Chiplet Technology: Revolutionizing Semiconductor Design and Integration

This webinar explores the innovative world of chiplet technology, examining its role in transforming semiconductor design and integration. It provides a comparison with traditional System-on-Chip (SoC) and System-in-Package (SiP) technologies, introduces the concept of heterogeneous integration, and discusses the drivers, advantages, challenges, and future insights related to chiplets.
 
Key points covered in the presentation:
  • Definition and significance of chiplets in modern semiconductor design
  • Comparison with SoC and SiP technologies
  • Introduction to heterogeneous integration
  • Drivers and advantages of adopting chiplet technology
  • Brief overview of challenges in implementing chiplets
  • Insights into the future potential and impact of chiplet technology
 
This webinar shares some of the research from the new IDTechEx report, "Chiplet Technology 2025-2035: Technology, Opportunities, Applications".

Presenter

Registration

We will be hosting the same webinar 3 times in one day, so please join which ever session is the most convenient for you.
Spaces are limited

Date:
Thursday 14 November 2024

Duration:
30 minutes

Webinar Times

Session #1 - Asia-Pacific
2:00am (London Time)
Session #2 - Europe
10:00am (London Time)
Session #3 - Americas
5:00pm (London Time)