Synthesis of Nano Metal Particles and their Application in Inks for Low Temperature Sintering (Printed Electronics Europe 2014)

Ms Sindy Mosch, Ceramic Energy Converters
Fraunhofer IKTS


Berlin 2014 Presentation - Fraunhofer IKTS*
Berlin 2014 Audio Presentation - Fraunhofer IKTS*

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Presentation Summary

synthesis of Ag/Au/Pt/ Cu nano particles and the influence of the synthesis parameters on the particle size and particle size distribution
  • preparation of inks for direct writing technologies and the influence of the used surfactants on the sintering temperature and properties of the inks
  • direct writing of the prepared metal inks on different substrate materials and the properties of the sintered ink: conductivity, printed structural dimensions, adhesion to the substrate,
  • examples: heater, chip contacts, conductive paths

Speaker Biography (Sindy Mosch)

Sindy Mosch
  • studies of material science at the Friedrich-Schiller-University of Jena, finished in 2004
  • 2004-2009 PhD at Fraunhofer IKTS about "Investigations about the dependence of material characteristics of the electrodes and the electrochemical activity of electrolyte-supported solid oxide fuel cells"
  • since 2004 research engineer at Fraunhofer IKTS in the field of high-temperature electrochemistry (SOFC, Sensors, paste development)
  • since 2009 development of nano-inks for direct writing methods and their application.

Company Profile (Fraunhofer IKTS)

Fraunhofer IKTS logo
The work of the Fraunhofer Institute for Ceramic Technologies and Systems IKTS covers all aspects of technical ceramics from preliminary basic research to application.
One core competence is the development of functional ceramic materials, miniaturized components and systems.
For the deposition of functional layers, both classic screen printing technology and digital printing processes (aerosol and inkjet printing) can be used, depending on application.
In addition, a complete ceramic multilayer technology line (LTCCs, HTCCs) is available to produce 3D-structured components.
We also offer a wide range of technologies for electrical contacting and the mechanical and microstructural characterization of electrical connections.
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