Thermal Management Reports and Subscriptions

This report identifies the key and emerging thermal management and fire protection materials and systems used for BESS safety. Analysis of the regulatory landscape, along with assessment of market players, helps to formulate granular ten-year forecasts for the global BESS fire safety market.

This report covers in-depth technical analysis of different cooling technologies for data centers, including air cooling, single-phase direct-to-chip cooling, two-phase direct-to-chip cooling, single-phase immersion, two-phase immersion, and microfluidic cooling. The report covers historic data from 2022 to 2024 and forecasts the market size (US$) and volume demand (units) for liquid cooling components for the next 10 years (2026-2036). The report also analyses thermal interface material (TIM2 and TIM1/TIM1.5) for data center components and projects their market size and area (m2) demand over the next 10 years. The report is one of the most comprehensive reports in the market, analysing different types of cooling technologies for advanced processors and data center applications. With significant investments in data centers, IDTechEx forecasts that the liquid cooling component market size for data centers will exceed US$4 billion by 2036.

This report provides an in-depth technical analysis of thermal interface materials (including TIM1/TIM2/TIM1.5) for EV batteries, power electronics, advanced semiconductor packaging, space and satellite technologies, data centers, EMI shielding, 5G, ADAS, and consumer electronics. 10-year granular area (m2), mass (kg), revenue (US$), and TIM unit price (US$) forecasts are given by application. The report covers recent developments in TIM fillers, high-performance TIMs, successful commercial uses, and historic TIM player acquisitions and partnerships. The report also identifies future TIM trends.

This report analyses thermal management approaches for electric vehicle batteries, motors, power electronics, and the vehicle as a whole. A deep dive is taken into OEM strategies, materials, fluids, and technologies. 10 year granular market forecasts are included segmented by technology.

This report provides a comprehensive overview of thermal challenges in advanced semiconductor packaging (ASP), covering power delivery evaluation for 2.5D and 3D ICs, identification of key thermal bottlenecks, assessment of emerging thermal interface materials, and analysis of advanced cooling technologies for next-generation packaging technologies. Coverage across different emerging TIM1 and TIM1.5 for ASP, historic market size data from 2021 to 2025 and a market forecast for TIM1 and TIM1.5 from 2026 to 2036 are all included, along with the market forecast for liquid and microfluidic cooling.

本报告提供了对航天器热防护罩的技术展望。基于传统和新兴的热防护罩技术，本报告评估了不同材料与设计。同时，结合空间探索需求，本报告识别了热防护技术的新兴应用机遇，最终形成面向2035年的市场展望。

尽管火灾发生率低于内燃机车，但消防安全对电动汽车而言至关重要，并带来了几个重大机遇。本报告探讨了相关法规、电池设计趋势，以及这些因素将如何影响陶瓷、云母、气凝胶、涂料、密封剂、泡沫、压缩垫、相变材料、聚合物等防火材料的应用。市场预测部分细分了材料和车辆类型，预测了年度大众需求和市场价值的变化。

本报告深入探讨了电动汽车（EV）电力电子设备所采用的热管理策略，涉及车规级功率半导体封装的热结构设计、管芯与衬底连接所使用的材料（如焊料、银烧结、铜烧结等），以及热界面材料和空气冷却、水冷却、油冷却的方法。报告中对SiC MOSFET、Si IGBT和GaN技术中使用的管芯连接、衬底连接和热界面材料（TIM）进行了详尽的技术分析。此外，本报告还提供了电动汽车电力行业TIM的市场预测，按照技术（Si、SiC、GaN）和组件（逆变器、车载充电器、DC-DC转换器）进行了细致分类。同时，报告中引入了一些商业应用实例。本研究报告依据2021年至2023年的历史市场数据，并结合2024年至2034年的未来预测，全面剖析了电动汽车电力电子行业的热管理现状。报告中强调了该领域的显著增长前景，并预测到2034年，TIM的总市值将超9亿美元。