Contactless temperature measurement functionality is very difficult to integrate into a mobile phone. In spite of the difficulties contactless forehead thermometry is still the most promising way of realizing body temperature in a mobile application. Small size, reasonably small Field of View and stable operation in harsh thermal environments are three necessary boundary conditions. Although such features would be highly attractive for numerous industrial and consumer applications too, they cannot be fulfilled simultaneously by state-of-the-art infrared sensors. Melexis will explain how these challenges were overcome, applying wafer level packaging techniques to thermopile technology. The resulting sensor represents a key milestone in our roadmap towards a medical grade part.
This presentation also includes a demo of the novel sensor.
Speaker Biography (Joris Roels)
Joris Roels received both his master and PhD degree in electrical engineering from Ghent University and was granted two awards for his PhD research in the field of optical MEMS.
In 2010 he joined Melexis, a Belgium based company that develops, tests and markets advanced integrated semiconductor products as application engineer in the optical sensors business unit.
Since 2013 Joris is in charge of the infrared temperature sensors product line in the Sensors Business unit.
Company Profile (Melexis)
Melexis designs, develops, tests and markets advanced integrated semiconductor products. Our devices meet the world's growing demand for greener and safer cars that are fun to drive, smarter appliances and more conscious buildings. We supply unique sensor and driver chips, communicating with analog, digital, wired or wireless interfaces, enhanced with advanced on board microcontrollers or DSP capabilities. Our core experience is derived from over 27 years supplying leading-edge and innovative ICs to the automotive electronics market, expanding in other application fields such as smart appliances and building automation.
Melexis' portfolio is built around three pillars: Sensing, Driving and Communicating. Sensors include magnetic, MEMs, and sensor interface ICs; optoelectronic single point and linear array sensors; infrared thermometers, CMOS wide dynamic range, Time of Flight and night vision cameras. Driver ICs cover Advanced DC & BLDC motor controllers and FET Pre-driver ICs. Communication ICs serve RKE, TPMS, ISM band applications, NFC, RFID reader and smart tag solutions. For more information, visit www.melexis.com