Printed, Flexible and Organic Electronics

Printed, Flexible and Organic Electronics

Printed Electronics, being thin film silicon or inorganic or organic semiconductors, can be used to form Thin Film Transistor Circuits (TFTCs), such as replacing the functionality of simple silicon chips. TFTCs also employ thin film conductors and dielectrics and the ultimate objective is to make many different components at the same time - such as displays, batteries, sensors, microphones etc using the same materials or at least the same deposition techniques thus saving cost and improving reliability. Some TFTCs will be capable of covering large areas to affordably form electronic billboards, smart shelves and so on. They will be lightweight, rugged and mechanically flexible. Often they will be made by rapid, high-volume reel-to-reel processing even forming a part of regular printing processes for graphics. These circuits will be cheap enough to permit electronics where envisaged silicon chips are always or almost always too expensive, where multiple components and needed, and where silicon is impracticle (e.g. not flexible, brittle, thick etc).
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2009
10 Jun 2009

Silicon ink developments at NanoGram

NanoGram's CEO Dr Kieran Drain speaks to IDTechEx, about the company's focus on its 35µm multi-crystalline silicon technology (mc-Si), called SilFoil™.
10 Jun 2009

New device to store electrical energy

Researchers at the Maryland NanoCenter at the University of Maryland have developed new systems for storing electrical energy derived from alternative sources that are, in some cases, 10 times more efficient than what is commercially available and will significantly enhance the performance of electrical energy storage devices.
10 Jun 2009

Belair Micro ramps-up printed silver product applications

Marketed products affirm cost abatement, increased serviceability and environmental advancements.
10 Jun 2009

PETEC purchases Optomec Aerosol Jet Deposition System

Aerosol Jet System will be used for the development of Organic Thin Film Transistors
9 Jun 2009

OLED progress round-up from S.I.D. 2009

In this final article for Printed Electronics World covering S I D 2009, we give highlights from some of the technical sessions covering progress with OLEDs
8 Jun 2009

CEHMS planning grant meeting

CEHMS will address an important problem of our generation facing the sensor networks, wireless communication and microelectronics industry related to power source.
8 Jun 2009

Flexible displays coming from Prime View International

At S.I.D. 2009, Ian French from Prime View International (PVI) gave an excellent presentation on progress with flexible displays.
5 Jun 2009

The rise and rise of E ink

IDTechEx looks at progress at E ink at S.I.D. held in San Antonio
5 Jun 2009

Energy Harvesting and Storage Conference - Day Two

The second day of the IDTechEx conference on Energy Harvesting and Storage in Cambridge UK was dedicated to the technology roadmap.
5 Jun 2009

iRex Technologies developing a high quality, full color digital reader

The world's leading provider of e‐reading solutions, Netherlands‐based iRex Technologies, announced new progress on development of a next generation of color, writable, ultra‐thin digital readers expected to launch mid 2011.
4 Jun 2009

Energy Harvesting & Storage Europe, Cambridge, UK

Now in its second day, the IDTechEx Energy Harvesting and Storage conference in Cambridge, UK, has 150 attendees discovering the latest in harvesting and storage technologies and the applications that drive such innovation.
4 Jun 2009

Progress with electrowetting displays

Electrowetting is a proven process, used for focus mechanisms in cameras and cellphones. As a display technology, it is gaining increased attraction due its excellent colour range, high contrast and versatile operation mode capability.
4 Jun 2009

Advanced flexible OLEDs closer to mass market

The Flexible Display Center (FDC) at Arizona State University and Universal Display Corporation (NASDAQ: PANL), has introduced the first a-Si:H active matrix flexible organic light-emitting diode (OLED) display to be manufactured directly on DuPont Teijin's polyethylene naphthalate (PEN) substrate.
3 Jun 2009

New focus for printed electronics

In the last year, the burgeoning printed and thin film electronics industry has greatly enhanced its repertoire and changed its priorities, encompassing such things as rapid commercialisation of disposable and invisible electronics.
3 Jun 2009

Highlights from S.I.D. 2009

This week IDTechEx is at the annual S.I.D. (Society for Information Displays) event in San Antonio, Texas, USA. Over the coming days we will provide coverage in Printed Electronics World of the latest developments announced at the event.
3 Jun 2009

OE-A Unveils New Roadmap and Demonstrators

The updated and expanded third edition of the OE-A Roadmap for organic and printed electronics offers an overview of future product generations as well as requirements for materials and technologies.
2 Jun 2009

Military thermoelectrics

Thermoelectric energy harvesting is used in many military applications. In addition, it is used in the related area of generating energy on space vehicles in deep space where thermoelectric are ineffective, this being done by converting the heat of a radioactive material - the Radioisotope Thermoelectric Generator RTG.
2 Jun 2009

Electronic skins for mobile devices that change color and design

Mobile phones that change color and design to match your shirt, hat or skirt could soon be the latest fashion accessory with the recent advancements in Electronic Skins.
1 Jun 2009

IDTechEx observe the latest at Berlin's Thin Film Solar Summit

Dr Harry Zervos, technology analyst with IDTechEx attended the Thin Film Solar Summit on the 19th and 20th of May, in Berlin which was mainly dominated by First Solar's achievements towards lowering their manufacturing costs to under 1 dollar.
1 Jun 2009

Liquavista raises €5 Million in series C funding

Liquavista, the developer of break-through display manufacturing technologies, today announced the closing of its Series C funding round of €5 million euro.