10년후 AI 하드웨어에 대한 예측 및 전망
Data centers and high-performance computing are the engines of the ongoing AI boom. IDTechEx covers much of the value chain here, from AI chips to the photonic integrated circuits used in interconnects to thermal management. With the 100s of billions of dollars being poured into these markets per year, the rate of change is rapid. As parameter counts for the largest AI models climb further into the trillions, the demands on the systems that train and infer them will continue to grow.
Drawing on IDTechEx's extensive research portfolio, including "Co-Packaged Optics (CPO) 2025-2035: Technologies, Market, and Forecasts", "Advanced Semiconductor Packaging 2025-2035: Forecasts, Technologies, Applications" and the upcoming report, "Hardware for High-Performance Computing (HPC) 2025-2035", this webinar will give an overview of the state of the AI hardware and HPC markets in 2024 and examine expected trends for the next decade.
This webinar will include:
- An outline of the ongoing development of specialized AI accelerators and the impact of ARM architectures on the CPU market for HPC.
- Trends and developments in memory and storage technologies for AI and HPC workloads and the advanced semiconductor packaging technologies to realize next-generation solutions.
- Examination of the growing role of silicon photonics in high-speed interconnects for HPC and how co-packaged optics will increase bandwidths whilst reducing power consumption.
- Discussion of the push towards liquid cooling in data centers, driven by increasing AI workloads.
- Insights from IDTechEx's ten-year forecasting for the HPC market.
