NextFlex

NextFlex

HQ Country
United States
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NextFlex®, America's Flexible Hybrid Electronics Manufacturing Institute, is a leading force in the Manufacturing USA network. It is a consortium of companies, academic institutions, non-profits, and state, local, and federal governments with a shared goal of advancing U.S. manufacturing of FHE. Since its formation in 2015, NextFlex's elite team of thought leaders, educators, problem solvers, and manufacturers have come together to collectively facilitate innovation, narrow the manufacturing workforce gap, and promote sustainable manufacturing ecosystems.
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2024
11 Jan 2024

ChemCubed

ChemCubed offer both nanocomposite material for 3D printing (termed NanoJet™) and multi-layer/multi-material digital printing solutions (termed ElectroJet™) for electronics, including materials (particle free inks), printers, and processes. This profile is an update of their latest developments on ElectroJet™.
2023
1 Aug 2023

Tapecon

Tapecon is an established contract manufacturer leveraging its screen printing expertise to produce fully printed and flexible hybrid electronics circuits. IDTechEx caught up with Technical Program Leader Rafael Tudela at the FLEX 2023 conference.
17 Jul 2023

Flexible Hybrid Electronics 2024-2034

IDTechEx Report:
5 Jun 2023

Flexible & Printed Electronics 2023-2033: Forecasts, Technologies, Markets

IDTechEx Report:
2022
21 Dec 2022

Manufacturing Printed Electronics 2023-2033

IDTechEx Report:
17 Nov 2022

Conductive Ink Market 2023-2033

IDTechEx Report:
27 Oct 2022

Electronic Skin Patches 2023-2033

IDTechEx Report: Dr Tess Skyrme and Dr Nadia Tsao
22 Aug 2022

ACI Materials

ACI Materials manufactures a range of conductive inks, provided as part of a 'full-stack' functional material portfolio. It targets applications across printed/hybrid electronics, especially in the wearable technology market with its stretchable inks. IDTechEx caught up with Marshall Tibbetts (COO), Andrew Bambach (Application Engineering Manager) and Mike Mastropietro (CTO).
15 Aug 2022

Boeing

Boeing are developing wireless connected sensors based on flexible hybrid electronics (FHE) for asset tracking/monitoring around their production sites. These will include Bluetooth Low Energy communication, along with temperature, humidity, and motion sensors.
2021
1 Feb 2021

Liquid Wire Delivers Best-in-Class Performance in NextFlex Study

Liquid Wire Inc has joined the NextFlex community whose mission it is to advance US manufacturing of Flexible Hybrid Electronics by fostering technology innovation and commercialization. The current NextFlex project to identify reliable stretchable conductor systems utilizes Liquid Wire's proprietary elastic Metal Gel circuit and conductor technologies to exceed the project goals of 100% stretch for more than 10,000 cycles.
2020
13 Nov 2020

Materials for Printed/Flexible Electronics 2021-2031: Technologies, Applications, Market Forecasts

IDTechEx Report: Raghu Das
22 Oct 2020

ChemCubed

Chem Cubed offer particle-free conductive inks for thin-film printed electronics, along with inkjet printers for prototyping/small volume production that are optimized to work with their inks. Relative to other conductive inks ChemCubed's particle-free inks have very low time/temperature sintering requirements, just 30 s at 100 C.
24 Jul 2020

Liquid Wire

28 May 2020

Integrated Deposition Solutions

Integrated Deposition Solutions produce aerosol print systems (termed 'nanojet'), offering both complete printers and print systems for integration into larger installations.
20 Apr 2020

KAUST

King Abdullah University of Science and Technology (KAUST) is a research university located near Jeddah, Saudi Arabia. This profile focuses on the work of Prof. Shamim's group, which is based on printed circuits, antennae and their applications.
24 Mar 2020

Electroninks

Electroninks has commercialized particle-free conductive inks for printed electronics applications. Such inks are marketed to replace nanoparticle inks, metal paste and sputtered or deposited metals.
10 Mar 2020

Brewer Science

Brewer Science offers a variety of solutions for electronics manufacturing, including anti-reflective and protective coatings, planarizing materials, carbon electronics, processing equipment, and other related systems. This profile focuses on their activities in the printed electronics domain.
9 Mar 2020

Boeing

At Flex2020 Boeing presented a multi-modal sensor utilizing flexible hybrid electronics.
6 Mar 2020

CPI

CPI, established in 2004 as the 'Centre for Process Innovation', is a partly UK Government funded technology innovation center. This profile focuses on their work and capabilities in the printed/flexible/novel electronics area, and their applications in smart packaging.
5 Mar 2020

SysteMECH

SysteMECH have developed a direct die-placement technology to attach thin dies (unpackaged ICs) to flexible substrates. This promises to avoid the damage that can occur to bare dies using typical pick-and-place methods and increase yields.