Omniply

Omniply have developed an innovative material that enables a high yielding method of removing flexible electronics from the rigid substrates used during manufacturing. This profile update is based on a presentation given during the NAPIM conductive ink conference held in October 2020.

IDTechEx interviewed Karim Somani, COO of Omniply at CES 2020. The company's message is that "they enable cheaper flexible electronics" which they claim to do by having an alternative lift off process - lifting the substrate off the glass carrier.