what impact the CHIPS Act is likely to have on the supply of semiconductor components into the automotive industry. Although automotive accounts for a relatively small part of total semiconductor demand, COVID-19 showed how sensitive the industry is to supply shortages.

Neureality

Neureality are an Israeli chip startup founded in 2019. Their products focus on providing software and hardware solutions to manage AI inference workloads. This background profile provides an overview of their current products.

ACCRETECH (Grinding Tool)

ACCRETECH is a company that specializes in semiconductor manufacturing equipment and precision measuring systems. IDTechEx spoke with ACCRETECH at Semicon Europe 2023.

TSMC (Advanced Semiconductor Packaging)

In the world of advanced semiconductor packaging, where innovation and competition drive the industry forward, various packaging technologies and strategies are shaping the future. Previously, IDTechEx had the opportunity to engage in a conversation about advanced semiconductor packaging with Dr. Cheng-Lin Huang, TSMC Advanced Packaging Department Manager. This dialogue provided valuable insights into the technology and the dynamic landscape of this industry. For further details, please refer below.

Black Sesame

Black Sesame are a leading Chinese provider of automotive computing chips for ADAS, autonomous driving, and infotainment. At IAA Mobility 2023 (also known as the Munich Motorshow), IDTechEx Technology Analyst James Falkiner spoke with Ming Zhong, System Analyst at Black Sesame. Mr Zhong discussed Black Sesame's products, from their upcoming C1200 chip, built on TSMC's 7nm process, to their A1000L, a high efficiency chip targeted at ADAS systems.

Chips as Currency: America, China, and the AI Race

Running in the background to the more visible, very real wars occurring around the world at present, there is another, economic and industrial in nature. This is a trade war between two principals: the USA and China.

Efinix

Efinix are a fabless semiconductor company that design field programmable gate array (FPGA) chips for edge devices. IDTechEx spoke with Mark Oliver, VP of Marketing and Business Development