칩렛 기술을 통한 반도체 설계 및 통합의 혁신

This webinar explores the innovative world of chiplet technology, examining its role in transforming semiconductor design and integration. It provides a comparison with traditional System-on-Chip (SoC) and System-in-Package (SiP) technologies, introduces the concept of heterogeneous integration, and discusses the drivers, advantages, challenges, and future insights related to chiplets.
 
Key points covered in the presentation:
  • Definition and significance of chiplets in modern semiconductor design
  • Comparison with SoC and SiP technologies
  • Introduction to heterogeneous integration
  • Drivers and advantages of adopting chiplet technology
  • Brief overview of challenges in implementing chiplets
  • Insights into the future potential and impact of chiplet technology
 
This webinar shares some of the research from the new IDTechEx report, "Chiplet Technology 2025-2035: Technology, Opportunities, Applications".

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Reports