Thermal Interface Materials: TIM1, TIM1.5, TIM2 - 3.2x market size increase from 2025 to 2036

Thermal management is rapidly becoming one of the most critical challenges across industries, from electric vehicle (EV) batteries and power electronics to high-performance data center chips, advanced semiconductor packaging, ADAS, 5G infrastructure, satellite and space technologies, and consumer devices.

 

Even with advanced active cooling solutions such as liquid and immersion cooling, thermal interface materials (TIMs) remain indispensable. TIMs, whether in the form of TIM1 die-attach materials, TIM1.5 package-level interfaces, or TIM2 system-level solutions, all play a critical role that enable reliable, high-performance thermal pathways in next-generation technologies.

 

In this webinar, IDTechEx Senior Technology Analyst Yulin Wang will dive deep into the evolving world of TIMs, exploring how these materials are shaping the future of thermal management across diverse applications. From innovations in TIM conductivity, property trends, and TIM fillers to the latest developments in TIM1, TIM1.5, and TIM2 for various industries, attendees will gain insights into both the technical advancements and the market opportunities driving this field forward.

 

Key insights include:

• A complete overview of thermal interface materials by TIM form (TIM1, TIM1.5, TIM2)

• TIMs in EV battery packs and power electronics: evolving conductivity and performance requirements, TIM1 (die-attach), TIM1.5, and TIM2 advancements

• TIMs in data centers and advanced semiconductor packaging: new opportunities as cooling transitions toward liquid-based solutions

• TIMs in space and satellite

• TIMs in 5G

• TIMs in ADAS and next-gen automotive electronics

• TIMs in consumer electronics and high-density packaging

 

This webinar draws on research from the new IDTechEx market report, "Thermal Interface Materials 2026-2036: Technologies, Markets and Forecasts".