Gestión térmica para empaques semiconductores avanzados 2026-2036: tecnologías, mercados y oportunidades
This report provides a comprehensive overview of thermal challenges in advanced semiconductor packaging (ASP), covering power delivery evaluation for 2.5D and 3D ICs, identification of key thermal bottlenecks, assessment of emerging thermal interface materials, and analysis of advanced cooling technologies for next-generation packaging technologies. Coverage across different emerging TIM1 and TIM1.5 for ASP, historic market size data from 2021 to 2025 and a market forecast for TIM1 and TIM1.5 from 2026 to 2036 are all included, along with the market forecast for liquid and microfluidic cooling.
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