Flexible Hybrid Electronics is a rapidly emerging approach to electrical circuit manufacture. Aiming to combine the low weight and flexibility of printed electronics with the processing capacity of integrated circuits, it represents an amalgamation of these two manufacturing ecosystems to meet application requirements. This presentation will review the fundamental enabling technologies, such as flexible ICs and low temperature soldering, outline roadmaps to overcome the remaining challenges. The extensive potential applications for FHE, spanning from wearable healthcare to smart packaging that aspires to meet commercial requirements, will be discussed, and market forecasts for adoption presented.
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