전기 전도성 접착제 (2022-2032년): 기술, 시장 및 전망: IDTechEx

전기 전도성 접착제(ECA) 시장은 2032년까지 36억 7000만 달러 규모로 성장할 것이다

전기 전도성 접착제 (2022-2032년): 기술, 시장 및 전망

등방성 전도성 접착제(ICA), 이방성 전도성 페이스트(ACP) 및 이방성 전도성 필름(ACF)을 포함한 전기 전도성 접착제(ECA)에 대한 글로벌 수요, 시장 동향 및 시장 예측.


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전기 전도성 접착제(ECA)는 땜납(solder)의 경쟁자이다. ECA는 플렉서블 전자장치, 인몰드 전자 및 웨어러블 기술과 같은 여러 산업 전반에 걸쳐 핵심 전도성 접합 기술이 될 것이다. 이 보고서는 전 세계 전기 전도성 접착제 시장에 대한 주요 통찰력과 상업적 전망을 포함한다. 보고서는 등방성 전도성 접착제(ICA), 이방성 전도성 페이스트(ACP) 및 이방성 전도성 필름(ACF)을 포함한 전기 전도성 접착제(ECA)를 다룬다. 각 응용분야에 대해 10년 ECA 시장 예측을 제공한다.
Electrically conductive adhesives (ECAs) are set to become a key conductive joining technology across a range of emerging industries. They may be used to connect components and circuitry across a wide range of uses, giving joins which are mechanically strong and electrically conductive. Due to the restricted use of lead-based solders, new alternatives are needed to fill the gap in the market, and IDTechEx believes electrically conductive adhesives are one of the most promising options.
 
Additionally, ECAs provide other benefits, such as fine pitch capacity, required for miniaturisation of electronics, and low temperature joining. Although they do have drawbacks, these benefits make ECAs well positioned to become the dominant joining technology in several emerging applications such as flexible, printable, and in-mold electronics.
 
Key questions answered in this report:
  • What are ECAs?
  • What is the ECA market size?
  • What are the key pros and cons of ECAs?
  • What are the different types of ECAs and how do they differ?
  • How will the demand for ECAs change in the future?
  • Where are the key application areas of ECAs?
  • What are the competitor materials to ECAs?
  • What are the key properties to consider with an ECA?
  • What are they main processing stages of ECAs, and what problems do they cause?
 
"Electrically Conductive Adhesives (ECAs) 2022-2032" contains key insights and commercial outlooks for ECAs, built upon primary interviews and product analysis. This comprehensive evaluation of the global ECA industry analyses the commercial and technological factors that are set to shape the emerging industry. The report considers both isotropically conductive adhesives (ICAs) and anisotropically conductive adhesives (ACAs), analysing them from both a technical and commercial point of view. Film based adhesives, in particularly anisotropically conductive films (ACFs), are also discussed.
 
The report analyses both current and emerging applications of ECAs, considering the key drivers and requirements for these areas, including automotive electronics, consumer electronics, display applications, printed electronics, and RFID applications.10-year market forecasts are given for each application area, broken down both by application, and by the type of adhesives used. Key players are evaluated, including Henkel, Panacol, Dexerials, Showa Denko Materials, and others.
 
Electrically Conductive Adhesives (ECAs): Technology Considerations
Electrically conductive adhesives are made of two components: the conductive filler, and the structural resin. The filler creates the conductive link across a join. Fillers are typically metal based, with the most common metal being silver. The resin provides mechanical strength to the adhesives and holds the filler particles in place. Resins are generally polymer based, with epoxy being the most common option. In this report, IDTechEx discusses established and emerging fillers and resins, analysing commercially available adhesives, and providing a detailed breakdown of commercially available ECAs. The exact properties desired from both the filler and the resin are also discussed, and different materials are evaluated for suitability.
 
The current state of the ECA industry technology and areas of innovation are also considered. Several novel ECA products are investigated, and areas of R&D pursued by market leading suppliers are highlighted.
 
Technology readiness levels for different component attachment materials and several innovations in Electrically Conductive Adhesives (ECAs)
Key benefits of Electrically Conductive Adhesives (ECAs)
Some key benefits of using an ECA are the fine pitch capacity, the low processing temperature, and the high flexibilities which can be achieved. These benefits make ECAs well suited to making smaller electronics and allow for use on a wider variety of substrates than alternative technologies, such as lead-free solders and silver sintering. Driven by these benefits, IDTechEx forecasts that the market for ECAs is growing, with ECAs set to replace outdated and poor performing competitors across a range of applications, including displays, consumer electronics and wearable technology.
 
ECAs are not a perfect technology, however. Drawbacks include high costs compared with other joining technologies, primarily due to high materials and processing costs, as well as a lack of self-alignment for components. This can make them unsuitable for certain applications, such as cost-sensitive applications where fine pitch is not required, or applications where ease of repair is desirable, such as hobbyist use. It is likely that no single conductive joining technology will win out in future, although IDTechEx believes that ECAs will become increasingly important over the next decade.
 
 
Electrically Conductive Adhesives (ECAs): Markets and Applications
ECAs are used across a range of established and emerging applications. Markets for established applications are more likely to grow at a steady rate, whereas emerging technologies that currently represent a comparatively small market may have the potential for much more rapid growth.
 
Current and future applications and markets considered in this report include:
  • Automotive electronics,
  • Consumer electronics,
  • Displays technologies
  • RFID
  • EMI shielding
  • Photovoltaics
  • Aerospace
  • Printed and flexible electronics
  • Wearable technologies
  • In-mold electronics
 
With 10-year market forecasts, key specifications, and SWOT analyses, provided for each application.
 
Electrically Conductive Adhesives (ECAs) are used across a range of applications at different stages of development. They are already established in applications such as display attachment, and are forecast to become increasingly dominant in In-mold electronics.
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Table of Contents
1.EXECUTIVE SUMMARY
1.1.Types of Joining Materials
1.2.Benefits of ECAs
1.3.Drawbacks of ECAs
1.4.SWOT analysis of ECAs
1.5.Types of ECA manufacturers
1.6.Applications of ECAs
1.7.Common Materials choices for ECAs
1.8.Key properties of ECAs
1.9.ICAs and ACAs
1.10.The future of ICAs and ACAs
1.11.Which manufacturers create which products?
1.12.Usage of different filler materials
1.13.Usage of different Resins
1.14.Types of Innovation in ECAs
1.15.Overview of applications
1.16.ECA Adoption for Multiple Applications
1.17.Roadmap: Emerging applications for ECAs
1.18.Specialisation of ECAs
1.19.Global ECA market forecast by type of ECA
2.INTRODUCTION
2.1.What are Electrically Conductive Adhesives?
2.1.1.Types of Joining Materials
2.1.2.Structure of Electrically Conductive Adhesives
2.1.3.Schematic of Interconnects
2.1.4.Benefits of ECAs
2.1.5.Drawbacks of ECAs
2.1.6.The cost of ECAs
2.1.7.SWOT analysis of ECAs
2.2.Market Analysis
2.2.1.Types of ECA manufacturers
2.2.2.ECA manufacturer overview
2.2.3.Major Multinational Suppliers: Summary
2.2.4.Mid-Sized Suppliers: Summary
2.2.5.Small Boutique Suppliers: Summary
2.2.6.Market fragmentation
2.2.7.Investigating the market leader: Henkel
2.2.8.Customisablity of ECAs
2.2.9.Summary of differences between large and small suppliers
2.3.An overview of applications of Electrically Conductive Adhesives (ECAs)
2.3.1.Applications of ECAs
2.3.2.Summary of Pros and Cons for Various Applications
2.3.3.Summary of Pros and Cons for Various Applications
2.4.Overview of materials and properties of ECAs
2.4.1.Finding the Correct Formulation
2.4.2.Key Statistics for ECA choice
2.4.3.Common Materials choices for ECAs
2.4.4.Key properties of ECAs
2.5.An overview of conductive joining technologies
2.5.1.Lead based solder
2.5.2.Wave and Reflow soldering
2.5.3.The need to replace lead based solders
2.5.4.Alternate conductive joining technologies
2.5.5.Taxonomy of conductive joining materials
2.5.6.Principles of Electrically Conductive Adhesives
2.5.7.Typical properties of ECAs versus lead based solders
2.5.8.ECAs: pros and cons
2.5.9.Silver Sintering
2.5.10.Silver Sintering: pros and cons
2.5.11.Transient Liquid Phase Sintering
2.5.12.Transient Liquid Phase Sintering: pros and cons
2.5.13.Non-lead based solders
2.5.14.Common lead free solder systems
2.5.15.Novel soldering systems
2.5.16.NovaCentrix: Photonic soldering
2.5.17.SAFI-Tech: Low temperature full metal interconnects with liquid metal solder microcapsules
2.5.18.Non-lead based solders: pros and cons
2.5.19.Comparison of die attach techniques
2.5.20.The lack of a "one-size fits all" technique
3.ISOTROPIC AND ANISOTROPIC CONDUCTIVITY
3.1.1.ICAs and ACAs
3.1.2.Pros and Cons of ACAs (compared to ICAs)
3.1.3.The future of ICAs and ACAs
3.1.4.Global ECA market forecast by type of ECA
3.1.5.Global ECA forecast by proportion of ECA type
3.1.6.Films vs pastes
3.1.7.Which manufacturers create which products?
3.2.Isotropically conductive adhesives (ICAs)
3.2.1.Isotropically conductive adhesives
3.2.2.Percolation threshold
3.2.3.Underfill
3.2.4.Global ICA market forecast by Application sector
3.3.Anisotropically conductive adhesives (ACAs)
3.3.1.Anisotropically conductive adhesives
3.3.2.Fundamentals of ACAs
3.3.3.Schematic showing the procedure required to form an anisotropically conductive joint
3.3.4.Global ACP market forecast by Application sector
3.3.5.Global ACF market forecast by Application sector
4.THE CONDUCTIVE FILLER
4.1.1.Filler materials overview
4.1.2.Usage of different filler materials
4.1.3.Company approaches to different filler materials
4.1.4.Filler materials selection
4.2.Properties required of the conductive filler
4.2.1.Intrinsic properties required of the conductive filler
4.2.2.Extrinsic properties of the filler materials
4.3.Filler material options
4.3.1.Filler Materials Choices - Conventional Metals
4.3.2.Filler Materials properties in ECAs
4.3.3.Silver migration
4.3.4.Costs of Silver and Gold
4.3.5.Filler materials choices - Metal Alternatives
4.4.Filler material morphology
4.4.1.Availability of different filler morphologies
4.4.2.Filler materials morphology
4.4.3.Anisotropic connections via particle morphology
4.4.4.Conductive metal coatings
4.4.5.Types of bulk core
4.4.6.Protective polymer coatings
4.4.7.Polymer filler and protective coat
5.THE STRUCTURAL RESIN
5.1.1.Resin Materials Overview
5.1.2.Usage of different Resins
5.1.3.Company approaches to different resin materials
5.1.4.Resin materials selection
5.2.Properties required of the resin material
5.2.1.Fundamentals of polymer chain chemistry
5.2.2.Thermoplastics and thermosets
5.2.3.Properties for the Polymer Resin
5.2.4.Properties of the filler materials
5.3.Resin material options
5.3.1.Matrix Materials Choices
5.3.2.Matrix Materials properties in ECAs
6.UTILISATION OF ECAS: A STEP BY STEP PROCESS
6.1.1.Overview of the application process
6.2.Application techniques for ECAs
6.2.1.Application techniques
6.2.2.Dispensing
6.2.3.Screen Printing
6.2.4.Inkjetting
6.3.Curing of ECAs
6.3.1.The Importance of Curing
6.3.2.Hierarchy of conductive joining materials
6.3.3.Thermal Cure
6.3.4.Issues with curing
6.3.5.Non-thermal curing (2 component systems)
6.3.6.Time and Temperature relations in curing
6.3.7.Cure Schedule and Adhesive Properties
6.3.8.Temperature profiles during curing
6.3.9.Polymer TTT curve
6.4.Storage of ECAs
6.4.1.Shelf life, Pot Life and Work Life
6.4.2.Storage and refrigeration of ECAs
6.5.Component design and testing with ECAs
6.5.1.Component termination design
6.5.2.Optical inspection and testing of ECA connections
6.5.3.Alternate inspection and testing of ECA connections
6.5.4.Rework and repair of joints
6.5.5.Replacement of joints
6.6.Failure Methods of ECAs
6.6.1.Failure mechanisms of ECAs
6.6.2.Resin Driven Failure Mechanisms
6.6.3.Non - Resin Driven Failure Mechanisms
7.EMERGING TECHNOLOGIES IN ECAS
7.1.1.Types of Innovation in ECAs
7.1.2.Major Multinational Suppliers: Innovation and Development
7.1.3.Mid-Sized Suppliers: Innovation and Development
7.1.4.Smaller Boutique Suppliers: Innovation and Development
7.1.5.Summary of Different Technical Innovations
7.1.6.Readiness level: Component attachment materials
7.2.Emerging Technologies in Isotropically Conductive Adhesives (ICAs)
7.2.1.Innovations in ICAs
7.2.2.Summary of Technologies in ICA
7.2.3.ICA films
7.2.4.The benefits of Isotropic Conductive Films (ICF)
7.2.5.The future of ICF
7.2.6.Semi-Sintering ICA pastes
7.2.7.Metal / Glass pastes
7.3.Emerging Technologies in Anisotropically Conductive Films (ACFs)
7.3.1.Innovations in ACFs
7.3.2.Summary of Technologies in ACF
7.3.3.Electrically aligned ACF (CondAlign)
7.3.4.CondAlign
7.3.5.Mechanically aligned ACF (Dexerials)
7.3.6.Dexerials
7.3.7.Emerging Technologies in Anisotropically Conductive Pastes (ACPs)
7.3.8.Innovations in ACPs
7.3.9.Summary of Technologies in ACP
7.3.10.Magnetically aligned ACA (SunRay Scientific)
7.3.11.SunRay Scientific
7.3.12.Nopion
8.APPLICATIONS OF ECAS
8.1.1.Applications of ECAs
8.1.2.Overview of applications
8.1.3.ECA Adoption for Multiple Applications
8.1.4.Roadmap: Emerging applications for ECAs
8.1.5.Specialisation of ECAs
8.1.6.Applications which require greater specialisation
8.1.7.Applications which require slight specialisation
8.1.8.The limits of ECA applications
8.1.9.Summary of Pros and Cons for Various Applications
8.1.10.Summary of Pros and Cons for Various Applications
8.1.11.Global ECA market forecast by Application sector
8.1.12.Global ICA market forecast by Application sector
8.1.13.Global ACP market forecast by Application sector
8.1.14.Global ACF market forecast by Application sector
8.2.Consumer electronics
8.2.1.A summary of ECAs in consumer electronics applications
8.2.2.Global ECA consumer electronics market forecast by type of ECA
8.2.3.Global ECA consumer electronics market forecast by final product type
8.2.4.Global ICA consumer electronics market forecast by final product type
8.2.5.Global ACA consumer electronics market forecast by final product type
8.2.6.The Consumer Electronics Industry
8.2.7.Circuit board attachment in Consumer Electronics
8.2.8.Mounting of Crystal devices
8.2.9.Crystal Device Mounts - Fujikura Kasei
8.2.10.Desirable Properties of an ECA for use in Consumer Electronics Applications
8.2.11.SWOT analysis of ECA in Consumer electronics applications
8.3.Automotive
8.3.1.A summary of ECAs in automotive electronics applications
8.3.2.Global ECA automotive electronics market forecast by type of ECA
8.3.3.Types of automotive vehicle by engine type
8.3.4.Global ECA automotive electronics market forecast by vehicle type
8.3.5.Global ICA automotive electronics market forecast by vehicle type
8.3.6.Global ACA automotive electronics market forecast by vehicle type
8.3.7.The potential of Automotive Electronics Applications
8.3.8.Uses of ECAs within a vehicle
8.3.9.Use of ECAs in automotive circuit boards
8.3.10.ECAs in Advanced automotive sensors
8.3.11.Automotive display applications
8.3.12.Desirable Properties of an ECA for use in Automotive Electronics Applications
8.3.13.SWOT analysis of ECA in automotive electronics applications
8.4.Aerospace
8.4.1.A summary of ECAs in aerospace electronics applications
8.4.2.Global ECA aerospace electronics market forecast by type of ECA
8.4.3.The use of ECAs in Aerospace applications
8.4.4.Structural Electronics in the aerospace industry
8.4.5.Structural Adhesives - Luna Innovations
8.4.6.Desirable Properties of an ECA for use in Aerospace Electronics Applications
8.4.7.SWOT analysis of ECA in aerospace electronics applications
8.5.Displays
8.5.1.A summary of ECAs in display technology applications
8.5.2.Global ECA for display applications market forecast
8.5.3.ECAs for Display Applications
8.5.4.Examples of display applications
8.5.5.A schematic of display interconnections
8.5.6.Prevalence of different display technologies
8.5.7.Automotive display applications
8.5.8.ACFs for Display attachment - Dexerials
8.5.9.Desirable Properties of an ECA for use in Display Applications
8.5.10.SWOT analysis of ECA in display applications
8.6.EMI Shielding
8.6.1.A summary of ECAs in EMI shielding applications
8.6.2.Global ECA for EMI shielding market forecast
8.6.3.EMI shielding effects
8.6.4.ECA differences for EMI Shielding
8.6.5.The demands of EMI shielding
8.6.6.EMI Shielding: Adhesives vs Sealants
8.6.7.Joint Configurations of EMI shielding
8.6.8.Mechanical Requirements of EMI Shielding
8.6.9.Mechanical Requirements of EMI Shielding - Lap Shear Strength
8.6.10.Mechanical Requirements of EMI Shielding - Bond Line Thickness
8.6.11.Mechanical Requirements of EMI Shielding - Flexibility
8.6.12.Electrical Requirements of EMI Shielding
8.6.13.Desirable Properties of an ECA for use in EMI Shielding Applications
8.6.14.SWOT analysis of ECA in EMI Shielding applications
8.7.Photovoltaics
8.7.1.A summary of ECAs in Photovoltaic applications
8.7.2.Global ECA for photovoltaic applications market forecast
8.7.3.The potential use of ECAs in photovoltaic applications
8.7.4.Development of ECAs for PV cells
8.7.5.Shingled PV cells
8.7.6.Desirable Properties of an ECA for use in Photovoltaic Applications
8.7.7.SWOT analysis of ECAs in PV cell applications
8.8.Printed and Flexible Electronics
8.8.1.A summary of ECAs in printed and flexible electronics applications
8.8.2.Global ECA for printed and flexible electronics market forecast by type of ECA
8.8.3.The potential for ECAs in Printed Electronics
8.8.4.Trend towards low temperature substrates for printed/flexible electronics
8.8.5.Example of conductive adhesives on flexible substrates
8.8.6.Component attachment for flexible hybrid electronics
8.8.7.Desirable Properties of an ECA for use in Flexible and Printed Electronics Applications
8.8.8.SWOT analysis of ECA in flexible and printed electronics applications
8.9.Wearables
8.9.1.A summary of ECAs in wearable electronics applications
8.9.2.Global ECA wearable electronics market forecast by type of ECA
8.9.3.Global ECA wearable electronics market forecast by final product type
8.9.4.Global ICA wearable electronics market forecast by final product type
8.9.5.Global ACA wearable electronics market forecast by final product type
8.9.6.What are Wearable Technologies?
8.9.7.Historic Wearable Technology Market Forecast
8.9.8.The two types of ECAs in wearable applications
8.9.9.Schematics of ECAs in wearable applications
8.9.10.Component/Component ECAs in wearable electronics
8.9.11.ICA vs ACA in wearable applications
8.9.12.Adhesives Research - AR
8.9.13.Creative Materials
8.9.14.Dycotec
8.9.15.Component/Component attach ECAs development
8.9.16.What are electrode/skin attach adhesives?
8.9.17.Why are E/S adhesives needed?
8.9.18.Product areas with body-worn electrodes
8.9.19.Differences between wet and dry electrodes
8.9.20.Wet vs dry electrodes schematic
8.9.21.Medical Adhesive Technologies
8.9.22.Development areas for hydrogel adhesives
8.9.23.Lohmann Tapes: Key Factors
8.9.24.Sekisui Kasei & ST-gel
8.9.25.Henkel: ECG arrangements
8.9.26.CondAlign: Electrode Attachment
8.9.27.Desirable Properties of an ECA for use in Wearable Applications
8.9.28.SWOT analysis of ECA in Wearable Applications
8.10.RFID
8.10.1.A summary of ECAs in RFID applications
8.10.2.Global ECA for RFID market forecast by type of ECA
8.10.3.What is RFID?
8.10.4.ECAs for use in RFID
8.10.5.Desirable Properties of an ECA for use in RFID Applications
8.10.6.SWOT analysis of ECA in RFID applications
8.11.In-mold Electronics
8.11.1.A summary of ECAs in In-mold electronics applications
8.11.2.Global ECA for In-mold electronics market forecast by type of ECA
8.11.3.The potential for ECAs in In-mold Electronics
8.11.4.A summary of the In-mold electronics process
8.11.5.Challenges of In-mold Electronics
8.11.6.Surviving the IME process
8.11.7.Desirable Properties of an ECA for use in In-mold Electronics Applications
8.11.8.SWOT analysis of ECA for IME applications
9.FORECASTS
9.1.1.Global ECA market forecast by type of ECA
9.1.2.Global ECA forecast by proportional of ECA type
9.1.3.Global ECA market forecast by Application sector
9.1.4.Global ICA market forecast by Application sector
9.1.5.Global ACP market forecast by Application sector
9.1.6.Global ACF market forecast by Application sector
9.1.7.Global ECA consumer electronics market forecast by type of ECA
9.1.8.Global ECA consumer electronics market forecast by final product type
9.1.9.Global ICA consumer electronics market forecast by final product type
9.1.10.Global ACA consumer electronics market forecast by final product type
9.1.11.Global ECA automotive electronics market forecast by type of ECA
9.1.12.Global ECA automotive electronics market forecast by vehicle type
9.1.13.Global ICA automotive electronics market forecast by vehicle type
9.1.14.Global ACA automotive electronics market forecast by vehicle type
9.1.15.Global ECA aerospace electronics market forecast by type of ECA
9.1.16.Global ECA for display applications market forecast
9.1.17.Global ECA for EMI shielding market forecast
9.1.18.Global ECA for photovoltaic applications market forecast
9.1.19.Global ECA for printed and flexible electronics market forecast by type of ECA
9.1.20.Global ECA wearable electronics market forecast by type of ECA
9.1.21.Global ECA wearable electronics market forecast by final product type
9.1.22.Global ICA wearable electronics market forecast by final product type
9.1.23.Global ACA wearable electronics market forecast by final product type
9.1.24.Global ECA for RFID market forecast by type of ECA
9.1.25.Global ECA for In-mold electronics market forecast by type of ECA
 

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전기 전도성 접착제 (2022-2032년): 기술, 시장 및 전망

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보고서 통계

슬라이드 352
전망 2032
게시 Aug 2021
ISBN 9781913899622
 

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