TSMC

Imec

Imec is a Belgian research institute, founded in 1984. It works on state-of-the-art semiconductor and nanoelectronics manufacturing. This profile explores the Sustainable Semiconductor Technologies & Systems (SSTS) program.

Artilux Inc

Artilux are a germanium-on-silicon (GeSi) technology platform company, developing and manufacturing GeSi photonics for a range of sensing, imaging, computing, and communications applications.

Comet Yxlon

Comet Yxlon is a division of Comet and develops X-ray and CT systems for non-destructive testing and metrology instruments for the semiconductor/electronics, automotive, and aerospace industries.

Advanced Semiconductor Packaging: Driving Next-Gen HPC Performance

Advanced semiconductor packaging is experiencing significant growth due to the interplay of technological, economic, and market forces. As silicon scaling approaches its limits, advanced packaging offers a viable alternative for boosting chip performance, particularly for high-performance computing (HPC) applications like AI and data centers, which demand increased computational power and bandwidth.

Emerging Trends and Key Markets in 2.5D and 3D Semiconductor Packaging

Emerging advanced semiconductor packaging technologies, such as 2.5D and 3D hybrid bonding, are crucial for enhancing system performance across various applications such as AI and high-performance computing. This article explores the technology development trends in 2.5D and 3D packaging technologies and the key market growth drivers.

US Chips Act Set to Reshape Helium Demand in the US

Given helium's critical role in semiconductor production, onshoring chip manufacturing will have a significant knock-on impact on the helium demand for semiconductor manufacturing.

2.5D and 3D - IDTechEx Explores Advanced Semiconductor Packaging

High-performance computing, 6G communication, autonomous vehicle chips, and consumer electronics are all key markets that benefit from advancing semiconductor packaging. IDTechEx's report, "Advanced Semiconductor Packaging 2024-2034: Forecasts, Technologies, Applications", goes into detail about emerging technologies, including 2.5D and 3D packaging.

Co-Packaged Optics (CPO): Evaluating Different Packaging Technologies

The rise of co-packaged optics is transforming modern data centers and high-performance networks by addressing critical challenges such as bandwidth density, energy efficiency, and scalability. CPO enhances interconnect bandwidth and energy efficiency by integrating optics and electronics within a single package, significantly shortening electrical link lengths.

IDTechEx Explores Emerging Materials for PICs

Photonic Integrated Circuits are photonic circuits formed on a semiconductor material that allows light to pass through it, such as silicon dioxide, also known as Silica (or Glass). These photonic circuits contain components for manipulating light passing through the circuit, enabling functionalities such as data transmission, sensing, and processing within a compact form factor. PICs are fundamentally altering how we manage and utilize optical signals, paving the way for advancements across multiple industries.

Ayar Labs: AI Accelerator Interconnect

Ayar Labs is a San Jose-based startup working on an optical I/O connectivity solution that offers high bandwidth, low-power, low-latency connections, using photonic integrated circuits (PICs) and electrical integrated circuits (EICs) on a monolithic chiplet. IDTechEx Technology Analyst James Falkiner spoke with Terry Thorn, Vice President of Commercial Operations at Ayar Labs, discussing Ayar Labs' current and future solutions for high-speed in-package optical communications.

Role of 3D Cu-Cu Hybrid Bonding in Powering Future HPC & AI Products

Semiconductor packaging has evolved from traditional 1D PCB levels to cutting-edge 3D hybrid bonding at the wafer level, achieving interconnecting pitches as small as single micrometers and over 1000 GB/s bandwidth. Key parameters, including Power, Performance, Area, and Cost, are crucial considerations. Power efficiency is enhanced through innovative packaging techniques, while Performance benefits from shorter interconnection pitches. Area requirements vary for high-performance chips and 3D integration's smaller z-form factor.

JSR Corporation

JSR Corporation is a Japanese company that specializes in materials innovation for various industries, such as digital solutions, life sciences, and plastics. IDTechEx spoke with JSR at Semicon Europe 2023

TOK

Tokyo Ohka Kogyo Co., Ltd. (TOK) is a Japan-based company that supplies photoresist material for the semiconductor industry. IDTechEx spoke with TOK at Semicon Europe 2023 to discuss its product offerings, specifically focused on those for advanced semiconductor packaging

Camtek

FormFactor FRT (acquired by Camtek), headquartered in Bergisch Gladbach, Germany, is a supplier of high-precision metrology solutions for the advanced packaging and silicon carbide markets. IDTechEx spoke with FRT/Camtek at Semicon Europe 2023.