Dyson

Upcoming Webinar - Smart Packaging: Emerging Drivers and Technologies

Wednesday 17 May 2023 - Multiple smart packaging technologies, including embedded lighting, wireless energy harvesting, flexible batteries, and low-cost sensing; Case studies showing the deployment and adoption of different types of smart packaging, such as electronic blister packs for pharmaceuticals; A roadmap for the adoption of different smart packaging technologies, and assessment of technology gaps and other adoption barriers

Smart Packaging Will Become a US$2.6 Billion Market by 2033

The role of packaging has evolved over time, from simply protecting and identifying the product to driving sales via enticing graphics. Smart packaging is the latest iteration, utilizing technology including sensors, indicators, and wireless communication to enhance user engagement, product quality, and supply chain efficiency.

Opportunities for Thin Film and Flexible Photovoltaics

This presentation was given by IDTechEx Principal Technology Analyst Dr Matthew Dyson at innoLAE 2023.

Printed Electronics for Additive Digital Manufacturing

Can electronics manufacturing be reconfigured for our digital, environmentally-conscious age? Dr Matthew Dyson, shares some insights on the topic in this complimentary whitepaper.

Join Our Upcoming Webinar on In-Mold Electronics

Thursday 23 February 2023 - Opportunities for Integrated Functionality. In this webinar Dr Matthew Dyson, a Principal Technology Analyst at IDTechEx, will discuss the following topics: - The status of IME and competing approaches for creating functional and decorative interfaces across multiple application sectors. - The challenges and benefits associated with functionality integration, and how the value proposition of IME is likely to grow over time. - IME specific material requirements, especially for conductive inks. - A roadmap for IME adoption, segmented by industry.

Webinar - Additive Electronics Manufacturing: Innovations & Prospects

Friday 10 February 2023 - Status and prospects of competing analogue and digital manufacturing methods for printed electronics; Technical discussion of emerging digital manufacturing methodologies; Evaluation of the benefits and challenges of adopting high throughput R2R manufacturing; and Innovations in component placement and attachment that will facilitate manufacturing of FHE.

Printed Electronics Enables R2R, Additive & Digital Manufacturing

Can electronics manufacturing be reconfigured for our digital, environmentally-conscious age? IDTechEx's new report, "Manufacturing Printed Electronics 2023-2033", explores a wide range of manufacturing innovations that will enable additive, digital, and higher throughput electronics production across many length scales.

Plastogaz

Plastogaz is an EPFL spin-out company that specializes in the advanced recycling of plastic waste using a catalytic hydrocracking process. IDTechEx spoke with Dr Felix Bobbink (Co-founder and CEO).

Flexible Hybrid Electronics: Status and Roadmap

This presentation was given by IDTechEx Senior Technology Analyst Dr Matthew Dyson at the SEMI/FlexTech FHE Masterclass.