TSMC

Co-Packaged Optics Race: Strategic Approaches from NVIDIA and Broadcom

Co-packaged optics (CPO) is gaining significant attention as the next architecture for next-generation switching. The shift toward co-packaged optics is also reshaping competitive positioning among semiconductor vendors. This article examines the differing approaches of NVIDIA and Broadcom, with further detail available in IDTechEx's latest report, "Co-Packaged Optics (CPO) 2026-2036: Technologies, Market, and Forecasts".

Why Consumer Electronics Will Continue to Lead the Edge AI Chip Market

Latency, energy, privacy. By shifting AI computation from the cloud to the edge, these issues can be alleviated. 2025 was a breakout year for many AI applications, with consumer electronics leading the way in revenue due to the trend to towards AI smartphones and PCs, and rising costs of chips manufactured on leading process nodes.

Atecom Technology Co., Ltd.

Atecom Technology Co., Ltd. is a wafer manufacturing company, supplying several leading tier 1 companies. It is based in Taiwan, with manufacturing capacity in China. IDTechEx spoke to Atecom at SEMICON Europa 2025 in Munich

Blueqat

Blueqat is a Japanese developer of quantum hardware and software solutions, currently developing a silicon-spin qubit quantum computer.

VisEra

VisEra Technologies operates as a specialty foundry focused on wafer-level optical component manufacturing and process integration for image sensors and micro-optical devices.

The Transition Transforming Network and AI Architecture

In recent years, optical transceiver technology has been steadily shifting toward placing the optics closer to the ASIC. Many in the industry expect the transition to progress directly toward fully integrated solutions such as co-packaged optics. IDTechEx's new report "Co-Packaged Optics (CPO) 2026-2036: Technologies, Market, and Forecasts" examines this transition in detail.

W.L. Gore & Associates

W.L. Gore is a specialist in fluoropolymers. IDTechEx spoke to W.L. Gore at Semicon Europa 2025 to learn more about its offerings, including cables and aerogel-based insulation.

Black Sesame Technologies

Black Sesame Technologies is a leading artificial intelligence chip design company based in China. The company focuses on the development of automotive grade intelligent computing SoC chips used for autonomous driving and advanced driver assistance systems. Black Sesame positions itself as a technology enabler for the automotive industry. It provides a full stack autonomous driving computing solution that includes both hardware and software, supporting OEMs and Tier 1 suppliers in deploying Level 2 to Level 4 intelligent driving functions.

Scaling the Silicon: Why GPUs are Leading the AI Data Center Boom

With the rising prevalence of these data centers, the accelerated computing chips needed within them are hot in today's markets. In the market report "AI Chips for Data Centers and Cloud 2025-2035: Technologies, Market, Forecasts", IDTechEx explores high-performance GPUs used in AI data centers and cloud computing. This article shows the scale of deployments from NVIDIA and AMD for today's AI infrastructure, and highlights technology enablers and challenges of these AI chips.