This report has been updated. Click here to view latest edition.

If you have previously purchased the archived report below then please use the download links on the right to download the files.

柔性、印刷和有机电子 2020-2030:预测、技术、市场

市场数据和技术及应用评估:全面了解


显示全部 说明 内容、图表列表 价格 Related Content
此报告针对柔性、印刷和有机电子行业提供了最全面的见解,并按照设备类型给出了详细的十年预测以及趋势、功能和市场成败的评估。除了通过印刷和非印刷、刚性和柔性电子等多种方式来评估市场价值外,还通过各种组件类型对市场进行了分析。所涵盖的关键组件包括显示屏、传感器、电池、逻辑、功能性墨水、电子织物等。
This report provides the most comprehensive view of the printed, organic and flexible electronics industry, giving detailed ten year forecasts by device type along with assessment of the trends, capabilities and market successes (and failures). The market is analyzed by each key component type in addition to assessing the market value by printed vs non printed, rigid vs flexible and much more.
 
Impartial assessment
In the report IDTechEx Research appraises each enabling technology component by virtue of its market need - not technology push. We draw on over fifteen years of knowledge tracking this sector on a global scale which culminates in this report providing detailed, refined forecasts, strategic positioning and assessment of trends, "hot topics" and unmet opportunities. Coverage of the technology is without hype - critically assessing the technology capabilities and genuine opportunities with realistic outlook based on our leading market insight.
 
Report Structure
The report is based on extensive primary interviews with suppliers across the value chain (including materials supply, equipment providers, component makers and system integrators), through to end user / OEM interviews to understand the user requirements. Research has been conducted globally based on our extensive contact database of the industry.
 
Each of the key enabling components are covered in turn in this report, being:
 
  • Conductors (used in a wide range of applications with growth from In Mold Electronics, e-textiles, RF/electro-magnetic interference shielding and much more)
  • Logic and memory (growth areas include smart packaging)
  • OLED displays (growth areas being plastic and foldable OLEDs)
  • Printed Quantum Dot (QD) Displays and hybrid QD-OLED displays
  • OLED lighting (addressing niche premium priced applications versus the incumbent LED lighting)
  • Electrophoretic and other bistable displays (growth in electronic shelf labels while color versions of information signs are improved)
  • Electrochromic displays (new products for smart packaging and smart labels)
  • Electroluminescent displays (in steady decline)
  • Other displays
  • Batteries (with companies focussing on electronic skin patches and other wearables)
  • Photovoltaics (with focus on building integrated PV and new technologies including perovskite PV)
  • Sensors (nine types are analyzed)
 
For each of the above sectors, the report covers:
 
  • Latest technical progress
  • Current and emerging applications
  • Market size - now and forecast through to 2029
  • Trends, challenges and opportunities
  • Key players and profiles of players
 
In addition, the report includes assessment of the application of printed, organic and flexible electronics to different industries specifically including automotive & transportation, consumer electronics, consumer goods, wearable electronics and others.
 
The value chain, go to market strategies and case studies of success and failure are given. This widely referenced IDTechEx report brings it all together, with particular focus on applications and quantative assessment of opportunities.
 
Market sizing
IDTechEx Research finds that the total market for printed, flexible and organic electronics will grow from $41.2 Billion in 2020 to $74 billion in 2030. The majority of that is OLEDs (organic but not mainly made by printing); printed biosensors; and printed conductive ink (used for a wide range of applications, but predominately PV). On the other hand, stretchable electronics, logic and memory, flexible batteries and capacitive sensors are much smaller segments but with strong growth potential.
 
A snapshot of the printed, organic and flexible electronics industry is shown below.
 
For each component ten year forecasts to 2030 are provided, with a breakdown of printed vs printed and rigid vs flexible.
 
 
(data masked for sample)
 
Company Profiles
IDTechEx Research continuously monitors hundreds of companies in this field, with the primary research used as a basis of the report. In addition, the report includes detailed profiles of over 50 companies.
 
If you are looking to understand the big picture, the opportunity, the problems you can address, or how you can start to use these technologies and the implications involved, this report is a must-buy. Researched by multilingual IDTechEx analysts and experts based eight countries in four continents, this report builds on 15 years of research of the industry.
从 IDTechEx 访问分析师
所有报告购买订单均包括与一名专家分析师进行 30 分钟的电话交谈,专家分析师将帮助您将报告中的重要发现与您正在处理的业务问题联系起来。这需要在购买报告后的三个月内使用。
更多信息
如果您对这一报告有任何疑问,请随时联系我们的报告团队 research@IDTechEx.com 或致电我们的销售经理:

AMERICAS (USA): +1 617 577 7890
ASIA (Japan): +81 3 3216 7209
ASIA (Korea): +82 10 3896 6219
EUROPE (UK) +44 1223 812300
Table of Contents
1.EXECUTIVE SUMMARY AND CONCLUSIONS
1.1.Summary
1.2.Definitions
1.3.Description and analysis of the main technology components of printed, flexible and organic electronics
1.4.Market potential and profitability
1.5.Current market size
1.6.Total Market Size by Component 2020-2030
1.7.Printed versus non-printed electronics
1.8.Market Size for Printed Electronics Components and Materials 2020-2030
1.9.Total market value of printed versus non-printed electronics 2020-2030
1.10.Findings on printed versus non-printed electronics
1.11.Flexible/conformal versus rigid electronics
1.12.Key components needed for flexible AMOLED displays
1.13.Market size of Flexible/ Conformation Electronics 2020-2030
1.14.Market value of flexible/conformal versus rigid electronics chart and table
1.15.Market by territory
1.16.The value chain and unmet needs
1.17.The Value Chain: Printed, Flexible & Organic Electronics
1.18.The value chain is unbalanced
1.19.But many have shifted to provide complete solutions because they are Pioneering New Market Creation
1.20.Go to Market Strategies
1.21.Strategy 2: Replace or do something simple in existing electronics/electrics
1.22.Strategy 3: Creating New Markets
1.23.What end users want - results from end user surveys
1.24.More companies are moving downstream to offer complete products
1.25.Hybrid Electronics
2.MARKET DRIVERS, LESSONS AND STRATEGIES FOR PRINTED ELECTRONICS
2.1.What is Printed, Flexible, Organic Electronics?
2.2.Printed, organic and flexible electronics value
2.3.Features that are associated with Printed Electronics
2.4.Giant industries collaborate for the first time
2.5.Recent Investments
2.6.Printed electronics in the retail industry
2.7.Printed electronics in healthcare
2.8.Printed electronics in wearable technology
2.9.Printed electronics in vehicles
2.10.Printed electronics in consumer electronics, IoT, etc.
2.11.Creating successful new products leveraging the benefits of printed electronics is challenging
2.12.Cost reduction has been more commercially successful...
2.13....but if it is the only differentiator it can struggle
2.14.Competing on more than cost has been the most successful
3.CONDUCTIVE INKS
3.1.Conductive Ink Options
3.2.Conductive inks and pastes
3.3.Characteristics of Ag nano inks
3.4.Flake versus nanoparticle inks
3.5.Explanation of conductive ink forecasts
3.6.Conductive Inks/Pastes, Polymer Thick Film (PTF): Key Suppliers
3.7.Nano particle conductive Inks/Pastes: Key Suppliers
3.8.Conductive Ink 2019 Market by Application $ millions
3.9.Conductive inks forecasts 2020-2030 $ millions
3.10.Conductive Ink in Photovoltaics
3.11.Silver consumption per PV wafer greatly improves
3.12.Touch screen market
3.13.Touch screen edge electrodes: getting finer
3.14.Automotive industry: Increasing use cases
3.15.Simple Circuit Printing
3.16.Structural Electronics
3.17.3D antennas
3.18.In-Mold Electronics (IME)
3.19.In-Mold Electronics (IME) Process and Examples
3.20.In-Mold Electronic Process
3.21.Comments on IME requirements
3.22.New ink requirements: stretchability
3.23.New ink requirements: portfolio approach
3.24.General application areas for IME
3.25.In-Mold Electronics (IME) Case Studies
3.26.Automotive: direct heating of headlamp plastic covers
3.27.3D printed electronics
3.28.Why 3D Printed Electronics?
3.29.Stretchable inks for E-Textiles
3.30.Conformal EMI shielding
3.31.Other Conductive Ink Applications
3.32.Conductive Ink Summary
3.33.Company profiles related to this chapter
4.DISPLAYS
4.1.Display drivers
4.1.1.Market drivers
4.1.2.New and established display technologies compared
4.2.OLED Displays
4.2.1.OLED displays
4.2.2.Why choose OLED over LCD?
4.2.3.Drivers for Display Innovation: OLED Displays
4.2.4.Evolution of the OLED industry
4.2.5.Examples of OLED products
4.2.6.Global OLED Production Capacity
4.2.7.OLED Display Market 2017-2018 by Value and SQ Meters
4.2.8.OLED market forecasts 2020-2030 $ Millions
4.2.9.OLED Display Forecasts 2019-2029 Area (sqm) by Form Factor (Rigid versus Flexible)
4.2.10.OLED Display Forecasts 2019-2029 Area (sqm) by Form Factor (Rigid versus Flexible)
4.2.11.OLED Display Forecasts 2019-2029, Panel Numbers by Form Factor (Rigid versus Flexible)
4.2.12.First step towards flexible: OLED on plastic substrate
4.2.13.The rise of plastic and flexible AMOLED
4.2.14.Case study: the Apple Watch
4.2.15.Case study: Motorola shatterproof screen
4.2.16.Key components needed for flexible AMOLED displays
4.2.17.Roadmap towards flexible AMOLED displays and flexible electronics devices
4.2.18.When will foldable displays take off?
4.2.19.Flexible OLEDs: First Foldable Display Comes to Market
4.2.20.Printing OLEDs
4.2.21.Inkjet Printing Organic Materials for Thin Film Encapsulation of OLEDs
4.2.22.Printed OLEDs: Printing RGB materials
4.2.23.Inkjet printing: is it worth it?
4.2.24.R G B inkjet printing in displays
4.2.25.Printed OLED Displays: Key Players
4.2.26.Printed OLEDs are finally commercial
4.2.27.Printed OLED TVs
4.2.28.JOLED: First Commercial Printed OLED Display
4.2.29.JOLED Printed OLED Strategy
4.2.30.UDC: Organic vapour jet printing
4.2.31.Fraunhofer IAP'S ESJET printing
4.2.32.Printing in Quantum Dot OLED Hybrid Displays
4.3.Electrophoretic and other bi-stable displays
4.3.1.Electrophoretic and other bi-stable displays
4.3.2.Electrophoretic e-readers decline - what's next?
4.3.3.The Holy Grail: Color E-paper Displays
4.3.4.New color display from E Ink without filters
4.3.5.Signage
4.3.6.Colour Electrophoretic Displays are Available $500 million market for e-paper in 2017
4.3.7.E-Paper Revenues
4.3.8.The early years of flexible E-ink displays
4.3.9.Other players in Reflective BiStable Displays
4.3.10.Electrowetting displays
4.3.11.Electrowetting displays: Liquavista
4.3.12.Electrowetting displays: Etulipa
4.3.13.Electrophoretic and Bi-Stable displays Market Forecasts 2020-2030 $ millions
4.4.Electrochromic displays
4.4.1.Electrochromic displays
4.4.2.Ynvisible Electrochromic Displays
4.4.3.Electrochromic displays market forecasts 2020-2030
4.5.AC Electroluminescent displays
4.5.1.EL technology
4.5.2.AC Electroluminescent (EL) Displays
4.5.3.Electroluminescent displays market forecasts 2018-2029 $ millions
4.6.Thermochromic displays
4.7.Flexible LCDs
4.7.1.Flexible LCDs
4.7.2.Flexible LCDs from FlexEnable
4.7.3.Flexible LCDs: Conclusions
4.7.4.Company profiles related to this chapter
5.LED AND OLED LIGHTING
5.1.OLED Lighting
5.1.1.Value proposition of OLED vs LED lighting
5.1.2.OLED lighting: solid-state, efficient, cold, surface emission, flexible......?
5.1.3.OLED Lighting Status
5.1.4.Cost challenge set by the incumbent (inorganic LED)
5.1.5.Comparing OLED and LED lighting
5.1.6.OLED Lighting is more challenging than OLED displays in terms of lifetime and light intensity requirements
5.1.7.OLED lighting - cost projection
5.1.8.Market announcements
5.1.9.Technology progress
5.1.10.OLED Lighting - market penetration
5.1.11.OLED lighting value chain
5.1.12.S2S Lines: OLEDWorks in Aachen (ex-Philips line)
5.1.13.S2S lines: LG display: Gen-2 and Gen 5
5.1.14.R2R line: Konica Minolta
5.1.15.But why is it so difficult to reduce cost??
5.1.16.OLED Lighting Market Forecast
5.1.17.OLED Lighting Market Forecast 2020-2030 $ millions
5.2.Printed LED lighting
5.2.1.Printed LED lighting
5.2.2.Nth Degree - Printed LEDs
6.PHOTOVOLTAICS
6.1.Introduction to photovoltaic technologies
6.2.Comparison of photovoltaic technologies
6.3.Efficiencies of Different Solar Technologies: Cells and Modules
6.4.Printing in crystalline silicon PV
6.5.Thin film photovoltaics
6.6.Value propositions—beyond conventional silicon
6.7.Amorphous silicon
6.8.CdTe and CIGS
6.9.DSSCs
6.10.Organic PV (OPV)
6.11.OPV: Typical device architectures
6.12.R2R solution vs R2R evaporation
6.13.OPV Progress
6.14.Solution Processed 17.5% tandem OPV (Aug 2018)
6.15.Examples of Organic PV
6.16.OPV installations
6.17.Challenges Commercializing Organic PV
6.18.Konarka vs Heliatek: a case study
6.19.Case study: Konarka's failure
6.20.Heliatek: R2R evaporated OPV
6.21.Latest progress update
6.22.Perovskites
6.23.Research-cell efficiencies of different solar technologies
6.24.Perovskite structure
6.25.Working principle
6.26.Evolution of Perovskite Development
6.27.Structures/architectures of perovskite solar cells
6.28.Perovskite solar cell evolution
6.29.Perovskite PV Commercial Opportunity
6.30.Perovskite PV Applications and Challenges
6.31.The Achilles' Heel
6.32.Efforts to overcome challenges
6.33.Efforts to overcome challenges
6.34.Overview
6.35.Pilot-scale capacity
6.36.Large scale roll-to-roll printed perovskite solar cells
6.37.Microquanta Semiconductor
6.38.Unique features are required where silicon PVs cannot provide
6.39.Application roadmap of perovskite photovoltaics
6.40.Market trends and forecasts
6.41.Company profiles related to this chapter
6.42.Perovskite Photovoltaics 2018-2028
7.PRINTED, FLEXIBLE BATTERIES
7.1.Introduction to batteries
7.2.Comparison of Power Options
7.3.Applications
7.4.Applications of printed batteries
7.5.Skin Patches
7.6.Application market roadmap
7.7.Printed battery technologies: Zn Based
7.8.Zinc-based printed batteries
7.9.Printed battery technologies: Li-ion Based
7.10.Printed battery layout
7.11.Component options of printed batteries
7.12.Typical construction and reaction of printed disposable battery
7.13.Players in printed battery industry
7.14.Rechargeable ZincPolyTM from Imprint Energy
7.15.Screen printed secondary zinc/nickel hydride batteries
7.16.Technology comparison and benchmarking
7.17.Technology benchmarking
7.18.Status of flexible batteries
7.19.Flexible and Printed Batteries 2020-2025 Market Value by Chemistry type $ millions
7.20.Flexible and Printed Batteries Market by Application in 2020 and 2025 $ millions
7.21.Company profiles related to this chapter
8.SENSORS
8.1.Sensor Definitions and Trends
8.1.1.Definitions
8.1.2.Main benefits of printed sensors
8.1.3.Types of sensors that can be printed
8.1.4.Market Maturity by Sensor Type
8.1.5.Printed and Flexible Sensor Market by Sensor type, 2019 $ millions
8.1.6.Printed and Flexible Sensor Market Forecast 2020-2030 $ Millions
8.2.BioSensors
8.2.1.Biosensors: Printed glucose test strips
8.2.2.Anatomy of a test strip: one example
8.2.3.Manufacturing steps of Lifescan Ultra
8.2.4.Profitability in the test strip industry is falling
8.2.5.Big four test strip manufacturers are changing to counter decreasing profitability
8.2.6.Diabetes management device roadmap: Glucose sensors
8.2.7.Test strips: A Billion Dollar market but in decline
8.2.8.Focus shifts from test strips to CGM
8.2.9.Glucose sensors for diabetes management: players
8.2.10.ECG (or similar) electrodes
8.2.11.Printed, flexible sweat sensor
8.3.Capacitive Sensors (including Transparent Conductive Films TCFs)
8.3.1.Capacitive Sensors
8.3.2.Printed Transparent Conductive Films (TCFs)
8.3.3.Metal mesh: hybrid
8.3.4.Metal mesh using screen printing
8.3.5.Metal mesh using gravure offset printing
8.3.6.Toray's photocurable screen printed paste for fine line metal mesh
8.3.7.Metal mesh with inkjet printing
8.3.8.Metal mesh: print seed layer and plate?
8.3.9.Silver nanowires: roll to roll formation using printing
8.3.10.Capacitive sensors on films
8.3.11.In-Mold Electronics: expanding material toolkit
8.3.12.IME PEDOT touch surfaces
8.3.13.Capacitive pressure/force sensor
8.3.14.Fluid level sensor
8.3.15.Printed capacitive stretch sensors
8.3.16.Applications: Strain sensor
8.3.17.Applications: haptic actuator
8.3.18.Printed capacitive stretch sensors: applications
8.4.Force Sensors (Piezoresistive)
8.4.1.Force sensing resistors (Piezoresistors)
8.4.2.Printed piezoresistive sensor
8.4.3.Materials
8.4.4.Previous applications of FSR
8.4.5.Sensors module: press buttons and large area sensors
8.4.6.Emerging applications
8.5.Force Sensors and Haptics (Piezoelectric and Ferroelectric)
8.5.1.Ferroelectric & Piezoelectric Sensors and Actuators
8.5.2.PVDF-based polymer options for sensing and haptic actuators
8.5.3.Low temperature inks
8.5.4.Applications: Touch sensing on metal
8.5.5.Joanneum Research: Pyzoflex
8.5.6.Applications: Skin conformable sensor
8.5.7.Applications: Loudspeaker
8.5.8.Applications: Haptic actuators
8.5.9.Example application: Haptic gloves
8.6.Temperature and humidity sensors
8.6.1.Printed temperature sensors
8.6.2.InFlect thermistor
8.6.3.Printed thermistors enable new designs
8.6.4.Humidity sensor with carbon nanotubes
8.6.5.Application to biometric sensing
8.6.6.Wireless humidity sensors
8.7.Printed Gas Sensors
8.7.1.Printed metal oxide gas sensors
8.7.2.Electrochemical gas sensor
8.7.3.Printed electrochemical gas sensors
8.8.Printed, Organic Photodetectors / Image Sensors
8.8.1.Printed organic photodetectors
8.8.2.Which wavelength can be detected?
8.8.3.First production line for OPD
8.8.4.What can you do with organic photodetectors?
8.8.5.Applications and prototypes
8.8.6.Large area image sensors
8.8.7.Applications of large area image sensors
8.8.8.Company profiles related to this chapter
9.LOGIC AND SYSTEMS
9.1.Types of Flexible or Printed Transistor Circuits
9.2.Why Print TFTs?
9.3.Semiconductor Choices Compared
9.4.But challenges persist...
9.5.Semiconductor choices
9.6.Incumbent TFT technologies- silicon based
9.7.Metal Oxide Semiconductors
9.8.Metal Oxide production process
9.9.IGZO enables large sized OLED TVs
9.10.But can Metal Oxide Semiconductors be printed?
9.11.Evonik's solution processible metal oxide
9.12.Latest progress with iXensic
9.13.Temperatures well below 350C
9.14.And even at room temperature with deep UV annealing
9.15.Organic semiconductors
9.16.OTFT Mobility hype: reality check
9.17.All printed TFTs
9.18.JAPERA all printed TFT
9.19.S2S automatic printed OTFT
9.20.Roll-to-roll printed organic TFTs
9.21.Merck's Organic TFT
9.22.Carbon nanotubes and graphene transistors
9.23.TFT Active Matrix (AM) arrays for displays and sensors
9.24.Three TFT technologies for flexible displays
9.25.TFT technologies for flexible displays
9.26.Challenges with Organic TFTs
9.27.AM electrophoretic display backplanes
9.28.Flexible LCDs
9.29.Organic LCD (FlexEnable)
9.30.JDI
9.31.Flexible LCDs: Conclusions
9.32.Use of TFT arrays in X-ray detectors
9.33.Next generation X-ray sensors: flexible
9.34.Advantage of organic TFT
9.35.Flexible fingerprint sensors
9.36.Other sensors with flexible TFTs: electronic skin
9.37.Flexible or printed transistors for logic, creating smart systems
9.38.Mediocre TFTs can do many functions
9.39.Current work in developing flexible transistor RFID and Smart Packaging
9.40.IMEC / Holst Centre Roadmap
9.41.Benefits of flexible logic
9.42.Logic Based Systems
9.43.Lessons from the Silicon Chip: need for modularity
9.44.Thin, flexible 'NFC' ICs come to market for simple wireless barcodes
9.45.Logic and Smart System Forecast 2020-2030 $ millions
9.46.Company profiles related to this chapter
10.PRINTING TECHNOLOGIES, CURING, SINTERING AND SYSTEM ASSEMBLY
10.1.Printing Technologies
10.1.1.Value Chain for Printing in Electronics
10.1.2.Screen Printing Dominates in Commercial Devices
10.1.3.Screen Printing
10.1.4.Inkjet Printing
10.1.5.Aerosol Jet
10.1.6.Flexo Printing
10.1.7.Gravure Printing
10.1.8.Slot Die Coating
10.1.9.Main parameters to cosnider when printing functional ink
10.1.10.Printing Technique Comparison
10.1.11.Printed Performance Characteristics
10.2.Curing / Sintering
10.2.1.Integral part of the layer deposition process: Drying and curing of printed layers
10.2.2.Principle of Vertical Ovens
10.2.3.Curing profiles of traditional pastes
10.2.4.Performance levels
10.2.5.Pulse of light: Photo-sintering
10.2.6.Photo-sintering
10.3.System Assembly
10.3.1.Design Options for Printed Electronics
10.3.2.Component Attach Options
10.3.3.Component Attach Example
10.3.4.System Encapsulation
10.3.5.Automation for Manufacture
10.3.6.Roll to Roll Assembly
11.COMPANY PROFILES
11.1.List of Company Profiles - alphabetical
11.1.1.ACREO
11.1.2.Agfa
11.1.3.Alta devices
11.1.4.Applied materials
11.1.5.Armor
11.1.6.Asada Mesh
11.1.7.BASF
11.1.8.Bebop
11.1.9.Blue Spark
11.1.10.Botfactory
11.1.11.CDT/Sumitomo Chemical
11.1.12.Ceradrop
11.1.13.Clariant
11.1.14.Clearink
11.1.15.Coatema
11.1.16.CPI
11.1.17.Dupont
11.1.18.Dycotec
11.1.19.E Ink
11.1.20.Enfucell
11.1.21.Fujifilm
11.1.22.Heliatek
11.1.23.Henkel
11.1.24.Hereaus
11.1.25.Imprint
11.1.26.Interlink
11.1.27.Isorg
11.1.28.Jenax
11.1.29.Kateeva
11.1.30.Molex
11.1.31.Merck group
11.1.32.Meyer Burger
11.1.33.Nagase
11.1.34.Notion Systems
11.1.35.Novacentrix
11.1.36.NRC
11.1.37.Optomec
11.1.38.Oxford PV
11.1.39.PARC
11.1.40.PragmatIC
11.1.41.PST sensors
11.1.42.Royole
11.1.43.Smartkem
11.1.44.Sun Chemical
11.1.45.Tactotek
11.1.46.Tangio
11.1.47.Thinfilm electronics
11.1.48.Ubiquitous energy
11.1.49.Voltera
11.1.50.VTT
11.1.51.XTPL
11.2.List of Company Profiles - by chapter
 

报告统计信息

幻灯片 620
Companies 50
预测 2030
 
 
 
 

Subscription Enquiry