Update
22 Sep 2023

Fraunhofer FEP
Fraunhofer FEP are one of many Fraunhofer institutes across Germany. This profile examines their recent work on image sensors that combine a silicon backplane with an organic light absorbing layer to extend the wavelength detection range into the SWIR region.
Included are:
8 Sep 2023

Wearable Quantum Sensors Measure Brain Activity While We Sleep & Move
New quantum sensors measuring brain activity have the potential to revolutionize our understanding of how humans respond to sleep, movement, diet, and aging.
Full profile interview
12 Jul 2023

EU Chips Act — SemiWise
Professor Asen Asenov has been a professor at the University of Glasgow's Department of Electrical Engineering for 32 years. He has a strong background in the semiconductor industry, with 42 years of industry experience. In 2010, he founded a successful startup called 'Gold Standard Simulations' (GSS), which focused on advanced CMOS simulation tools. GSS was later acquired by Synopsys in 2016, leading to the establishment of SemiWise in 2017. SemiWise specializes in areas like low-power CMOS modeling and simulation, providing semiconductor IP, device design consulting, software solutions, and training courses.
Additionally, Prof. Asenov is involved in UK chip initiatives and advises the Bulgarian government on the EU (European) Chips Act.
IDTechEx interviewed Prof. Asenov, discussing the EU Chips Act and the competition in the semiconductor industry in July 2023.
Update
9 Jun 2023

Fraunhofer IAP
The Fraunhofer Institute for Applied Polymer Research (Fraunhofer IAP) recently outlined its work on sintering of printed conductive structures by energy input using microwave irradiation in a webinar. The potential benefit is to enable sintering on thermally fragile substrates.
Full profile interview: SWOT
1 Jun 2023

Additive Electronics
Full profile interview
1 Jun 2023

OQmented
OQmented is a fabless developer of laser beam scanning (LBS) systems, focusing on displays for augmented reality (AR) devices and 3D sensing for consumer electronics. The Fraunhofer ISIT spinout uses hermetically sealed MEMS mirror systems enabling high resolution RGB augmented reality near to the eye displays or ultra-fast 3D depth scanning, ideally designed for mobile devices by achieving the lowest power consumption with its double resonant Lissajous scanning. The company is based in Itzehoe, Germany.
External press release
26 May 2023

Oxford PV sets new solar cell world record
Oxford PV, a pioneer in the field of next-generation solar cells, has set a new world record for the efficiency of a commercial-sized solar cell, marking a significant breakthrough in the drive towards a low-carbon global economy.
Full profile interview
20 Mar 2023

Wiferion: Wireless Charging for Industrial Electric Vehicles
Wiferion develops and provides contactless inductive wireless energy systems intended for industrial and mobile robotics applications. IDTechEx spoke to Mr Matthieu Ebert, Vice President of Wiferion North America, to learn more about Wiferion's technology, ahead of their official launch of the subsidiary in Chicago.
1 Mar 2023

Miniaturized Spectral Sensing: Making Lab Capabilities Affordable
Are you unsatisfied with the color reproduction of your smartphone camera? Would you like your phone or other household appliance to detect different materials or even assess the freshness of food? The emerging technology of miniaturized spectrometers and multispectral cameras holds the solution.
17 Feb 2023

Low-Loss Materials for 6G: Current Status and Future Direction
The next generation of telecoms technologies, 5G, is not fully deployed yet; in fact, the exciting high-frequency bands of mmWave 5G are not set to take off for another several years, according to IDTechEx forecasts.
25 Jan 2023

Promising Innovations in Emerging Image Sensors
The new IDTechEx report, "Emerging Image Sensor Technologies 2023-2033: Applications and Markets", explores a diverse range of image sensing technologies capable of resolutions and wavelength detection far beyond what is currently attainable.
Update
13 Dec 2022

Fraunhofer IZM
Fraunhofer IZM has developed a method of integrating flexible thinned silicon ICs within polyimide to produce a fully flexible hybrid circuit. IDTechEx caught up with the German research center at Electronica 2023.