All IDTechEx Research reports : Thermal Management

Ten-year forecast covering eight market sectors, including gas sensing, pressure sensing and moisture detection for electric vehicle and energy storage system applications. Remote monitoring and live control technologies included.

Fire protection, thermal management, corrosion protection, dielectric, EMI shielding, self-healing PFAS-free coatings for EV battery, automotive, aerospace, oil & gas, data centers, construction, telecommunications, electronics

超轻型先进纳米多孔材料，包括聚合物、二氧化硅和复合单体、颗粒、厚层及其他形式，在电动汽车防火、油气隔热、能源、工业、航空航天等领域得到应用。

模块化架构、供应链弹性、异构集成、先进封装、先进互连和通信、热管理解决方案

Global markets for electric vehicle motors. Motor technology, materials, rare-earth reduction, axial flux, in-wheel, thermal management, benchmarking, and suppliers. Granular regional forecasts. Cars, micro-EVs, buses, vans, and trucks.

用于电动汽车、公共汽车、货车、卡车及微移动工具的防火和热失控限制材料。这些材料包括陶瓷、云母、气凝胶、泡沫、密封剂、涂料、聚合物以及相变材料等。

高性能计算、Exascale超级计算机、人工智能芯片、中央处理器（CPU）、图形处理器（GPU）和加速器、内存、存储、半导体先进封装、网络、互连和热管理。

对航天器再入大气层时使用的热防护罩（TPS）及隔热板进行颗粒技术评估，涵盖瓦片式、烧蚀式和可膨胀式等多种类型，并提供十年市场预测。

氦在半导体制造、泄漏测试（如电动汽车电池）、低温学（MRI、NMR、量子计算）和航空航天中的关键应用，以及替代品采用趋势、回收技术和10年预测

Automotive industry, logistics, home-use, key players and suppliers, AI chip, battery, actuator, motor, screw, tactile sensor, camera, bearing, LiDAR, PEEK materials, cost analysis of components, 10-year volume and market size forecast

Covering Power Electronics forecasts in US$ and GW for 2026-2036, including the inverter, onboard charger, and DC-DC converter. Supply chain analysis of Si IGBTs and SiC MOSFETs. Automotive GaN companies and integrated Power Electronics.

电力、太阳能、风能、地热能、核能、燃料电池、电池、能源效率（热能、IT、电力）、碳信用额、绿色混凝土、制造业、范围2和范围3减排以及市场前景的脱碳

在工业加热过程中的脱碳和更广泛市场（LDES、CSP）的热能储存（TES）分析，包括技术（熔盐、固态、PCM、电热、热化学）、参与者、项目、措施 & 预测。

Material demand, benchmarking, market trends, TIM1/TIM1.5/TIM2, TIMs in 5G, EV batteries and power electronics, semiconductor packaging, space/satellite, data centers, ADAS, consumer electronics, TIM fillers, 10-year forecast by industry.

Ten-year TIM1/TIM1.5 forecast for advanced semiconductor packaging (ASP) split by graphene, liquid metal, thermal gel, and indium foil. 10-year forecast for microfluidic cooling. Detailed analysis on thermal and power management for ASP.

Granular ten-year forecast for data center cooling technologies and components, including air cooling, single-phase/two-phase D2C/immersion cooling and their associated components. Comprehensive analysis of TIM2 for data center components.

Thermal management of Li-ion batteries, electric motors, power electronics, and passenger cabin. Trends and market forecasts for thermal management materials, fluids, technologies, and strategies.

Si IGBT、SiC MOSFET和GaN的细粒度TIM、管芯连接和衬底连接的十年市场预测。逆变器和电机的液体冷却系统预测。电源模块供应商概况和供应链分析。

10 year BESS thermal management and fire safety system and materials forecasts, assessment of regulations, passive and active technologies, and developer approaches to fire safety across grid-scale, C&I and residential BESS sectors.