Full profile interview
22 Oct 2020

ChemCubed
Chem Cubed offer particle-free conductive inks for thin-film printed electronics, along with inkjet printers for prototyping/small volume production that are optimized to work with their inks. Relative to other conductive inks ChemCubed's particle-free inks have very low time/temperature sintering requirements, just 30 s at 100 C.
Full profile interview: SWOT
24 Jul 2020

Liquid Wire
Full profile interview
28 May 2020

Integrated Deposition Solutions
Integrated Deposition Solutions produce aerosol print systems (termed 'nanojet'), offering both complete printers and print systems for integration into larger installations.
Update interview
20 Apr 2020

KAUST
King Abdullah University of Science and Technology (KAUST) is a research university located near Jeddah, Saudi Arabia. This profile focuses on the work of Prof. Shamim's group, which is based on printed circuits, antennae and their applications.
Full profile interview
24 Mar 2020

Electroninks
Electroninks has commercialized particle-free conductive inks for printed electronics applications. Such inks are marketed to replace nanoparticle inks, metal paste and sputtered or deposited metals.
Update interview
10 Mar 2020

Brewer Science
Brewer Science offers a variety of solutions for electronics manufacturing, including anti-reflective and protective coatings, planarizing materials, carbon electronics, processing equipment, and other related systems. This profile focuses on their activities in the printed electronics domain.
Update
9 Mar 2020

Boeing
At Flex2020 Boeing presented a multi-modal sensor utilizing flexible hybrid electronics.
Full profile interview
6 Mar 2020

CPI
CPI, established in 2004 as the 'Centre for Process Innovation', is a partly UK Government funded technology innovation center. This profile focuses on their work and capabilities in the printed/flexible/novel electronics area, and their applications in smart packaging.
Full profile interview
5 Mar 2020

SysteMECH
SysteMECH have developed a direct die-placement technology to attach thin dies (unpackaged ICs) to flexible substrates. This promises to avoid the damage that can occur to bare dies using typical pick-and-place methods and increase yields.
Full profile interview
2 Mar 2020

NextFlex
NextFlex is a consortium of companies, academic institutions, non-profits and state, local and federal governments who collectively aim to advance U.S. manufacturing of flexible hybrid electronics.
Included are:
26 Feb 2020

Wearables Pivot to Healthcare, Printed Electronics Wins
Healthcare Sensor Innovations 2020, hosted in San Jose on March 17-18, identifies and assesses the opportunities for printed and flexible electronics in healthcare as the technology enables a new wave of medical wearable devices.
Full profile interview
7 Feb 2020

American Semiconductor Inc
American Semiconductor is a company based in Idaho, USA that has developed a process for thinning silicon chips and packaging them within a polymer. This enables flexible, durable silicon ICs, offering processing capability with a flexible form factor.
Full profile interview
31 Jan 2020

NovaCentrix
NovaCentrix has developed photonic curing/sintering, which enables conductive inks and solder to be heated without damaging the substrate. This facilitates printing conductive inks and soldering components onto cheap flexible substrates such as PET rather than requiring expensive temperature-resistant substrates.