Advanced Materials

Advanced Materials

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2009
3 Dec 2009

Printed Programmable Logic

Nano ePrint Ltd, UK, United Kingdom
3 Dec 2009

Low cost, high performance carbon nanomaterials films for energy, electronics and beyond

Canatu Oy, Finland, Finland
3 Dec 2009

Flexible Inorganic Optoelectronic Devices on Thin Plastic Sheets via Multilayer Transfer Printing

University of Illinois, USA, United States
3 Dec 2009

Inkjet Printing of Printed Electronic Applications

PixDro b.v., Netherlands, Netherlands
3 Dec 2009

Continuous Roll-to-Roll Nanoimprinting and Nano-inscribing with Applications to Organic Solar Cells

University of Michigan, USA, United States
3 Dec 2009

Carbon Nanotube Memory and Electronics

Nantero, USA, United States
3 Dec 2009

Functional Organic Materials in Electronic Devices

Polyera Corporation, USA, United States
3 Dec 2009

Printing: an Enabler for Sensors & Media Security Applications

GE Global Research Center, USA, United States
3 Dec 2009

Work with Printed Nanotubes for Super Capacitors

Stanford University, USA, United States
3 Dec 2009

Flexo Printing Technology for Printed Electronics Applications

Asahi Kasei Chemicals Corporation, Japan, Japan
3 Dec 2009

Graphene Inks for Printed Electronics

Vorbeck Materials, USA, United States
3 Dec 2009

The State of Oregon's Renewable Energy Policies

Oregon Business Development Department, USA, United States
3 Dec 2009

Recent Development in ORGACONTM Formulations and Ink for Printable Electrodes

Agfa Materials, Belgium, Belgium
3 Dec 2009

Printed Inorganic Solar Cells

Solexant Corp., United States, United States
3 Dec 2009

Jet-Printing: From Drops to Electronic Devices

Palo Alto Research Center (PARC), USA, United States
3 Dec 2009

Developments with Hybrid Graphene-Carbon Nanotube Material (G-CNT)

University of California, Los Angeles (UCLA), USA, United States
3 Dec 2009

Advances in CLEVIOS™ PEDOT/PSS Coatings and Oligothiophene Semiconductors for Printed Electronics

H.C. Starck Inc, USA, United States
3 Dec 2009

Applications in Printed Electronics

Rogers Corporation, USA, United States
3 Dec 2009

Slot Die Coating

Mitsubishi Materials Corporation, Japan, Japan
3 Dec 2009

Turn-Key-Production Line for High Efficient and Low Cost CIGS Thin Film Modules

centrotherm photovoltaics AG, Germany, Germany