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2021

Liquid Wire Delivers Best-in-Class Performance in NextFlex Study

Liquid Wire Inc has joined the NextFlex community whose mission it is to advance US manufacturing of Flexible Hybrid Electronics by fostering technology innovation and commercialization. The current NextFlex project to identify reliable stretchable conductor systems utilizes Liquid Wire's proprietary elastic Metal Gel circuit and conductor technologies to exceed the project goals of 100% stretch for more than 10,000 cycles.

2020

Materials for Printed/Flexible Electronics 2021-2031: Technologies, Applications, Market Forecasts

IDTechEx Report: Dr Matthew Dyson, Raghu Das and Dr Richard Collins

ChemCubed

Chem Cubed offer particle-free conductive inks for thin-film printed electronics, along with inkjet printers for prototyping/small volume production that are optimized to work with their inks. Relative to other conductive inks ChemCubed's particle-free inks have very low time/temperature sintering requirements, just 30 s at 100 C.

Wearable Sensors 2021-2031

IDTechEx Report: James Hayward

3D Electronics 2020-2030: Technologies, Forecasts, Players

IDTechEx Report: Dr Matthew Dyson and Dr Richard Collins

Liquid Wire

Integrated Deposition Solutions

Integrated Deposition Solutions produce aerosol print systems (termed 'nanojet'), offering both complete printers and print systems for integration into larger installations.

KAUST

King Abdullah University of Science and Technology (KAUST) is a research university located near Jeddah, Saudi Arabia. This profile focuses on the work of Prof. Shamim's group, which is based on printed circuits, antennae and their applications.

Flexible Hybrid Electronics 2020-2030: Applications, Challenges, Innovations and Forecasts

IDTechEx Report: Dr Matthew Dyson

Conductive Ink Markets 2020-2030: Forecasts, Technologies, Players

IDTechEx Report: Dr Matthew Dyson and Yasuo Yamamoto

Electroninks

Electroninks has commercialized particle-free conductive inks for printed electronics applications. Such inks are marketed to replace nanoparticle inks, metal paste and sputtered or deposited metals.

Brewer Science

Brewer Science offers a variety of solutions for electronics manufacturing, including anti-reflective and protective coatings, planarizing materials, carbon electronics, processing equipment, and other related systems. This profile focuses on their activities in the printed electronics domain.

Boeing

At Flex2020 Boeing presented a multi-modal sensor utilizing flexible hybrid electronics.

CPI

CPI, established in 2004 as the 'Centre for Process Innovation', is a partly UK Government funded technology innovation center. This profile focuses on their work and capabilities in the printed/flexible/novel electronics area, and their applications in smart packaging.

SysteMECH

SysteMECH have developed a direct die-placement technology to attach thin dies (unpackaged ICs) to flexible substrates. This promises to avoid the damage that can occur to bare dies using typical pick-and-place methods and increase yields.

NextFlex

NextFlex is a consortium of companies, academic institutions, non-profits and state, local and federal governments who collectively aim to advance U.S. manufacturing of flexible hybrid electronics.

Wearables Pivot to Healthcare, Printed Electronics Wins

Healthcare Sensor Innovations 2020, hosted in San Jose on March 17-18, identifies and assesses the opportunities for printed and flexible electronics in healthcare as the technology enables a new wave of medical wearable devices.

American Semiconductor Inc

American Semiconductor is a company based in Idaho, USA that has developed a process for thinning silicon chips and packaging them within a polymer. This enables flexible, durable silicon ICs, offering processing capability with a flexible form factor.

NovaCentrix

NovaCentrix has developed photonic curing/sintering, which enables conductive inks and solder to be heated without damaging the substrate. This facilitates printing conductive inks and soldering components onto cheap flexible substrates such as PET rather than requiring expensive temperature-resistant substrates.

2019

innoLAE 2020: Breakthrough Technologies and New Applications

The 6th Innovations in Large-Area Electronics Conference (innoLAE) returns to the Wellcome Genome Campus Conference Centre, Cambridge, UK on 21-22 January 2020, to deliver a programme highlighting the most innovative and exciting aspects of large-area electronics (LAE) - a new way of making electronics which includes printable, flexible, plastic, organic and bio- electronics.