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2021

N-Ink

N-Ink is an early-stage company that has developed an n-type organic transparent conductive ink, but is still establish a clear product-market fit.

Security Labels with Transparent Printed Electronics

Prismade has brought its PrismaID technology to a new level. The new solution aims to protect valuable and sensitive documents like cards, contracts or certificates with an easy-to-use security label and connect them to digital services. This innovative technology is a scalable B2B solution offered to businesses with a high need of authentication and discretion during document related processes.

Heraeus

Heraeus is a German based technology group. Heraeus electronics, an internal branch of the company, produces a number of materials for electronics attachment and packaging. Thomas Lynch, Technology Analyst at IDTechEx, spoke to Mark Challingsworth, the Global Head of Marketing at Heraeus Electronics about the company's worth with Electrically conductive adhesives (ECAs).

Sun Chemical

2020

Desirable Metals for 3D Printing Near Market Readiness

Despite a temporary setback owing to the COVID-19 pandemic, the market for 3D printing of metals is expected to see a significant rise over the next decade. Within that, it is anticipated that most of the revenue will be attributed to material sales.

Heraeus: CucorAl Plus

At the recent ChargedEVs event, Heraeus demonstrated a new material for interconnects in electric vehicle power modules, that combines the advantages of aluminium and copper.

Scrona

Scrona is an early stage Swiss company that has developed a micro-electro-mechanical system (MEMS) that enables very high resolution (<1 um) electrohydrodynamic printing via 1000s of independently controllable nozzles simultaneously. This exciting technology breaks the current trade-off between printing speed and resolution.

Elantas

9 Materials Science Start-Ups Changing Metal Additive Manufacturing

The metal additive manufacturing market will be negatively impacted by the 2020 pandemic. Despite this short-to-mid-term setback, the industry is forecast to rise and exceed $10Bn within the next 10-years. The emerging and established printer players grab nearly all of the headlines, but most of this forecast annual revenue will be in material sales in which there is great untapped potential.

Heraeus

Heraeus provides a portfolio of IC packaging materials including sintered Ag paste for die attach purposes.

Ink-based conformable package-level EMI shielding

Ink-based conformable package-level EMI shielding: a megatrend or supplier push? In this article we consider the trend towards ink-based conformable package-level EMI shielding. The more general trend towards conformable package-level shielding is a major one, and is already in full swing. Indeed, many products have already adopted such coating, replacing the established bulky lid-based shields.

Clariant

IDTechEx visited Clariant in Höchst near Frankfurt to learn more about their silver nanoparticle activity. We talked with Carsten Schauer in this visit.

Heraeus

IDTechEx visited Heraeus in Hanau to learn more about their new particle-free silver ink technology. This material is mainly targeted at conformal package-level EMI shielding.

COPT Center

Dr Khasha Ghaffarzadeh visited COPT {#ndash} the centre of organic electronics at the University of Cologne (Koeln) {#ndash} to meet with Dr Stephen Kirchmeyer. He was previously at Heraeus working on PEDOT and is now a board member of various companies such as Genes'Ink. He is also a board member of OEA.

2019

IDTechEx Wearable USA 2019 Award Winners

Each year at the IDTechEx Show!, two companies are honoured for their achievements in developing and commercialising different aspects of wearable technology. The awards are judged by industry peers from some of the leading companies in the space.

In-Mold Electronics Market will Take-off in 2020 - Here's Why

In-mold electronics (IME) - or in-mold structural electronics (IMSE) - is about to enter a period of rapid revenue growth, with IDTechEx forecasting the overall market to exceed $1bn within a decade.

Die Attach Materials for Power Electronics in Electric Vehicles

New IDTechEx Research report investigates the market for various die and substrate attach materials used in power electronics in various electric vehicles. It provides a comprehensive view of the industry trends, looking at the trends driving the adoption of higher performance die-attach materials.

Metal sintering die attach materials, processes, and suppliers

This is part V of our article series.

New EMI shielding tech boosts performance for new 5G mobile standards

Electromagnetic interference is increasingly becoming a problem today - especially for new generation mobile phones and 5G technology. To meet this challenge, Heraeus now offers a new complete solution consisting of silver ink and printer for EMI shielding. This system is both less expensive and more effective than all other options available today.

Graphene Enhanced Conductive Inks Overview

Graphene-based conductive inks were introduced commercially as early as 2009. These graphene printing inks can contain a very wide range of graphene loading, from up to 40% for use as non-transparent conductive inks or as little as 0.1% to 1% in transparent conductive ink applications depending on the level of conductance required.

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