환경 친화적 전자기기 및 반도체 제조 주요 기업, 시장동향 및 전망 2025-2035
지속가능 전자기기, 친환경 전자제품, 소재 및 PCB, 접적회로(IC), 전자폐기물, 에너지 효율성, 물관리, 관련 규제 및 향후 10년간 시장전망을 포괄하는 보고서
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PCB 및 반도체 산업 전반의 지속가능한 혁신을 다루고 있는 이번 보고서에서는 친환경 전자기기 업체들의 프로필을 포함하여 주요 제조공정 및 재료의 혁신에 분석을 포함하여 향후 10년간 시장예측 및 전망을 포괄하고 있으며, 반도체 산업의 에너지 및 물 사용량이 각각 12% 와 8% 의 연평균 성장률로 증가할 것으로 예상되는 바, 이에 대한 효율적인 관리전략이 필요함을 강조하고 있습니다.
이 보고서에서 아래와 같은 주요 정보를 제공합니다.
기술 동향 및 제조업체 분석:
- 유연하고 재활용 가능한 생분해성 기판을 포함한 인쇄 회로 기판용 신흥 재료에 대한 논의
- 기존 솔더, 저온 솔더, 전기 전도성 접착제를 포함한 다양한 부품 실장 재료 비교
- 화학물질 사용을 줄이고 비용을 절감하기 위한 습식 및 건식 에칭 방법 비교
- 다양한 재료 및 제조 공정의 지속 가능성 벤치마킹 및 SWOT 분석
- 새로운 재료와 공정을 포함한 IC 제조 방법의 지속 가능성을 위한 주요 기업들의 활동 분석
- IC 제조를 위한 물 관리 분석
- 인쇄 회로 기판 및 집적 회로 제조와 관련된 환경 영향 및 배출을 줄이기 위해 개선해야 할 주요 영역
- 새로운 적층 제조 경로와 이를 개발하는 기업에 대한 평가
- 강화되는 법규가 새로운 재료와 제조 공정의 채택에 미칠 영향 평가
시장 예측 및 분석:
- 매출, 생산량, 재료 요구 사항, 에너지 사용량 및 물 사용량별로 세분화된 시장 규모 및 10년 시장 예측
- 인쇄 회로 기판 및 집적 회로 제조와 관련된 다양한 재료 및 공정에 대한 기술 및 상업적 준비 수준 평가
이 보고서에서 다루는 주요 내용/목차는 아래와 같습니다.
1. 핵심 요약 및 결론
2. 향후 10년간 세분화된 시장 전망
3. 전자기기에 대한 지속가능성 관련 규제의 영향
4. 지속가능한 혁신 및 IC 관련 제조기업들
- 웨이퍼 재료
- 포토리소그래피 및 에칭
- 물관리
- PFAS
5. 지속가능한 혁신 및 PCB 관련 제조기업들
- 기판
- 패터닝 및 금속화
- 부품 실장
6. 전자폐기물에 대한 기술분석 및 주요업체
7. 기업 프로필
This report examines sustainable electronics innovations, throughout the printed circuit board (PCB) and semiconductor industries. It covers key manufacturing processes and materials, including granular market forecasts from 2025-2035 and featuring profiles of green electronics players and information gathered at SEMICON Europa and Electronica 2024. This report provides indispensable insight into innovations in the electronics industry. Energy and water usage in the semiconductor industry are set to grow at a CAGR of 12% and 8% respectively from 2025-2035, with efficient management strategies for both critical. The electronics market is huge, with integrated circuits (ICs) the 3rd most traded product globally, and there are huge opportunities for sustainable innovation.
Conventional electronics manufacturing is extremely wasteful, with many materials, chemicals and manufacturing processes harmful to the environment. This report explores the environmental impact of manufacturing PCBs and ICs, highlighting opportunities to mitigate potential damage to the environment. These include low temperature processing, optimization or elimination of superfluous wasteful steps, recycling and re-using materials where possible and adoption of novel approaches with potential to replace conventional manufacturing steps. PCB substrate materials are analyzed, including biodegradable and recyclable materials which could provide long term alternatives to currently dominant FR4. These include substrates and technologies such as polylactic acid, Soluboard®, Recyclad1G and ReUSE®.
Action currently being undertaken by many well-known electronics manufacturers to improve the sustainability and efficiency of their products is also explored. These include Samsung, TSMC, GlobalFoundries and Intel, among many others. This includes water management strategies for semiconductor manufacturing, with over 500 billion liters of water used annually by the industry.
The report assesses sustainable methods of electronics manufacturing and concentrates on innovations within PCBs and ICs. The report evaluates how sustainable innovation can drive forward a new era of green electronics and covers different materials and manufacturing processes that can deliver effective long-term sustainability improvements. Covering each key stage of the value chain for PCB and IC manufacturing, the report identifies areas that can benefit from innovation. These are compared not just in terms of the emissions, materials, and water consumption but also in terms of scalability and cost to implement. For ICs, it covers wafer preparation from ingots, wafer oxidation, etching, photolithography, surface doping, metallization, packaging and water management. For PCBs, the report covers design options, substrate choices, patterning and metallization and component attachment materials and processes. End of life technologies and processes are then explored for all electronic devices.
Map of global supply chains for semiconductor manufacturing.
Barriers to sustainable electronics are also assessed, with capital costs and integration of new methods into existing manufacturing techniques complex. A key driver for green electronics will be legislation which is described in detail. This includes new Ecodesign for Sustainable Products Regulation (ESPR) and digital product passports (DPP) legislation coming into effect in Europe. Existing and upcoming legislation in the Asia Pacific (APAC) region is also described. Whilst 90% of PCBs are manufactured in the APAC region, the electronics supply chain flows globally, resulting in localized legislation having a global impact.
For those looking to understand opportunities in sustainable electronics, at all stages of the PCB and IC manufacturing value chain, IDTechEx's report is a must. Sustainable electronics is currently of critical importance: as demand for electronics continues to grow it is vital for the reduction of environmental impact and compliance with anticipated stricter legislation. In many cases sustainable improvements and operational cost reductions can arrive hand in hand, making implementation desirable on two fronts. The reader will leave equipped with a wide-ranging, in-depth picture of the present and future of sustainable electronics.
Key questions answered in this report
- What are the key policies and legislations to watch out for?
- What are existing low emission technologies that can be implemented?
- What disruptive technologies are on the horizon?
- Which novel manufacturing routes are both sustainable, reliable, and scalable?
- How can additive manufacturing reduce costs and minimize waste?
- Where are the key materials growth opportunities?
- What are key players doing to improve sustainability?
This report from IDTechEx covers the following key aspects:
Technology trends & manufacturer analysis:
- Discussion of emerging materials for printed circuit boards, including flexible, recyclable and biodegradable substrates.
- Comparison of different component attachment materials, including conventional solder, low temperature solder, and electrically conductive adhesives.
- Comparison of wet and dry etching methods with a view to reducing chemical waste and cutting costs.
- Sustainability benchmarking of different materials and manufacturing processes, with key SWOT analysis throughout.
- Insight into what key industry players are doing to enact sustainability measures in their IC fabrication methods, including new materials and processes.
- Water management analysis for IC manufacturing.
- End of life analysis and highlighting of key areas to be improved to reduce the environmental impact and emissions associated with the manufacturing of printed circuit boards and integrated circuits.
- Evaluation of emerging additive manufacturing routes and the companies developing them.
- Assessment of how rising legislation will affect the adoption of new materials and manufacturing processes.
Market forecasts & analysis:
- Market size and 10-year market forecasts segmented by revenue, production volume, materials requirements, energy usage and water usage. Assessment of technological and commercial readiness level for different materials and processes related to the manufacturing of printed circuit boards and integrated circuits.
| Report Metrics | Details |
|---|---|
| Historic Data | 2022 - 2024 |
| CAGR | Energy usage in the semiconductor industry to reach 736 billion kWh by 2035 at a CAGR of 12.0% from 2025. |
| Forecast Period | 2025 - 2035 |
| Forecast Units | -Annual revenue (US$ billion) - Production (million m2) - Production (million 200mm wafer equivalen |
| Regions Covered | Worldwide |
| Segments Covered | - PCB substrates - PCB patterning methods - PCB component attachment materials - IC substrates - IC manufacturing energy usage - IC manufacturing water usage |
IDTechEx의 분석가 액세스
모든 보고서 구입에는 전문가 분석가와의 최대 30분의 전화통화 시간이 포함되어, 보고서의 주요 결과를 귀하가 제시하는 비즈니스 문제에 연결하도록 돕습니다. 이 전화통화는 보고서를 구매한 후 3개월 이내에 사용해야합니다.
추가 정보
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| 1. | EXECUTIVE SUMMARY |
| 1.1. | The issue with conventional electronics manufacturing |
| 1.2. | The issue with conventional semiconductor manufacturing |
| 1.3. | Growth in the semiconductor and electronics industry exacerbates sustainability issues |
| 1.4. | Advancing technology creates sustainability challenges for semiconductor manufacturing |
| 1.5. | Sustainability driver: Legislation in Europe |
| 1.6. | Sustainability driver: Global legislation focuses on emissions and restriction of hazardous substances |
| 1.7. | Sustainability driver: onshoring gives opportunities for new sustainable manufacturing processes |
| 1.8. | Sustainability driver: Global funding for electronics provides opportunities for sustainability |
| 1.9. | Challenges for sustainable electronics |
| 1.10. | Key technical opportunities for sustainable electronics manufacturing |
| 1.11. | Renewable energy adoption for sustainable electronics manufacturing |
| 1.12. | Opportunities for sustainability within semiconductor manufacturing |
| 1.13. | Sustainability index benchmarking |
| 1.14. | Semiconductor manufacturing: Silicon substrate alternatives |
| 1.15. | Semiconductor manufacturing: Gallium Nitride is the most important sustainable silicon alternative, with applications in power electronics |
| 1.16. | Semiconductor manufacturing: sustainable patterning through solvent use reduction and reuse |
| 1.17. | Semiconductor manufacturing: comparing the sustainability of etching and photolithography techniques |
| 1.18. | Semiconductor manufacturing: unsustainably high-water usage |
| 1.19. | Semiconductor manufacturing: Sustainable water usage through reuse |
| 1.20. | Semiconductor manufacturing: Other water management techniques |
| 1.21. | Semiconductor manufacturing: PFAS reduction |
| 1.22. | Opportunities for sustainability within PCB manufacturing |
| 1.23. | PCB manufacturing: sustainable substrate alternatives analysis |
| 1.24. | PCB manufacturing: sustainable substrate alternatives benchmarking |
| 1.25. | PCB manufacturing: Sustainable patterning techniques |
| 1.26. | PCB manufacturing: Sustainable patterning through etchant regeneration |
| 1.27. | PCB manufacturing: Sustainable component attachment materials |
| 1.28. | PCB manufacturing: Alternatives to thermal processing for component attachment |
| 1.29. | The issues of electronics waste |
| 1.30. | Techniques to reduce electronic waste |
| 1.31. | Key takeaways (I) |
| 1.32. | Key takeaways (II) |
| 1.33. | Key takeaways (III) |
| 2. | INTRODUCTION |
| 2.1. | The electronics industry today |
| 2.2. | Sustainability in the electronics industry |
| 2.3. | Conventional electronics manufacturing poses obstacles to sustainability challenge |
| 2.4. | Increasing numbers of electronic devices |
| 2.5. | Manufacturing strategies to increase speed and reduce embedded energy |
| 2.6. | Ecodesign for Sustainable Products Regulation |
| 2.7. | Global impacts for electronics |
| 2.8. | Anti-Greenwashing |
| 2.9. | Other global electronics regulations (I) |
| 2.10. | Other global electronics regulations (II) |
| 2.11. | Global electronics funding |
| 2.12. | Onshoring |
| 2.13. | Sustainability promotes opportunities in the electronics industry |
| 2.14. | Renewable energy adoption |
| 2.15. | Carbon price drives renewable energy adoption |
| 2.16. | Smart manufacturing |
| 2.17. | Recycling and reuse initiatives for electronics |
| 2.18. | Report structure |
| 2.19. | Sustainability index benchmarking |
| 3. | SUSTAINABLE ELECTRONICS MARKET FORECASTS |
| 3.1. | Forecasting data sources |
| 3.2. | Methodology- substrate production and manufacturing method forecasts |
| 3.3. | Methodology- energy and water usage forecasts |
| 3.4. | PCB production by substrate |
| 3.5. | PCB revenue by substrate |
| 3.6. | Rigid PCBs patterning and metallization methods |
| 3.7. | Flexible PCBs patterning and metallization methods |
| 3.8. | Rigid PCB component attachment materials |
| 3.9. | Flexible PCB component attachment materials |
| 3.10. | IC production by substrate |
| 3.11. | IC manufacturing energy usage |
| 3.12. | IC manufacturing water usage |
| 3.13. | Global e-waste generation |
| 3.14. | Summary- PCB manufacturing |
| 3.15. | Summary- IC manufacturing |
| 4. | INTEGRATED CIRCUIT MANUFACTURING |
| 4.1. | Introduction |
| 4.1.1. | IC manufacturing: Chapter structure |
| 4.1.2. | Conventional integrated circuit manufacturing |
| 4.1.3. | Key areas for sustainability within IC manufacturing |
| 4.2. | Wafer preparation and materials |
| 4.2.1. | Introduction to wafer production for ICs |
| 4.2.2. | Conventional silicon wafer production |
| 4.2.3. | Si wafer energy and material loss |
| 4.2.4. | Silicon wafer production improvements |
| 4.2.5. | Gallium nitride benefits |
| 4.2.6. | Gallium nitride manufacturing |
| 4.2.7. | Silicon carbide comparison |
| 4.2.8. | SWOT analysis: Gallium nitride ICs |
| 4.2.9. | PragmatIC flexible ICs |
| 4.2.10. | SWOT analysis: PragmatIC's flexible ICs |
| 4.2.11. | Printed organic ICs |
| 4.2.12. | Sustainability index: Wafer material |
| 4.2.13. | Key takeaways: Wafer preparation |
| 4.3. | Oxidation |
| 4.3.1. | Introduction to oxidation |
| 4.3.2. | Pre-oxidation cleaning replacements |
| 4.3.3. | Recycling acid etchants |
| 4.3.4. | Substrate oxidation |
| 4.3.5. | Wet and dry thermal oxidation |
| 4.3.6. | MOSFET transistors |
| 4.3.7. | Transistor gate oxide improvements |
| 4.3.8. | Solution-based manufacture of gate oxides |
| 4.3.9. | Solution-based hafnium oxide |
| 4.3.10. | Sustainable gate oxides research (I) |
| 4.3.11. | Sustainable gate oxides research (II) |
| 4.3.12. | Silicon on Insulator (SOI) |
| 4.3.13. | SOI Manufacture |
| 4.3.14. | Status and market potential of gate oxides |
| 4.3.15. | Gate oxides: Key SWOT for major technologies |
| 4.3.16. | Sustainability index: Oxidation |
| 4.3.17. | Key takeaways: Oxidation |
| 4.4. | Patterning and surface doping |
| 4.4.1. | Introduction: Patterning and surface doping |
| 4.4.2. | Conventional photolithography (I) |
| 4.4.3. | Conventional photolithography (II) |
| 4.4.4. | Chemical usage and environmental impact for photolithography |
| 4.4.5. | EUV and other photolithography advancements |
| 4.4.6. | Semiconductor foundry node roadmap |
| 4.4.7. | EUV sustainability |
| 4.4.8. | Conventional etching |
| 4.4.9. | Dry vs wet etching |
| 4.4.10. | Plasma etching challenges |
| 4.4.11. | Dry etching chemicals |
| 4.4.12. | Solvent use reduction and reuse |
| 4.4.13. | Chemical reduction |
| 4.4.14. | Green solvents and materials |
| 4.4.15. | Green materials research |
| 4.4.16. | PFAS in semiconductor manufacturing |
| 4.4.17. | PFAS reduction and replacement (I) |
| 4.4.18. | PFAS reduction and replacement (II) |
| 4.4.19. | Photolithography hydrogen use |
| 4.4.20. | Conventional deposition and doping |
| 4.4.21. | Sustainable innovations for deposition and doping |
| 4.4.22. | Energy usage optimization |
| 4.4.23. | Nano OPS' 'fab in a tool' |
| 4.4.24. | Patterning methods: Key SWOT |
| 4.4.25. | Sustainability index: Patterning |
| 4.4.26. | Key takeaways: Patterning and doping |
| 4.5. | Metallization and packaging |
| 4.5.1. | Introduction: Metallization |
| 4.5.2. | Conventional metallization |
| 4.5.3. | Metal gate material price |
| 4.5.4. | EU Due diligence restrictions on tantalum sourcing |
| 4.5.5. | Electroplating and physical vapour deposition |
| 4.5.6. | Electroplating sustainable advancements |
| 4.5.7. | Printed metal gates for organic thin film transistors |
| 4.5.8. | Sustainability index: Metallization |
| 4.5.9. | Key takeaways: Metallization |
| 4.6. | Packaging |
| 4.6.1. | Introduction: Packaging |
| 4.6.2. | Conventional packaging |
| 4.6.3. | 3D packaging transition |
| 4.6.4. | Interconnection technique - Wire Bond |
| 4.6.5. | Interconnection technique - Flip Chip |
| 4.6.6. | Sustainability index: Interconnection techniques |
| 4.6.7. | Glass interposer packaging implementation |
| 4.6.8. | Organic substrates comparison |
| 4.6.9. | Interposer technologies: Key SWOT |
| 4.6.10. | PFAS reduction in packaging |
| 4.6.11. | Circular economy through semiconductor packaging |
| 4.6.12. | Key takeaways: Packaging |
| 4.7. | Water management |
| 4.7.1. | Introduction: Water management |
| 4.7.2. | The role of water in semiconductor manufacturing |
| 4.7.3. | Global water scarcity |
| 4.7.4. | The importance of water sustainability in semiconductor manufacture |
| 4.7.5. | Case study: Taiwan |
| 4.8. | Ultra pure water in semiconductor manufacturing |
| 4.8.1. | Ultra pure water use in manufacturing |
| 4.8.2. | UPW specifications and monitoring methods |
| 4.8.3. | The importance of UPW specifications |
| 4.8.4. | Ultra pure water production |
| 4.8.5. | UPW contamination difficulties |
| 4.9. | Water treatment technique advancement |
| 4.9.1. | UPW technology advancements (I) |
| 4.9.2. | UPW technology advancements (II) |
| 4.9.3. | Polyfluoroalkyl substances (PFAS) |
| 4.9.4. | Technology readiness level (TRL) |
| 4.10. | Water management strategies |
| 4.10.1. | Water usage increasing with advancing technology |
| 4.10.2. | Water management efficiency |
| 4.10.3. | Water management motivations |
| 4.10.4. | Water management techniques (I) |
| 4.10.5. | Water management techniques (II) |
| 4.10.6. | Water reuse |
| 4.10.7. | Wet processing equipment suppliers incorporating water management |
| 4.10.8. | Water management player strategies |
| 4.10.9. | Cost benefit analysis of UPW upgrades and reuse |
| 4.10.10. | Key takeaways: Water management |
| 5. | PRINTED CIRCUIT BOARD MANUFACTURING |
| 5.1. | Introduction |
| 5.1.1. | PCB manufacturing: Chapter structure |
| 5.1.2. | Introduction: History of traditional PCBs |
| 5.1.3. | Conventional PCB manufacturing |
| 5.1.4. | Manufacturing of PCBs concentrated in APAC |
| 5.1.5. | Key areas for sustainability within PCBs |
| 5.1.6. | Sustainable materials for PCB manufacturing |
| 5.2. | Design options |
| 5.2.1. | Introduction: Design options for PCBs |
| 5.2.2. | Ecodesign regulation |
| 5.2.3. | Eco-design |
| 5.2.4. | Double-sided and multi-layered PCBs allow extra complexity and reduce board size |
| 5.2.5. | Flexible PCBs |
| 5.2.6. | Moving away from rigid PCBs will enable new applications |
| 5.2.7. | In-mold electronics |
| 5.2.8. | IME manufacturing process flow |
| 5.2.9. | Motivation and challenges for IME |
| 5.2.10. | How sustainable is IME? |
| 5.2.11. | IME can reduce plastic usage by more than 50% |
| 5.2.12. | Investment in In-Mold Electronics |
| 5.2.13. | TactoTek |
| 5.2.14. | IME vs reference component: Cradle to gate automotive life cycle assessment |
| 5.2.15. | Key takeaways: PCB design options |
| 5.3. | Substrate choices |
| 5.3.1. | Introduction: Substrate choices |
| 5.3.2. | Disadvantages of FR4 |
| 5.4. | Rigid PCB alternative substrates |
| 5.4.1. | Legislation on halogenated substances |
| 5.4.2. | Halogen-free FR4 advantages |
| 5.4.3. | Household name halogen-free FR4 adoption |
| 5.4.4. | Halogen-free PCB suppliers for high-frequency applications |
| 5.4.5. | SWOT analysis: Halogen-free FR4 |
| 5.4.6. | Glass substrates (I) |
| 5.4.7. | Glass core substrates (II) |
| 5.4.8. | Ceramic substrates |
| 5.4.9. | Ceramic substrate property comparison |
| 5.4.10. | Vitrimer PCBs |
| 5.4.11. | SYTECH Recyclable PCB |
| 5.4.12. | Low-energy epoxy resins |
| 5.4.13. | Rigid PCB substrates: Key SWOT |
| 5.5. | Flexible PCB substrates |
| 5.5.1. | Introduction to flexible PCB substrates |
| 5.5.2. | Polyimide comparison to FR4 and new opportunities |
| 5.5.3. | Application areas for flexible PCBs |
| 5.5.4. | Polyimide alternatives |
| 5.5.5. | Recyclable polyimide substrate development |
| 5.5.6. | Stretchable electronics |
| 5.5.7. | Flexible PCB substrates: Key SWOT |
| 5.6. | Bio-based and biodegradable substrates |
| 5.6.1. | Introduction to bio-based PCBs |
| 5.6.2. | Switching to bio-based PCBs involves new optimization |
| 5.6.3. | Bioplastics for PCBs |
| 5.6.4. | Bioplastics: Current research and use |
| 5.6.5. | Polylactic acid |
| 5.6.6. | Biodegradable PCBs- JIVA |
| 5.6.7. | JIVA Partnerships could accelerate uptake |
| 5.6.8. | Dell's Concept Luna laptop using Soluboard® |
| 5.6.9. | Project HyPELignum |
| 5.6.10. | Cellulose research and development |
| 5.6.11. | 'Papertronics' research |
| 5.6.12. | SWOT Analysis: Bio-based materials |
| 5.7. | Key takeaways |
| 5.7.1. | Sustainability index: PCB substrates |
| 5.7.2. | Key takeaways |
| 5.8. | Patterning and metallization |
| 5.8.1. | Introduction: Patterning and metallisation |
| 5.8.2. | Conventional metallization is wasteful and harmful |
| 5.8.3. | Common etchants pose environmental hazards |
| 5.8.4. | Etchant regeneration makes wet etching more sustainable |
| 5.8.5. | Additive manufacturing benefits |
| 5.8.6. | Dry phase patterning |
| 5.8.7. | Print-and-plate |
| 5.8.8. | Sustainability benefits of print-and-plate |
| 5.8.9. | Formaldehyde alternative for green electroless plating |
| 5.8.10. | Laser induced forward transfer (LIFT) |
| 5.8.11. | Operating mechanism of LIFT |
| 5.8.12. | Target applications for laser induced forward transfer |
| 5.8.13. | Copper inks |
| 5.8.14. | Copper ink: Copprint |
| 5.8.15. | Copper inks driven by price |
| 5.8.16. | SWOT analysis: Copper inks |
| 5.8.17. | Carbon based inks |
| 5.8.18. | Barriers in printed electronics |
| 5.8.19. | Nano Dimension 3D printing |
| 5.8.20. | Sustainability index: Patterning and Metallization Processes |
| 5.8.21. | Sustainability index: Patterning and Metallization Materials |
| 5.8.22. | Key takeaways: Patterning and metallization |
| 5.9. | Component attachment - Materials |
| 5.9.1. | Introduction: Component attachment materials |
| 5.9.2. | Component attachment materials |
| 5.9.3. | Comparing component attachment types |
| 5.9.4. | Introduction: Limitations of conventional lead-free solder |
| 5.9.5. | Wide range of solder alloys available |
| 5.9.6. | Second-life tin |
| 5.9.7. | Low-temperature soldering and adhesives sustainability advantages |
| 5.9.8. | Low temperature solder alloys |
| 5.9.9. | Low temperature solder enables thermally fragile flexible substrates |
| 5.9.10. | Low temperature solder could perform as well as conventional solder |
| 5.9.11. | Low temperature alloy price comparison |
| 5.9.12. | SAFI-Tech's innovative supercooled liquid solder |
| 5.9.13. | SWOT Analysis: Low temperature solder |
| 5.9.14. | Electrically conductive adhesive's introduction |
| 5.9.15. | Non-conductive resin materials in ECAs |
| 5.9.16. | Key ECA innovations |
| 5.9.17. | ECAs in in-mold electronics (IME) |
| 5.9.18. | Low temperature curing ECAs |
| 5.9.19. | SWOT Analysis: ECAs |
| 5.9.20. | Status and market potential of SAC solder alternatives |
| 5.9.21. | ECAs vs low temperature solder |
| 5.9.22. | Sustainability index: Component attachment materials |
| 5.9.23. | Key takeaways: Component attachment materials |
| 5.10. | Component Attachment - Processes |
| 5.10.1. | Introduction: Component attachment processes |
| 5.10.2. | Thermal processing can be slow and time consuming |
| 5.10.3. | UV curing of ECAs could lower heat |
| 5.10.4. | UV curing equipment widely available |
| 5.10.5. | Photonic sintering and curing advantages |
| 5.10.6. | Photonic sintering |
| 5.10.7. | Near-infrared radiation can dry in seconds |
| 5.10.8. | Status and market potential of component attachment processes |
| 5.10.9. | Sustainability index: Component attachment processes |
| 5.10.10. | Key takeaways: Component attachment processes |
| 6. | END OF LIFE |
| 6.1. | Introduction |
| 6.1.1. | Introduction: End of life |
| 6.1.2. | E-waste is rapidly accumulating but recycling struggles to keep up |
| 6.1.3. | Increasing legislation for e-waste |
| 6.1.4. | Largest emissions from electronics are produced by ICs |
| 6.1.5. | Increasing renewable energy can result in substantial emissions reductions |
| 6.1.6. | Early testing minimizes waste |
| 6.1.7. | Etchant produces largest amount of hazardous waste |
| 6.2. | Recycling, recovery and reuse |
| 6.2.1. | Recovery of copper oxide from wastewater slurry |
| 6.2.2. | PCB recycling |
| 6.2.3. | PCB previous metal recovery |
| 6.2.4. | Critical semiconductor materials: Applications and recycling rates |
| 6.2.5. | Semiconductor hydrofluoric acid waste |
| 6.2.6. | Recyclable PCBs |
| 6.2.7. | Biodegradable substrates |
| 6.2.8. | Excess stock |
| 6.2.9. | Global take-back schemes |
| 6.2.10. | Reuse of equipment |
| 6.3. | Key takeaways |
| 6.3.1. | Summary of techniques to reduce waste |
| 6.3.2. | Key takeaways: End of life |
| 7. | COMPANY PROFILES |
| 7.1. | Links to company profiles on IDTechEx website |
Ordering Information
환경 친화적 전자기기 및 반도체 제조 주요 기업, 시장동향 및 전망 2025-2035
£€$元¥
전자 (사용자 1-5명)
£5,650.00
전자 (사용자 6-10명)
£8,050.00
전자 및 1 하드 카피 (사용자 1-5명)
£6,450.00
전자 및 1 하드 카피 (사용자 6-10명)
£8,850.00
전자 (사용자 1-5명)
€6,400.00
전자 (사용자 6-10명)
€9,100.00
전자 및 1 하드 카피 (사용자 1-5명)
€7,310.00
전자 및 1 하드 카피 (사용자 6-10명)
€10,010.00
전자 (사용자 1-5명)
$7,000.00
전자 (사용자 6-10명)
$10,000.00
전자 및 1 하드 카피 (사용자 1-5명)
$7,975.00
전자 및 1 하드 카피 (사용자 6-10명)
$10,975.00
전자 (사용자 1-5명)
元50,000.00
전자 (사용자 6-10명)
元72,000.00
전자 및 1 하드 카피 (사용자 1-5명)
元58,000.00
전자 및 1 하드 카피 (사용자 6-10명)
元80,000.00
전자 (사용자 1-5명)
¥990,000
전자 (사용자 6-10명)
¥1,406,000
전자 및 1 하드 카피 (사용자 1-5명)
¥1,140,000
전자 및 1 하드 카피 (사용자 6-10명)
¥1,556,000
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반도체 산업의 에너지 사용량은 2035년까지 7,360억 kWh 에 달할 것으로 전망
보고서 통계
| 슬라이드 | 340 |
|---|---|
| 전망 | 2035 |
| 게시 | Jan 2025 |
콘텐츠 미리보기
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