All IDTechEx Research reports : Semiconductors, Computing & AI

3D电子产品市场，包括3D表面电子产品、模内电子产品、全增材制造3D电子产品、金属化方法、增材制造电子材料和应用

6G, sub-THz, NTNs, Reconfigurable Intelligent Surfaces (RIS), Distributed MIMO, Semiconductors for 6G, antenna packaging, low-loss materials, heterogeneous integration.

异质集成、AI（人工智能）、HPC（高性能计算）、数据中心、半导体封装市场预测、封装天线、2.5D封装、3D封装、扇出型封装、FOWLP（扇出型晶圆级封装）、FOPLP（扇出型面板级封装）、Si-Via（硅通孔）、玻璃封装、共封装光学元件、RDL（再分配层）、混合键合

图形处理单元（GPUs）、中央处理单元（CPUs）、定制化AI专用集成电路（ASIC）及其他各类AI加速器，以及参与者分析、技术、趋势、供应链以及预测分析等。

Ten-year forecasts of edge AI chips for different applications: automotive, consumer electronics, humanoid robots, predictive maintenance. Supply chain analysis, including CPUs, NPUs, GPUs. Autonomous driving, intelligent cockpits, AI smartphones, AI PCs.

在电池生命周期内，未来十年里人工智能将在五大应用领域发挥重要作用，包括技术基准设定以及数据驱动的市场预测。超过20家公司简介。

AiP、天线、半导体先进封装、衬底技术、5G、6G、相控阵、扇出、倒装芯片、玻璃、LTCC、HDI、EMI、波束成形

用于自动驾驶汽车 & 机器人出租车的雷达，远程雷达，近程雷达，雷达涂层，4D成像雷达，高通道计数雷达，半导体雷达技术，波导天线，汽车雷达预报

Autonomous consumer cars by SAE level (L1, L2, L2+, L3, L4), Level 4 driverless robotaxis, commercial robotaxi services, autonomous driving rules and regulations, autonomous driving software, ADAS software

Granular 10-year forecasts on BESS for data centers and C&I applications. Analyses on players, key projects, applications, battery storage technology trends & benchmarking, LFP Li-ion costs & manufacturing. Insights from dozens of primary interviews.

模块化架构、供应链弹性、异构集成、先进封装、先进互连和通信、热管理解决方案

CPO, optical interconnects, optical IO, data center, switches, AI, advanced semiconductor packaging, 2.5D, 3D, optical engine, EIC, PIC

协作机器人（cobots）、移动作业机器人、末端效应器、传感器、抓手、汽车制造、拣选和放置、码垛、包装、食品和饮料、电子、电动汽车锂离子电池

Market for secondary source critical material extraction technology, critical material recovery technology, rare earth recycling, lithium-ion battery technology metal recovery, critical semiconductor recovery, platinum group metal recovery

远程健康、远程医疗、远程患者监测、数字治疗、消费者健康可穿戴设备和医疗诊断中的人工智能

10年详细预测及市场规模评估——本报告涉及HBM、QLC固态硬盘、下一代硬盘（HAMR、MAMR）以及用于AI、HPC、数据中心、云、边缘、物联网和嵌入式应用程序的新兴存储器（MRAM、RRAM、FeRAM、PCM）的发展。

电磁干扰 (EMI) 屏蔽的材料、方法和应用，包括封装级屏蔽、喷镀、印刷、导电油墨、MXene、纳米碳、异质集成、系统级封装、分区化。

涵盖可穿戴电子设备、原型汽车电子产品和智能包装等应用，以及导电油墨、柔性集成电路、组件附着材料/方法和 R2R 制造等基础技术。

Glass in semiconductors technology benchmarks & analysis, supply-chain deep dive, market forecasts across carrier, panel, IC-substrate, interposer, IPD, RF-MEMS & photonic glass segments, challenges, opportunities and adoption outlook

高性能计算、Exascale超级计算机、人工智能芯片、中央处理器（CPU）、图形处理器（GPU）和加速器、内存、存储、半导体先进封装、网络、互连和热管理。

氦在半导体制造、泄漏测试（如电动汽车电池）、低温学（MRI、NMR、量子计算）和航空航天中的关键应用，以及替代品采用趋势、回收技术和10年预测

Automotive industry, logistics, home-use, key players and suppliers, AI chip, battery, actuator, motor, screw, tactile sensor, camera, bearing, LiDAR, PEEK materials, cost analysis of components, 10-year volume and market size forecast

未来十年六种舱内传感的粒度容积和市场规模预测。舱内传感的监管要求和传感器采用路线图概述。

Low-loss materials for 5G, 6G, automotive radars, high-speed digital, with market assessment, player overview, trends, detailed benchmarks, and forecasts.

2.5D技术、3D技术、半导体先进封装、RDL（重布线层）、高性能介电材料、铜-铜混合键合技术、EMC（电磁兼容性）、MUF（多层膜结构）、中介层设计、玻璃基底材料、工艺、FOWLP（晶圆级扇出型封装）、FOPLP（面板级扇出型封装）、管芯堆叠技术、有机材料以及无机材料等

20-year forecasts for materials opportunities in quantum computing, quantum sensing, and quantum communications. Technologies, key players, supply chain dynamics for superconductors, photonics, PICs, nanomaterials, and diamond for quantum applications.

在材料科学领域，以数据为中心的设计和发现方法。在数据基础设施、机器学习和人工智能方面取得显著进展。参与者简介、技术进步、市场前景、战略方法。

涉及可重构智能表面、雷达波束形成技术、抗反射涂层、激光眩光保护方案、高精度金属传感器以及激光雷达波束控制等领域。2024年-2034年收入、表面积和单位预测

Emerging MEMS innovations in inertial sensing, gravimetry, and speaker technology. Granular 10-year market forecasts with player coverage, performance benchmarking, and competing technologies.

SAE 2级至3级市场的私有ADAS车辆、自动驾驶规则 & 法规、ADAS解决方案供应商、Soc制造商、ADAS汽车传感器套件、使能技术。

Covering Power Electronics forecasts in US$ and GW for 2026-2036, including the inverter, onboard charger, and DC-DC converter. Supply chain analysis of Si IGBTs and SiC MOSFETs. Automotive GaN companies and integrated Power Electronics.

Ten-year power electronics market forecasts, including forecasts for electric vehicles, data centers, and renewable energy. Detailed comparison of silicon, silicon carbide, gallium nitride, and ultra-wide bandgap semiconductors.

量子随机数生成器、量子密钥分发、地面光网络和天基卫星量子网络用于下一代密码安全

20 year forecasts for quantum computing: superconducting, photonic, silicon spin, neutral atom, trapped ion, diamond defect, annealers, topological qubits. Infrastructure, applications, and materials for quantum computing, quantum and AI.

Key players, technologies, applications, materials, and 20-year granular quantum sensor market forecasts for: atomic clocks, quantum magnetic field sensors, gravimeters, gyroscopes, accelerometers, quantum RF, and single photon detectors.

全面概述量子计算市场、量子传感市场及量子通信市场的技术、应用、趋势与机遇，同时阐述量子材料发展的总体趋势。

The complete analysis of the global RFID industry.

电动车和自动驾驶车辆、电池管理系统 (BMS)、微控制器 (MCU)、芯片系统 (SoC)、ADAS、LiDAR、雷达、5G 连接领域的半导体材料趋势。硅 (Si)，氮化镓 (GaN)，碳化硅 (SiC)。

Compound Semiconductors, Transceivers, Indium Phosphide/InP PICs, Thin-Film Lithium Niobate/TFLN PICs, PICs for Quantum, Light-based Interconnects, Manufacturing, Materials, Co-Packaged Optics, MicroLED

SDVs, Connected and Autonomous Vehicles (CAVs), In-Car AI Assistants, V2X, Autonomy as a Service, Connected Vehicles, E/E Architecture, Intelligent Transportation Systems (ITS-G5), DSRC, C-V2X, Features as a Service, ADAS

电力、太阳能、风能、地热能、核能、燃料电池、电池、能源效率（热能、IT、电力）、碳信用额、绿色混凝土、制造业、范围2和范围3减排以及市场前景的脱碳

涵盖可持续电子、绿色电子、材料和制造印刷电路板（PCB）、集成电路（IC）、电子废物、能源效率、水管理和电子立法。

Material demand, benchmarking, market trends, TIM1/TIM1.5/TIM2, TIMs in 5G, EV batteries and power electronics, semiconductor packaging, space/satellite, data centers, ADAS, consumer electronics, TIM fillers, 10-year forecast by industry.

Ten-year TIM1/TIM1.5 forecast for advanced semiconductor packaging (ASP) split by graphene, liquid metal, thermal gel, and indium foil. 10-year forecast for microfluidic cooling. Detailed analysis on thermal and power management for ASP.

Granular ten-year forecast for data center cooling technologies and components, including air cooling, single-phase/two-phase D2C/immersion cooling and their associated components. Comprehensive analysis of TIM2 for data center components.

Si IGBT、SiC MOSFET和GaN的细粒度TIM、管芯连接和衬底连接的十年市场预测。逆变器和电机的液体冷却系统预测。电源模块供应商概况和供应链分析。