Heraeus GmbH

Printed and flexible electronics in vehicles will reach $5.5bn by 2026

As printed and flexible electronics are beginning to proliferate, with a variety of components and devices coming to market, several end user verticals are expected to benefit from the host of advantages these technologies offer and the automotive sector is no exception. Overall, the market is expected to grow to over $5.5 Billion dollars in the next decade, spearheaded by the projected growth of in-mold electronics and OLED technologies, as discussed in more detail in the newly launched IDTechEx report "Printed and Flexible Electronics in Automotive Applications 2016-2026 - Enabling technology toolkits, suppliers and market forecasts".

Heraeus Noblelight receives Queen's Award for Enterprise

Heraeus Noblelight was presented with the prestigious Queen's Award for Enterprise: Innovation by Sir Hugh Duberly KCVO, CBE, Her Majesty's Lord-Lieutenant of Cambridgeshire.

IDTechEx Show! 2015 - 75% exhibitor space booked and over 200 speakers

The IDTechEx Show!, America's largest event focused on emerging technologies, including printed electronics and wearable technology, has already booked more than 75% of its exhibition space at the event, which will be held Nov. 18-19 in the heart of Silicon Valley at the Santa Clara Convention Center in Santa Clara, California.

Flexible 7 inch touch panel with integrated OLED display developed

Partnering Touch and OLED Technologies: Heraeus and the Industrial Technology Research Institute (ITRI), Taiwan demonstrate new flexible technologies for the touch panel and display industries.

He who does not print, vacuum coats

Atmospheric vs. vacuum deposition in the flexible electronics era.

Trends in PV metallization

The photovoltaic industry remains a major end user of printed electronics. In this article, we will provide a detailed cost breakdown of the wafer-based silicon photovoltaic cells, showing that Ag and Al metallization continue to constitute a major cost element of the overall PV cell even though the manufacturers make to zero margin. We will then investigate some of the trends in Ag metallization before commenting on silicon inks, which at one point appeared to be the technology that increased efficiency but were leapfrogged by progress in metallization pastes.

The Hague Display: New printed electronics demonstrator

The transatlantic project team from the Cal Poly State University, USA and the Munich University of Applied Science in Germany have developed and produced hand-out demonstrators for the IDTechEx Printed Electronics Conferences in Santa Clara and Berlin. They will be distributed to attendees at Printed Electronics Europe in Berlin on April 28-29.

Perpetuus Advanced Materials secures landmark commercial agreement

Perpetuus will supply innovative alternatives to existing silver and copper-based inks and pastes.

Cambrios and Heraeus create high-conductivity transparent conductors

Cambrios Technologies Corporation and Heraeus have announced a new class of hybrid, transparent, conductive materials made of silver nanowires and conductive polymers.

Interview with Heraeus at Printed Electronics USA

Video interview with Dr Stephan Kirchmeyer, Global Technical Director, Display & Semiconductor from Heraeus

New Clevios hardcoat - up to scratch

New Clevios™ PEDOT:PSS hardcoat at the Printed Electronics Show, Santa Clara, California.

The graphene industry finds new market opportunities in California

The 5th IDTechEx conference and tradeshow on graphene and 2D materials- Graphene and 2D Materials LIVE! - has become the annual meeting place for the global graphene industry in California.

The $2 billion conductive ink industry gathers in Santa Clara

This is a successful and growing industry. Indeed, IDTechEx projects that the $2billion conductive ink/paste sector will grow $3.2 billion in 2025 at the material level.

Air of optimism returning to the PV industry

The IDTechEx Printed Electronics and Energy Harvesting events focus on emerging thin and/or flexible photovoltaic technologies. This co-located event will cover printed electronics, energy harvesting, supercapacitors, wearable technologies and 3D printing and will attract in excess of 2,500 attendees and 200 exhibitors.