Flexible barrier technologies: a brief review of technology options
25 June 2015 | Worldwide by Dr Harry Zervos
Back in 2014, we witnessed the launch of the first displays deposited on flexible substrates, and the first efforts to encapsulate them. There are significant differences in the encapsulation techniques utilized by each of the companies commercializing flexible electronics. These differences signify the variety of technologies available, in terms of deposition as well as material options for the barrier films, some of which are discussed in this article
Login or Register You are not logged in. For existing users, please login to learn more about this premium content. For new users, please register with idtechex.com or use the links below for more details about premium content from IDTechEx.
Subscription Benefits
A subscription from IDTechEx allows you to access our full body of research content on emerging technologies, including market, technology and company data, alongside direct engagement with our expert analysts.
Subscription content includes:
Subscription content includes:
- Market research reports
- Forecasts
- Premium articles
- Company profiles
- Industry digests
- Webinars
- Innovation maps
- Event summaries and write-ups