NextFlex
NextFlex
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United States
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NextFlex®, America's Flexible Hybrid Electronics Manufacturing Institute, is a leading force in the Manufacturing USA network. It is a consortium of companies, academic institutions, non-profits, and state, local, and federal governments with a shared goal of advancing U.S. manufacturing of FHE. Since its formation in 2015, NextFlex's elite team of thought leaders, educators, problem solvers, and manufacturers have come together to collectively facilitate innovation, narrow the manufacturing workforce gap, and promote sustainable manufacturing ecosystems.
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2022
21 Dec 2022
Manufacturing Printed Electronics 2023-2033
IDTechEx Report: Dr Matthew Dyson and Dr Isabel Al-Dhahir
17 Nov 2022
Conductive Ink Market 2023-2033
IDTechEx Report: Dr Matthew Dyson
27 Oct 2022
Electronic Skin Patches 2023-2033
IDTechEx Report: Andy Ko, Brendan Beh, Dr Tess Skyrme, Dr Matthew Dyson and Dr Nadia Tsao
22 Aug 2022
ACI Materials
ACI Materials manufactures a range of conductive inks, provided as part of a 'full-stack' functional material portfolio. It targets applications across printed/hybrid electronics, especially in the wearable technology market with its stretchable inks. IDTechEx caught up with Marshall Tibbetts (COO), Andrew Bambach (Application Engineering Manager) and Mike Mastropietro (CTO).15 Aug 2022
Boeing
Boeing are developing wireless connected sensors based on flexible hybrid electronics (FHE) for asset tracking/monitoring around their production sites. These will include Bluetooth Low Energy communication, along with temperature, humidity, and motion sensors.
18 Mar 2022
3D Electronics/Additive Electronics 2022-2032
IDTechEx Report: Dr Matthew Dyson
2021
9 Sep 2021
Printed and Flexible Sensors 2022-2032: Technologies, Players, Markets
IDTechEx Report: Dr Matthew Dyson
1 Feb 2021
Liquid Wire Delivers Best-in-Class Performance in NextFlex Study
Liquid Wire Inc has joined the NextFlex community whose mission it is to advance US manufacturing of Flexible Hybrid Electronics by fostering technology innovation and commercialization. The current NextFlex project to identify reliable stretchable conductor systems utilizes Liquid Wire's proprietary elastic Metal Gel circuit and conductor technologies to exceed the project goals of 100% stretch for more than 10,000 cycles.2020
13 Nov 2020
Materials for Printed/Flexible Electronics 2021-2031: Technologies, Applications, Market Forecasts
IDTechEx Report: Dr Matthew Dyson, Raghu Das and Dr Richard Collins
22 Oct 2020
ChemCubed
Chem Cubed offer particle-free conductive inks for thin-film printed electronics, along with inkjet printers for prototyping/small volume production that are optimized to work with their inks. Relative to other conductive inks ChemCubed's particle-free inks have very low time/temperature sintering requirements, just 30 s at 100 C.24 Jul 2020
Liquid Wire
28 May 2020
Integrated Deposition Solutions
Integrated Deposition Solutions produce aerosol print systems (termed 'nanojet'), offering both complete printers and print systems for integration into larger installations.20 Apr 2020
KAUST
King Abdullah University of Science and Technology (KAUST) is a research university located near Jeddah, Saudi Arabia. This profile focuses on the work of Prof. Shamim's group, which is based on printed circuits, antennae and their applications.
17 Apr 2020
Flexible Hybrid Electronics 2020-2030: Applications, Challenges, Innovations and Forecasts
IDTechEx Report: Dr Matthew Dyson
24 Mar 2020
Electroninks
Electroninks has commercialized particle-free conductive inks for printed electronics applications. Such inks are marketed to replace nanoparticle inks, metal paste and sputtered or deposited metals.10 Mar 2020
Brewer Science
Brewer Science offers a variety of solutions for electronics manufacturing, including anti-reflective and protective coatings, planarizing materials, carbon electronics, processing equipment, and other related systems. This profile focuses on their activities in the printed electronics domain.9 Mar 2020
Boeing
At Flex2020 Boeing presented a multi-modal sensor utilizing flexible hybrid electronics.6 Mar 2020
CPI
CPI, established in 2004 as the 'Centre for Process Innovation', is a partly UK Government funded technology innovation center. This profile focuses on their work and capabilities in the printed/flexible/novel electronics area, and their applications in smart packaging.5 Mar 2020
SysteMECH
SysteMECH have developed a direct die-placement technology to attach thin dies (unpackaged ICs) to flexible substrates. This promises to avoid the damage that can occur to bare dies using typical pick-and-place methods and increase yields.2 Mar 2020
NextFlex
NextFlex is a consortium of companies, academic institutions, non-profits and state, local and federal governments who collectively aim to advance U.S. manufacturing of flexible hybrid electronics.
Included are:
