Graphene Based Supercapacitors Fabricated Using Spray Coating :Recent Results And Short Term Perspectives (Graphene Europe 2017)

This contribution will deal with the fabrication of supercapacitors using a deposition technique based on spray-coating of carbon based nanomaterials. We will show the last results obtained developing electrodes, based on mixture of graphene/carbon nanofibers, but also specific electrolytes, ionic liquids, able to operate between -45+C and +105°C (application for avionics). We will also show which is our value chain in order to achieve the industrial fabrication in the next 3 years implementing this technique for roll-to-roll production.

Dr. Paolo Bondavalli is in charge of the transverse topic on nanomaterials at Thale Research and Technology. Presently his work is focused on the development of new materials (e.g. graphene, cnts, nanowires) for the new generation of electronics devices and for energy storage applications, memristor, electromagnetic shielding. Dr Bondavalli has received his Hdr in 2011, at Paris-Sud on a work on "devices based on random network of carbon nanotubes". During the last five years, he has participated, also as coordinator, in several EU projects (concerning CNTs, graphene, spintronics, energy) and ANR projects. He is involved in the Graphene Flagship initiative. He recently issued a book on Graphene ("Graphene and Related Materials: Properties and Applications" Ed Elsevier, pp 192, 2017).

Thales Group Competence Centre Microelectronics is Thales's industrial and technological competence centre for (micro)electronics packaging, interconnections and assemblies. Located in France, the site of Etrelles (Brittany) designs, engineers and manufactures high-added value electronics modules and systems dedicated to harsh environments or specific systems. With 600 skilled staff, 10000sq. m of industrial facilities of which 5700sq. m clean rooms, the GCC Microelectronics team performs pioneering work in electronic technologies to boost the performance and reliability of applications facing critical functional or packaging constraints. We provide innovative and robustified electronic solutions integrative of new generation materials and advanced interconnection and assembly processes.