28 Nov 2025

New IDTechEx Report: Co-Packaged Optics (CPO) 2026-2036
IDTechEx's report titled "Co-Packaged Optics (CPO) 2026 to 2036: Technologies, Market, and Forecasts" reviews recent advances in CPO technology, tracks emerging packaging approaches, assesses the strategies of leading companies, and provides long term market forecasts. The report highlights how CPO adoption is set to reshape data center infrastructure in the coming decade.
Appears in IDTechEx Report

24 Nov 2025
Sensor Market 2026-2036: Technologies, Trends, Players, Forecasts
IDTechEx Report: Dr Tess Skyrme, Mika Takahashi, Dr Conor O'Brien, Noah El Alami, Daniel Parr, Shihao Fu, Dr Yu-Han Chang and Dr Xiaoxi He
Full profile interview
31 Oct 2025

Cisco Quantum Research
Cisco's quantum research lab is developing hardware and software for quantum networking and quantum data centers.
Included are:
Full profile interview
10 Jun 2025

Groq
Groq is a California-based fabless chip designer that focuses on designing chips for developers and enterprises to deliver AI inference. Groq is known for designing the Language Processing Unit (LPU), a novel architecture purpose-built to accelerate AI inference.
Full profile interview
15 Apr 2025

NVIDIA: Telecommunications
NVIDIA is a global leader in artificial intelligence (AI) and accelerated computing that is becoming an important technology partner in the telecommunications industry. While it does not provide traditional network equipment, NVIDIA supports telecom operators through AI infrastructure, automation tools, and simulation technologies that enable more efficient, software-defined networks. This company profile explores NVIDIA's position, partnerships, and activities within the telecom space.
9 Apr 2025

The Packaging Technologies Behind NVIDIA's 3D-Stacked CPO
At GTC 2025, NVIDIA announced two new networking switch platforms - Spectrum-X Photonics and Quantum-X Photonics - based on Co-Packaged Optics (CPO) technology. Both platforms incorporate TSMC's 3D hybrid bonding technology for its CPO, and these will be the world's first 3D-stacked silicon photonics engine.
Background
6 Jan 2025

Google: Optical Circuit Switches and Data Center Fabrics
At Microtech Ventures' 2024 Microfab Summit Dr. Kevin Yasumura, Principal Engineer and Technical Lead for MEMS and Optical Switching Development at Google, spoke about the tech giant's Lightwave Fabric architecture for data centers. This talk focused on Google's optical circuit switches and its role in this architecture.
Full profile interview
15 Oct 2024

University of Washington: Vikram Iyer Group
IDTechEx spoke to Vikram Iyer, Assistant Professor at the University of Washington. His research group has developed a new printed circuit board, which enables recycling of both circuit components and the circuit substrate.