All IDTechEx Research reports : Semiconductors, Computing & AI

Market for 3D electronics, covering electronics on 3D surfaces, in-mold electronics, fully additive 3D electronics, metallization methods, additive electronics materials, and applications.

6G, sub-THz, NTNs, Reconfigurable Intelligent Surfaces (RIS), Distributed MIMO, Semiconductors for 6G, antenna packaging, low-loss materials, heterogeneous integration.

Heterogeneous Integration, AI, HPC, Data Centers, Semiconductor Packaging Market Forecast, Antenna in Package, 2.5D, 3D, Fan-Out, FOWLP, FOPLP, Through-Si-Via, Glass Packaging, Co-Packaged Optics, RDL (Redistribution Layer), Hybrid Bonding

Graphics processing units (GPUs), central processing units (CPUs), custom AI ASICs, and other AI accelerators, with player analysis, technologies, trends, supply chain, and forecasts

Ten-year forecasts of edge AI chips for different applications: automotive, consumer electronics, humanoid robots, predictive maintenance. Supply chain analysis, including CPUs, NPUs, GPUs. Autonomous driving, intelligent cockpits, AI smartphones, AI PCs.

Ten-year forecasts across five application areas for AI throughout the battery lifecycle, including technology benchmarking and data-driven market predictions. Over 20 company profiles.

AiP, Antenna, Advanced Semiconductor Packaging, Substrate technology, 5G, 6G, Phased array, fan-out, flip-chip, glass, LTCC, HDI, EMI, Beamforming

Radars for autonomous cars & robotaxis, long-range radar, short-range radar, radar cocooning, 4D imaging radar, high-channel-count radars, semiconductor technologies for radar, waveguide antenna, automotive radar forecasts

Autonomous consumer cars by SAE level (L1, L2, L2+, L3, L4), Level 4 driverless robotaxis, commercial robotaxi services, autonomous driving rules and regulations, autonomous driving software, ADAS software

Granular 10-year forecasts on BESS for data centers and C&I applications. Analyses on players, key projects, applications, battery storage technology trends & benchmarking, LFP Li-ion costs & manufacturing. Insights from dozens of primary interviews.

Modular architecture, supply chain resilience, heterogeneous integration, advanced packaging, advanced interconnects and communications, thermal management solutions

CPO, optical interconnects, optical IO, data center, switches, AI, advanced semiconductor packaging, 2.5D, 3D, optical engine, EIC, PIC

Collaborative robots (cobots), mobile manipulators, end-effectors, sensors, grippers, automotive manufacturing, picking and placing, palletizing, packaging, food and beverage, electronics, EV Li-ion battery

Market for secondary source critical material extraction technology, critical material recovery technology, rare earth recycling, lithium-ion battery technology metal recovery, critical semiconductor recovery, platinum group metal recovery

Telehealth, telemedicine, remote patient monitoring, consumer health wearables, digital therapeutics, & artificial intelligence in medical diagnostics

10-year granular forecast and market sizing, this report covers advancements in HBM, QLC SSDs, next-gen HDDs (HAMR, MAMR), and emerging memory (MRAM, RRAM, FeRAM, PCM) for AI, HPC, data centers, cloud, edge, IoT, and embedded applications.

Materials, methods and applications for electromagnetic interference (EMI) shielding including package-level shielding, sputtering, printing, conductive inks, MXenes, nanocarbons, heterogeneous integration, system-in-package, compartmentalization.

Covering applications such as wearable electronics, prototyping automotive electronics, and smart packaging, along with underlying technologies including conductive inks, flexible ICs, component attachment materials/methods and R2R manufacturing.

Glass in semiconductors technology benchmarks & analysis, supply-chain deep dive, market forecasts across carrier, panel, IC-substrate, interposer, IPD, RF-MEMS & photonic glass segments, challenges, opportunities and adoption outlook

High-Performance Computing, Exascale Supercomputers, AI Chips, CPUs, GPUs and Accelerators, Memory, Storage, Advanced Semiconductor Packaging, Networking, Interconnects and Thermal Management.

Key applications of helium in semiconductor manufacturing, leak testing (e.g. EV batteries), cryogenics (MRI, NMR, quantum computing), and aerospace, with trends in adoption of substitutes, reclamation technologies, and 10-year forecasts

Automotive industry, logistics, home-use, key players and suppliers, AI chip, battery, actuator, motor, screw, tactile sensor, camera, bearing, LiDAR, PEEK materials, cost analysis of components, 10-year volume and market size forecast

Granular ten-year volume and market size market forecasts by 6 in-cabin sensors. Overview of regulatory requirements and roadmap of sensor adoption for in-cabin sensing.

Low-loss materials for 5G, 6G, automotive radars, high-speed digital, with market assessment, player overview, trends, detailed benchmarks, and forecasts.

2.5D, 3D, advanced semiconductor packaging, RDL, dielectric material, Cu-Cu hybrid bonding, EMC, MUF, interposer, glass, processes, FOWLP, FOPLP, die stacking, organic, inorganic

20-year forecasts for materials opportunities in quantum computing, quantum sensing, and quantum communications. Technologies, key players, supply chain dynamics for superconductors, photonics, PICs, nanomaterials, and diamond for quantum applications.

Data-centric approaches for design and discovery within materials science. Notable advancements in data infrastructures, machine learning, and AI. Player profiles, technology progression, market outlook, strategic approaches.

Covering Reconfigurable Intelligent Surfaces, radar beamforming, anti-reflection coatings, laser glare protection, metalenses and LiDAR beam-steering. Forecasts of revenue, surface area, and units 2024-2034

Emerging MEMS innovations in inertial sensing, gravimetry, and speaker technology. Granular 10-year market forecasts with player coverage, performance benchmarking, and competing technologies.

Private ADAS Vehicles in SAE Level 2 to Level 3 Market, autonomous driving rules & regulations, ADAS Solution Providers, Soc Manufactures, Sensor Suite for ADAS Cars, enabling technologies.

Covering Power Electronics forecasts in US$ and GW for 2026-2036, including the inverter, onboard charger, and DC-DC converter. Supply chain analysis of Si IGBTs and SiC MOSFETs. Automotive GaN companies and integrated Power Electronics.

Quantum random number generators, quantum key distribution, terrestrial optical networks and space-based satellite quantum networks for the next generation of cryptographic security

20 year forecasts for quantum computing: superconducting, photonic, silicon spin, neutral atom, trapped ion, diamond defect, annealers, topological qubits. Infrastructure, applications, and materials for quantum computing, quantum and AI.

Key players, technologies, applications, materials, and 20-year granular quantum sensor market forecasts for: atomic clocks, quantum magnetic field sensors, gravimeters, gyroscopes, accelerometers, quantum RF, and single photon detectors.

Comprehensive overview of the technologies, applications, trends, and opportunities in the quantum computing market, quantum sensing market, and quantum communications market as well as the overarching trends in quantum material development.

The complete analysis of the global RFID industry.

Semiconductor materials trends within electric and autonomous vehicles, battery management system (BMS), microcontrollers (MCU), Systems on chips (SoCs), ADAS, LiDAR, radar, 5G connectivity. Silicon (Si), Gallium Nitride (GaN), Silicon Carbide (SiC).

Compound Semiconductors, Transceivers, Indium Phosphide/InP PICs, Thin-Film Lithium Niobate/TFLN PICs, PICs for Quantum, Light-based Interconnects, Manufacturing, Materials, Co-Packaged Optics

SDVs, Connected and Autonomous Vehicles (CAVs), In-Car AI Assistants, V2X, Autonomy as a Service, Connected Vehicles, E/E Architecture, Intelligent Transportation Systems (ITS-G5), DSRC, C-V2X, Features as a Service, ADAS

Decarbonization of power, solar, wind, geothermal, nuclear, fuel cells, batteries, energy efficiency (thermal, IT, electrical), carbon credits, green concrete, manufacturing, scope 2 and scope 3 emissions reductions, and market outlook

Covering sustainable electronics, green electronics, materials and manufacturing printed circuit boards (PCBs), integrated circuits (ICs), e-waste, energy efficiency, water management, and electronics legislation.

Material demand, benchmarking, market trends, TIM1/TIM1.5/TIM2, TIMs in 5G, EV batteries and power electronics, semiconductor packaging, space/satellite, data centers, ADAS, consumer electronics, TIM fillers, 10-year forecast by industry.

Ten-year TIM1/TIM1.5 forecast for advanced semiconductor packaging (ASP) split by graphene, liquid metal, thermal gel, and indium foil. 10-year forecast for microfluidic cooling. Detailed analysis on thermal and power management for ASP.

Granular ten-year forecast for data center cooling technologies and components, including air cooling, single-phase/two-phase D2C/immersion cooling and their associated components. Comprehensive analysis of TIM2 for data center components.

Granular ten-year TIM, die-attach and substrate-attach market forecasts for Si IGBT, SiC MOSFETs, and GaN. Liquid Cooling forecast for inverters and motors. Power module suppliers' profile and supply chain analysis.