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19 Dec 2023

Future Automotive Technologies 2024-2034: Applications, Megatrends, Forecasts

IDTechEx Report: Dr James Jeffs, Dr James Edmondson, James Falkiner and Yulin Wang
24 Nov 2023

In-Cabin Sensing 2024-2034: Technologies, Opportunities and Markets

IDTechEx Report: Yulin Wang and Dr James Jeffs
5 Oct 2023

Automotive Radar 2024-2044: Forecasts, Technologies, Applications

IDTechEx Report: Dr James Jeffs
13 Mar 2023

Pontosense — Radars for In-Cabin Monitoring

Vayyar designs radar chips and has been working on in-cabin technologies for some time.
30 May 2022

Spartan Radar: Radar-Enhancing Software

Vayyar is an Israeli radar chip start-up with technologies designed for in-cabin ADAS and AV applications.
11 Mar 2022

Smart Radar System: Radars for Multiple Industries

Vayyar is very well funded with more than US$180 million as of its last round of funding. Vayyar is developing its own radar chip and aiming at applications including the smart home and automotive. They are also targeting the elderly market and have fall detection applications. Vayyar's funding, self-designed chip, and application portfolio makes for thorough competition for SRS. Since SRS is using a chip from NXP (who have high quality mass production capabilities), it may have an advantage in terms of ease of commercialisation.
18 Aug 2020


Vayyar was established in 2011 in Israeli. It has thus far raised $188M Vayyar is offering a radar chip with upto 72Tx and 72Rx.
30 Jan 2020


IDTechEx met with Vayyar at CES 2020. Vayyar has developed a '4D' radar system that tracks location of objects in three dimensions plus their movement.
3 Dec 2019


Vayyar was established in 2011 in Israeli. It has thus far raised $79M
25 Oct 2019

New IDTechEx Research Report: Radars 2020-2030

Radars evolve towards 4D imaging with improved resolution and object detection AIs, surpassing $15Bn as forecast by IDTechEx Research in their latest report on the topic, covering ADAS and autonomous driving, 4D imaging radars, semiconductor technology, low insertion loss materials, advanced packaging, deep learning, object detection/ classification/ tracking.