A Novel Passive RFID Sensing System for Intelligent Infrastructure (RFID Europe 2010)

Sithamparanathan Sabesan, Doctorate Student
University of Cambridge
United Kingdom
 
2010 9월28일.

Presentation Summary

  • Ubiquitous in-building Real Time Location Systems (RTLS) today are limited by costly active tags and short range portal readers of passive RFID tags.
  • Requirement for distributed multi-service communications and sensing system
  • Use of distributed antenna system (DAS) technology to a) improve RFID detection accuracy and coverage and b) provide large area, accurate RTLS coverage over shared WiFi networks.
  • Construction of Demonstrator of DAS supported RTLS over RFID sensors and WiFi network over a shared infrastructure.

Speaker Biography (Sithamparanathan Sabesan)

Sithamparanathan Sabesan received a Master of Philosophy degree in Engineering from the University of Cambridge, in the United Kingdom in 2008. He is currently working toward a Ph.D. degree, conducting research on passive UHF RFID and RoF technologies at the same University. He was previously with ARM, U.K., as a student IP Electronic Engineer in 2007. Mr. Sabesan was awarded the Sir William Siemens Medal in 2006.

Company Profile (University of Cambridge, Dept of Engineering)

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Cambridge University Engineering Department, which was rated as a 5* Department in the last Research Assessment Exercise, has been carrying out research in thin film transistors based on amorphous silicon and other inorganic materials for more than ten years. It has a state-of-the-art clean facility within the Centre for Advanced Photonics and Electronics. This includes 160 m2 of Class 10,000 laboratories which houses a range of deposition systems for producing a diverse range of materials including metallic thin films, amorphous silicon, high-k dielectrics, carbon nanotubes and silicon nanowires. There is a further 140 m2 of Class 1,000 laboratories which includes processing facilities for 1 µm photolithography and nanoparticle-polymer composite processing. Finally, there is 140 m2 of Class 100 laboratories which includes a rapid thermal annealer, deep reactive ion etch system, liquid crystal processing facility, 0.5 µm double-sided mask aligner and an e-beam lithography system.
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