Flipchip Joining To Printed Ink Circuitry On Flexible Substrates (Wearable USA 2018)

Mr Jeff Knight, General Manager-Advanced Process Lab
Universal Instruments
United States


USA 2018 (pdf) Presentation - IDTechEx*

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Presentation Summary

Being able to join bumped silicon die to printed ink circuitry on temperature sensitive flexible substrates is a key manufacturing enabler for the flexible hybrid electronics industry. Attachment of such devices using asymmetric heating applied with a die bonder was explored as a means to minimize the thermal load on temperature intolerant substrates. Chip joining using SnAgCu and BiSnAg solders as well as an isotropic conductive adhesive material were all demonstrated using top side asymmetric heating. Polyimide, PET, and TPU substrates were examined for physical or chemical alteration from the thermal load of such bonding. The microstructures of joints formed on printed copper ink were examined along with basic joint properties.

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