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스마트 및 지능형 패키징 (2020-2030년)

글로벌 전망, 시장 및 기술 평가

모두 보기 설명 목차, 표 및 그림 목록 가격 Related Content
이 IDTechEx Research 보고서는, 스마트 패키징, FMCG(Fast Moving Consumer Goods) 브랜드의 스마트 패키징에 대한 의견, 구현 기술 평가, 스마트 패키징 사례 연구, 주요 업체 및 전자 스마트 패키징 전망에 대한 스마트 및 지능형 패키징 기회를 다룬다. 액티브 패키징 기술 옵션 및 화학 지표도 검토한다. 이러한 분석은 중국의 QR 코드 상승에 대한 평가에서부터 4천억 달러 이상의 패키징 산업에서 근본적인 변화를 가능하게 하는 새로운 반도체 및 기타 구성요소를 기반으로 한 최신 전자 스마트 라벨에 이르기까지 전 세계적으로 수행되었다. 또한 실패로부터 배우는 도전과 교훈에 대한 솔직한 평가도 포함된다. 이 상세한 연구 보고서를 통해 전체적인 그림을 볼 수 있다.
Smart (or intelligent) packaging for goods is packaging which goes beyond the basic function of passively containing and protecting the product by adding useful functionality with real benefits for the consumer.
This comprehensive IDTechEx Research report covers the upcoming requirements and drivers for smart packaging; feedback from Fast Moving Consumer Goods (FMCG) brands with their views of smart packaging; assessment of enabling technologies; smart packaging case studies; key players; and forecasts of electronic smart packaging.
This analysis is done on a global basis, from assessing the rise of QR codes in China to the latest electronic smart labels based on novel semiconductors and other components that are enabling a radical change in the $400 billion+ packaging industry.
IDTechEx concludes how the global demand for electronic smart packaging features will be a $895 million market in 2030 versus $55 million in 2020 (and more if the infrastructure, software and services are also included). Based on an impartial analysis, IDTechEx expects that almost 21 billion packages sold in 2030 will feature an electronic feature to enhance the package.
Why Smart and Intelligent Packaging?
Smart and intelligent packaging can offer many different benefits to the brand, retailer and consumer. For example, it addresses the need for brands to reconnect with the customer or face potential oblivion from competing products. Other drivers include counterfeiting to the ageing population's need for better drug delivery devices.
There are many current and developing emerging technologies which are driving change in the smart packaging segment, often with very different purposes, which include:
  • RFID for wireless item identification (usually invisible to the consumer)
  • Electronic Articles Surveillance (EAS) for anti theft (usually invisible to the consumer)
  • QR codes for identification (increasingly used for payments)
  • Data loggers for temperature, shock, vibration, etc monitoring
  • Interactive smart packaging including illumination, sound, measuring (such as smart blister packs) and much more
  • Chemical indicators: temperature, frozen chemical visual indicators
  • Internal active packaging: whereby the package interacts with the contents to keep it fresher for longer, for example
  • External active packaging: whereby the package releases aromas, for example, to entice consumers
Drivers for Smart Packaging
There are prominent drivers for smart packaging, including the ageing population, more wealthy consumers, requirement for more data on products purchased, entertainment value, need to distinguish products amidst greater competition and tougher legislation.
Smart packaging can also solve big challenges such as monitoring patients not taking medication at the correct times when needed or informing that the medicines or foods are still safe to consume.
Across that backdrop there are other significant impending changes, from increasing home delivery of products and groceries which may change the value of the product packaging in the decision and sales process to many new enabling technologies from machine vision systems to identify items to the increasing adoption of RFID to printed electronics labels. Of course, sustainability is also a high priority for brands.
Global, Detailed Assessment of Smart Packaging
This report from IDTechEx covers the full picture and opportunities - in addition to the challenges. To gain very high volume, and therefore lowest costs, by selling across all industries, basic hardware platforms must be developed. These are discussed. The detailed market forecasts, statistics for associated industries, pros and cons, technology choices and lessons of success and failure provide a lucid, compact analysis.
The report is structured as follows:
Executive summary, including key conclusions and forecasts
The need for Smart Packaging and brand perspectives
This section covers the drivers for smart packaging, end user requirements and voice of the customer based on feedback from global FMCG firms on their perspectives on smart packaging
RFID: NFC and RAIN for Smart Packaging
NFC and RAIN technologies, prices and their application to packaging
Printed, Flexible and Organic Electronics
Assessment of enabling technologies including displays, flexible/printed batteries, printed sensors and flexible logic circuits
QR codes
Failures and successes, analysis of use of QR codes in China
Capacitive ink strip / identification systems
Analysis of novel identification systems relevant to smart packaging
RFID Sensors
NFC and RAIN sensor systems, passive or with battery
Chemical smart packaging technologies
Review of chemical smart packaging technologies including time temperature and freshness indicators
Smart Packaging Applications: RFID
Applications and case studies of RFID smart packaging
Smart Blister Packs
Assessment of smart blister packs for monitoring medication compliance'
Smart Packaging Case Studies
Case studies and applications of printed electronics in smart packaging
Electronic Smart Packaging Forecasts
Forecasts and conclusions of electronic smart packaging. Forecasts are given in terms of number of units, average sales price and total market value for each of the following: NFC, RAIN RFID, Light-up/display based electronic smart packaging, audio smart packaging
Opportunities in Smart Packaging
The report identifies and assesses the many challenges still to be addressed, including the value of tagging products in the highest volume versus cost, sustainable profitable applications beyond one-off projects, environmental impact and unmet needs including the lack of integrators and complete product designers. Applicable technologies are assessed with details of the key players.
All of these opportunities and trends, including detailed ten year forecasts, are covered in this IDTechEx report "Smart and Intelligent Packaging 2020-2030". The report reveals many ways in which brands can create a sharp increase in market share, customer satisfaction and profitability. It covers case studies of successes and failures and why.
IDTechEx의 분석가 액세스
모든 보고서 구입에는 전문가 분석가와의 최대 30분의 전화통화 시간이 포함되어, 보고서의 주요 결과를 귀하가 제시하는 비즈니스 문제에 연결하도록 돕습니다. 이 전화통화는 보고서를 구매한 후 3개월 이내에 사용해야합니다.
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Table of Contents
1.1.What is Smart Packaging?
1.2.Why Smart Packaging - Logistical and Safety Reasons
1.3.Why Smart Packaging - Increasing Sales and Better Merchandising
1.4.Smart Packaging - Status
1.5.Smart Packaging: Things Are Changing
1.6.EAS tags
1.7.QR Codes
1.8.Unique ID with no silicon chip
1.9.Chipless RFID or Flexible/Printed IC Passive tags
1.10.RAIN (UHF RFID) Smart Packaging
1.11.RAIN (UHF RFID) Smart Packaging 2020-2030
1.12.RAIN (UHF RFID) tags 2020-2030 - numbers million
1.13.RAIN (UHF RFID) tags 2020-2030 - avg sale price $cents
1.14.RAIN (UHF RFID) tags 2020-2030 - market value $M
1.15.NFC (HF RFID) Smart Packaging
1.16.NFC (HF RFID) tags 2020-2030 - numbers million
1.17.NFC (HF RFID) tags 2020-2030 - avg sale price $cents
1.18.NFC (HF RFID) tags 2020-2030 - market value $M
1.19.NFC (HF RFID) Smart Packaging Forecast Reasoning
1.20.Electronic Smart Packaging beyond RFID
1.21.Electronic Smart Packaging Total Forecast 2020-2030 Numbers million
1.22.Electronic Smart Packaging Total Forecast 2020-2030 Market value $M
1.23.Challenges and Opportunities
2.1.The need for smart packaging
2.2.Problems in the retail industry
2.3.Problems in healthcare
2.4.Using more of the human senses and in a better way
3.1.End User Needs: Drivers for Smart Packaging
3.2.End User Feedback on Smart Packaging - Application Needs
3.3.End User Views on Smart Packaging - Technical Needs
3.4.P&G and printed electronics
3.5.Diageo and printed electronics
3.7.Colgate-Palmolive Group
4.2.RFID Technologies: The Big Picture
4.3.Passive RFID
4.4.Favourite RFID frequencies
4.5.Passive RFID Systems
4.6.Battery Assisted Passive /Semi Active tags
4.7.Examples of Battery Assisted Passive (BAP) RFID sensors
4.8.Active RFID
4.9.Real Time Locating Systems (RTLS)
4.10.Chipless/printed RFID
4.11.Passive RFID: Technologies by Operating Frequency
4.12.Anatomy of passive HF and UHF tags
4.13.Challenges in contacting HF/NFC coils
4.14.Threats to passive RFID: machine vision?
4.15.Might Packaging Become Irrelevant with Online Retailing?
5.1.Description and analysis of the main technology components of printed, flexible and organic electronics
5.2.Market potential and profitability
5.3.Current market size
5.4.Go to Market Strategies: Pros and Cons
5.5.The value chain is unbalanced
5.6.But many have shifted to provide complete solutions
5.7.Many enabling printed electronic technologies are an enabler but not an obvious product
5.8.Creating successful new products is hard
5.9.Cost reduction has been more commercially successful...
5.10....but if it is the only differentiator suppliers can struggle
5.11.Competing on more than cost has been the most successful
5.12.Keep It Simple, Stupid
6.1.Electrochromic displays
6.1.1.Electrochromic displays
6.1.2.Ynvisible Electrochromic Displays
6.2.AC Electroluminescent displays
6.2.1.AC Electroluminescent displays
6.2.2.AC electroluminescent displays
6.2.3.EL technology
6.2.4.AC Electroluminescent (EL) Displays
6.3.Thermochromic displays
6.3.1.Thermochromic Displays
7.1.Printed LED lighting
7.2.Nth Degree - Printed LEDs
8.1.Introduction to batteries
8.2.Comparison of Power Options
9.1.Applications of printed batteries
9.2.Types of sensors that can be printed
9.3.Sensors: Technology Readiness
9.4.Capacitive pressure/force sensor
9.5.Fluid level sensor
10.1.Types of Flexible or Printed Transistor Circuits
10.2.Why Print Transistors
10.3.Semiconductor Choices Compared
10.4.But challenges persist...
10.5.Semiconductor choices
10.6.Incumbent TFT technologies- silicon based
10.7.Metal Oxide Semiconductors
10.8.Metal Oxide production process
10.9.But can Metal Oxide Semiconductors be printed?
10.10.Evonik's solution processible metal oxide
10.11.Latest progress with iXensic
10.12.And even at room temperature with deep UV annealing
10.13.Organic semiconductors
10.14.OTFT Mobility hype: reality check
10.15.All printed TFTs
10.16.JAPERA all printed TFT
10.17.S2S automatic printed OTFT
10.18.Roll-to-roll printed organic TFTs
10.19.Merck's Organic TFT
10.20.Carbon nanotubes and graphene transistors
10.21.Latest progress with flexible/printed transistor RFID
10.22.Flexible or printed transistors for logic, creating smart systems
10.23.Mediocre TFTs can do many functions
10.24.Current work in developing flexible transistor RFID and Smart Packaging
10.25.IMEC / Holst Centre Roadmap
10.26.Benefits of flexible logic
10.27.Save on IC attach cost?
10.28.Logic Based Systems
10.29.Lessons from the Silicon Chip: need for modularity
10.30.Thin, flexible 'NFC' ICs come to market for simple wireless barcodes
10.31.Printed electronics components
10.32.PragmatIC's wine temperature sensing label
10.33.Logic and Smart System Forecast 2018-2030 $ millions
10.34.Company profiles related to this chapter
11.1.QR Codes: Failure in Europe and America, Huge Success in China
11.2.QR Codes: where next?
11.3.Will NFC or RAIN Impact QR Codes?
12.1.RFID without transistors Hidden Electronic Product Code (HidE)
12.2.Printechnologics printed ID
12.3.Radar ID 60GHz
12.4.Inksure - SARcode Example
12.5.Touchcode: T-ink / Printechnologics
12.6.Touchcode Application Concepts
12.7.Touchcode Progress
12.9.Prismade Labs
13.1.RFID Sensors: main choices
13.2.RFID tag sensor from IC-TAG
13.3.Passive UHF RFID sensor co-developed by Powercast and Vanguard ID Systems
13.4.Passive UHF RFID Sensor: RFMicron and Smartrac
13.5.GE/ Kemsense: BioSensors on conventional RFID labels
13.6.Chemical powerless RFID sensor tag
13.7.Lessons from Failures
14.1.Food degradation
14.2.Microbial Spoilage
14.3.Chemical and Enzymatic Activity
14.4.Oxidative Deterioration/Rancidity
14.5.Moisture/Vapour Migration
14.6.Determining Shelf Life
14.7.Food Degradation
14.8.Time Temperature Indicators (TTIs)
14.9.Chemical TTIs
14.10.Chemical Time Temperature Indicators
14.11.Examples of Chemical Time Temperature Indicators (TTIs
14.12.Freshness Indicators
14.13.Ripeness Indicators
14.14.Time Indicators
15.1.Pallet/ case tagging
15.2.Retail apparel, item level
15.3.Retail Apparel Payback
15.4.RFID for anti-counterfeiting - it's the law!
15.5.METI, Japan, target 100 billion tags/year by 2025
15.6.IDTechEx view on the METI announcement
15.7.RFID provides more consumer engagement and use data
15.8.Coca-Cola Freestyle Machine
15.9.RFID provides more consumer engagement and use data
16.1.The Problem: Medication Non-Compliance
16.2.The Problem: Medication Non-Compliance - Statistics
16.3.The Current Solution
16.4.The Printed Electronics / RFID Solutions
16.5.Smart Blister Packs
16.6.Smart Blister Packs - Not a Big Success Yet
16.7.Things are Changing & More Players Enter
16.8.Smart Blister Packs: Outlook
17.1.Batteries with integral battery tester
17.2.Light up Packaging: Bombay Sapphire, KENT Gold, Copoya Rum
17.3.Place mats - McDonalds
17.4.Interactive tablecloth - Hallmark
17.5.Beer package game - VTT Technology
17.6.Cookie heater pack - T-Ink
17.7.Theft detection - Swedish Postal Service and Deutsche Post
18.1.RAIN (UHF RFID) Smart Packaging
18.2.RAIN (UHF RFID) Smart Packaging 2020-2030
18.3.RAIN (UHF RFID) tags 2020-2030 - numbers million
18.4.RAIN (UHF RFID) tags 2020-2030 - avg sale price $cents
18.5.RAIN (UHF RFID) tags 2020-2030 - market value $M
18.6.NFC (HF RFID) Smart Packaging
18.7.NFC (HF RFID) tags 2020-2030 - numbers million
18.8.NFC (HF RFID) tags 2020-2030 - avg sale price $cents
18.9.NFC (HF RFID) tags 2020-2030 - market value $M
18.10.NFC (HF RFID) Smart Packaging Forecast Reasoning
18.11.Electronic Smart Packaging beyond RFID
18.12.Electronic Smart Packaging Total Forecast 2020-2030 Numbers million
18.13.Electronic Smart Packaging Total Forecast 2020-2030 Market value $M
18.14.Challenges and Opportunities

보고서 통계

슬라이드 258
전망 2030

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